DEEPX Surpasses 300 Customer Validations Through Its “Early Engagement Customer Program” Prepares to Launch Mass Production in Mid-Year and Accelerate Global Market Entry

 

  • Over the past year, DEEPX has used MPW-based products for real-world testing, identifying practical on-site requirements and enhancing product completeness.
  • According to Omdia, the global AI chip market is expected to reach approximately USD 243 billion by 2028. On-device AI is emerging as a key sector to watch.

SEOUL, South Korea, 31, March–DEEPX, a company specializing in on-device AI semiconductors, announced that its “Early Engagement Customer Program” (EECP)—run over the past year in preparation for the mid-year mass-production launch of its first product—has received more than 300 customer validation requests worldwide for its DX-M1 prototype.

 

This milestone reflects strong global interest in the upcoming mid-year release of DEEPX’s first mass-produced chip, the “DX-M1.” Through the program, the company has confirmed surging demand for on-device AI technology across a broad range of industries.

 

Since last year, DEEPX has participated in over 20 global events to promote its prototype products and expand its international business footprint. The program specifically targeted companies requiring AI semiconductors—including those in surveillance systems, smart mobility, robotics, factory automation, and camera systems—by providing MPW (Multi-Project Wafer) based prototypes and technical support. By showcasing prototype capabilities in real-world environments, DEEPX proactively collected industry feedback and swiftly pinpointed areas needing further refinement.

 

These efforts went well beyond simple readiness for mass production. They delivered valuable insights into each industry’s requirements and emerging market trends, while also securing diverse use cases from a wide spectrum of customers. DEEPX noted that the data and feedback gathered through this program have been instrumental in boosting both the technical robustness of the DX-M1, scheduled for release in mid-year, and its user convenience.

 

DEEPX has also highlighted its technical strengths at leading industry events worldwide. By tailoring its response to specific technical needs—well before mass production—the company has garnered multiple awards from international organizations. Notably, DEEPX secured three innovation awards at CES 2024 for its original technologies, and at COMPUTEX Taipei, one of the largest AI semiconductor tradeshows, it won a startup terrace award in a competition against more than 400 companies. At this year’s CES, the Consumer Technology Association (CTA) even named DEEPX a “must-visit company,” drawing over 16,000 booth visitors—an all-time high.

 

Additionally, DEEPX was recognized as the “2024 Company of the Year – In the Global Artificial Intelligence Chip Industry” by market research firm Frost & Sullivan, and the DX-M1 was named “the 2024 Product of the Year” by global IT publication EETimes. These accolades highlight DEEPX’s strong technological foundation and have heightened expectations for robust worldwide sales as soon as mass production officially launches mid-year.

 

According to market research firm Omdia, the global AI chip market is set to reach approximately USD 243 billion by 2028, propelled by an emerging market of around USD 69 billion in sectors such as surveillance systems, smart mobility, and robotics. Recognizing these opportunities, DEEPX is expanding global partnerships in key regions including the United States, Taiwan, and Europe, continuously strengthening its product competitiveness through close collaboration with potential customers.

 

DEEPX’s CEO Lokwon Kim stated, “Over the past year, more than 300 companies worldwide have carried out customer validations with us, underscoring the rapid spread of on-device AI technology. With the official mid-year launch of the DX-M1, we aim to address market needs head-on and firmly establish DEEPX as a foremost global player in the on-device AI industry.”

 

About DEEPX

Founded in anticipation of an era when artificial intelligence will be as pervasive as electricity and Wi-Fi, DEEPX develops core technology for high-performance AI semiconductors and computing solutions that bring intelligence to electronic devices. DEEPX currently holds over 326 patents pending in the U.S., China, and Korea—one of the largest patent portfolios in the world for on-device AI chip development.

 

DEEPX’s AI semiconductors are optimized for various applications, improving energy efficiency while enabling advanced AI functionality. The company is collaborating with customers such as Hyundai Kia Motors Robotics Lab, POSCO DX, Jahwa Electronics, LGU+, and Inventec on mass-production developments. In addition, DEEPX works with more than 120 global organizations in areas like smart cameras, surveillance systems (AI NVR), smart factories, robotic platforms, and AI servers, and conducts strategic global promotions in the United States, China, Taiwan, and Europe.

DEEPX Appoints Former NXP Product Marketing Director Jaedoo Jun as Head of U.S. Subsidiary— Aims to Rapidly Expand Global On-Device AI Market Presence and Accelerate Revenue Generation



  • Mr. Jun, a 20-year veteran of leading global semiconductor and IT companies such as ST-Ericsson, TI, and NXP, will drive aggressive business expansion in North America.
  • With its U.S. subsidiary poised for growth and plans to establish a new branch in Taiwan this year, DEEPX expects to gain a competitive advantage in the global AI semiconductor market and maximize sales potential.

SEOUL, South Korea, 10, March – DEEPX (CEO Lokwon Kim), a leading AI semiconductor company, announced the strategic appointment of former NXP Product Marketing Director Jaedoo Jun as Head of its U.S. subsidiary. This move is designed to secure a competitive edge in the rapidly evolving global AI semiconductor market and to drive significant revenue growth.

 

Mr. Jun is a seasoned professional with over two decades of experience spanning multiple prominent semiconductor and IT firms—including ST-Ericsson, TI (Texas Instruments), and NXP—across the United States, Europe, and Asia. Having built expertise in hardware design, technology marketing, and sales in mobile, automotive, and home entertainment sectors, he is uniquely equipped to propel DEEPX’s expansion in North America.

During his tenure at NXP, Mr. Jun oversaw product marketing for the Security & Connectivity Business Unit in both North America and Korea. In this role, he led initiatives in business development, customer collaboration, and product roadmap planning. Under his leadership, NXP secured stable revenue streams from global clients such as Samsung and LG, while actively pursuing next-generation semiconductor opportunities.

“As performance in AI semiconductors is heavily dependent on the tight integration of hardware and software, it’s crucial to develop differentiated technologies and provide solutions tailored to customer needs,” Mr. Jun said. “I look forward to leveraging my experience to broaden DEEPX’s market reach and to help cement the company’s position in the global AI semiconductor arena.”

DEEPX plans to deploy his leadership to spearhead a more aggressive expansion in the North American market. Alongside his appointment, the company is also actively recruiting additional business leaders and Field Application Engineers (FAEs) in the region—reinforcing its commitment to delivering advanced technical support and nurturing stronger customer relationships on the ground.

Moreover, DEEPX is accelerating global expansion by establishing a branch in Taiwan in the first half of this year. By strengthening communication with seasoned leaders in the global fabless industry and collaborating with local FAE teams, the company aims to operate in a more specialized, strategic manner within the Taiwanese market. Simultaneously, DEEPX is finalizing an agreement with a major global semiconductor distributor to solidify early worldwide distribution channels for its AI chip solutions. This comprehensive commercial push is anticipated to strengthen DEEPX’s competitiveness in major international markets, including the United States and Taiwan, as the company continues to aggressively pursue growth and market share.

DEEPX Receives the ‘Startup Terrace Awards’ at Computex Taipei

 

  • Over 120 Taiwanese and global OEM companies highly praised DEEPX’s proprietary products and technologies unveiled at ‘Computex Taipei’
  • Recognized for innovative technology and commercial potential in leading the global market at ‘InnoVEX,’ the global startup program of ‘Computex Taipei,’ and honored with the ‘Startup Terrace Awards’

DEEPX, a company specializing in AI semiconductor core technology, participated in “Computex Taipei 2023,” Asia’s largest IT exhibition held for the first time in four years since the COVID-19 pandemic. At the event, DEEPX showcased its technologies and products to Taiwanese and Greater China enterprises, carrying out promotional activities aimed at expanding into the East Asian market.

 

During this exhibition, DEEPX presented four products—DX-L1, DX-L2, DX-M1, and DX-H1—based on its independently developed core AI semiconductor technology. The company also demonstrated various real-time AI computation applications. More than 120 potential client companies, including Taiwanese and Greater China IT hardware OEMs and AI application developers, visited DeepX’s booth. They gave high praise for DEEPX’s four-product solution strategy, noting its strong adaptability to a wide range of market demands and its ability to handle AI computations even in resource-constrained environments, demonstrating excellent potential for mass production. This positive response led to significant interest in DEEPX’s products and follow-up inquiries about collaboration on AI hardware application system development.

 

DEEPX also took part in “InnoVEX 2023,” the startup-focused section of “Computex Taipei.” Among 400+ startups from 22 countries undergoing evaluation by international investors, DEEPX was selected for having outstanding technology and placed in the top ten, which included five Taiwanese startups and five global startups. In the final round, DEEPX’s innovative core technology and commercial potential for leading the global market were acknowledged with a second-place finish, winning the “Startup Terrace Awards.” Through this accolade, DeepX was awarded a cash prize of USD 20,000 and gained support for entry into the Taiwanese market, including collaboration opportunities with Taiwanese companies and introductions to global investors.

 

A “Computex Taipei” official said, “By participating in this year’s Computex Taipei, DEEPX has achieved two significant milestones. First, it introduced its products and technologies to representatives of leading Taiwanese OEM enterprises such as Foxconn, Wiwynn, and Inventec, receiving recognition for commercial viability and mass production capabilities. Second, as DEEPX possesses core AI semiconductor technology from South Korea, it has gained an opportunity to enter the Taiwanese market, one of the global hubs for logic semiconductors and the fabless industry.”

 

He continued, “This year, DEEPX will do its utmost to fully commercialize its products. In this cutting-edge field where the whole world is competing, we will strive to become the first Korean company to lead the global market through our core technology.”

 

Meanwhile, DEEPX also participated in the 47th Korea-Taiwan Economic Cooperation Committee hosted by the Federation of Korean Industries (FKI) and the Chinese International Economic Cooperation Association in Taiwan. On May 31, DEEPX attended a welcome event hosted by Taiwan, followed by a joint conference on June 1 with 100 entrepreneurs from both Korea and Taiwan. These events provided opportunities to build networks with Taiwanese government officials, investors, and business leaders, further expanding DEEPX’s business presence.

DEEPX Honored with the Gold Innovator Award 2023 from Vision System Design

 

  • DEEPX’s first-generation NPU IP, DX-GEN1, received the gold medal from Vision System Design’s Innovation Virtual 2023 award program.
  • DEEPX also opened its US subsidiary, DEEPX US, and celebrated by showcasing its technology at the Embedded Vision Summit

SEOUL, South Korea, 01 June -DEEPX, an industry-leading artificial intelligence semiconductor technology company, today announced that the company has received Vision System Design Magazine’s Innovation Virtual 2023 Gold Medal. This recognition confirms that DEEPX’s Neural Processing Unit (NPU) IP, DX-GEN1, is one of the most innovative products in the field of machine vision this year. The prestigious award was announced at ‘The Automate Show 2023,’ held May 22, 2023, in Detroit, MI, USA.

 

As part of opening its US-based subsidiary, DEEPX US, the company also recently unveiled its physical products at the Embedded Vision Summit 2023 held in Santa Clara, CA, USA. DEEPX’s entire family of AI chips was developed using the company’s DX-GEN1 technology. Over 20 of these innovative AI technologies, including real-time demos based on these chips, were shown at DEEPX’s booth, leaving a lasting impression on numerous global company representatives, who praised DEEPX’s edge AI and machine learning technologies.

 

Upon winning the Innovation Virtual award, DEEPX has further solidified its reputation for ingenuity and innovation in the global market’s focal point of machine vision technology. In response to the award, DEEPX’s CEO, Lokwon Kim, expressed his gratitude, stating, “I am honored to have received this recognition, which demonstrates DEEPX’s originality and innovation in the field of machine vision technology.” DEEPX’s AI products are low-power, high-efficiency AI processors designed to achieve an IPS (Inferences Per Second) per watt that is a 10x performance improvement over standard GPU performance. DEEPX’s goal is to maintain a competitive edge in the core technologies necessary to apply GPU-level advanced AI capabilities to resource-constrained devices, thereby contributing to global leadership in the field. 

 

DX-GEN1 highlights DEEPX’s leadership in the field of AI technology, including image classification, object detection, and scene segmentation. It offers scalability ranging from 2.4 TOPS for DX-L1 to 22 TOPS for DX-H1 with 2K/4K/8K MAC combinations, supporting the latest AI algorithms. DEEPX’s NPU technology also boasts AI computational accuracy on par with, if not surpassing, GPUs. With optimized hardware and software design for edge devices, DEEPX provides the world’s top-performing embedded AI solution, offering high performance, low power consumption, and cost-effectiveness. Its exceptional power efficiency sets it apart from other products, ensuring superior performance efficiency for IoT devices.

 

Linda Wilson, the chief editor of VSD, praised DEEPX on receiving the Gold Medal at the 2023 VSD Innovation Awards. She emphasized the significance of this award, stating, “Each year this unbiased and increasingly competitive program aims to celebrate the most innovative products and systems in machine vision.” Wilson also said, “The Vision Systems Design team would like to congratulate DEEPX for their score in the 2023 Innovators Awards program. The DEEPX team should be very proud.” Vision Systems Design (VSD), a leading journal in the US machine vision industry, annually awards the Innovators Awards to recognize innovative products and solutions in the field of machine vision. As a reputable source, VSD provides insights into the latest technologies, applications, and service trends in vision systems worldwide. The esteemed panel of judges

딥엑스, ‘제58회 발명의 날’ 단체 부문 최고상인 대통령 표창 수상

 

  • 2018년 창업 후 특허 출원 157건으로, AI 반도체 원천기술 개발 및 기술 시장 장악력 확보, 시스템 반도체의 최첨단 원천 기술의 국산화에 기여한 공로 인정
  • 국가 AI 반도체 산업의 경쟁력 강화를 위해 핵심 기술의 특허 권리화를 적극적으로 시도, 임직원들의 직무발명을 보호, 장려하는 등 국가 인력 양성에도 기여
  • “지속적인 기술혁신을 통해 AI 반도체 기술에서 초겊차 기술을 확보하고 지식 재산 인프라를 공고히 구축해서 국가의 시스템 반도체 기술의 경쟁력을 강화하는데 최선을 다할 것”

 

딥엑스(대표 김녹원)가 ‘제58회 발명의 날’ 기념식에서 단체 부문 최고상인 ‘발명 장려 유공’ 대통령 표창을 수상했다고 밝혔다. AI 반도체 기업이 발명의 날 기념 대통령 표창을 수상한 것은 딥엑스가 처음이다.

 

특허청은 매년 발명의 날을 기념해 발명 진흥으로 국가산업 발전에 크게 기여한 공적이 있는 발명 유공자를 발굴하고 포상한다. 딥엑스는 지난 5월 12일(금) 서울 코엑스에서 열린 발명의 날 기념식에서 세계적인 수준의 AI 반도체 하드웨어 및 소프트웨어 관련 원천기술을 개발하여 글로벌 시장 장악력을 확보하고 대한민국 시스템 반도체 산업에 필요한 미래 원천 기술 선점에 기여한 공을 인정받아 단체 부문 최고상을 품에 안았다.

 

시스템 반도체 산업은 기술 선진국인 미국 기업이 68% 이상의 원천 기술 특허를 확보하고 있고 국내 산업은 외산 기술에 종속되어 수십년간 천문학적인 로열티를 지불하고 있다. 딥엑스의 목표는 AI 반도체의 원천기술까지 확보하여 세계 최고의 제품을 독자적으로 개발하는 것이다. AI 반도체 기술 개발이 전세계적으로 뜨겁게 진행되는 와중에, AI 반도체라는 시스템 반도체의 신기술에서 기술 독립으로 외화 유출을 막고 글로벌 시장을 주도하기 위해 딥엑스는 원천기술의 특허를 확보하는데 많은 자원과 노력을 쏟고 있다.

 

딥엑스는 스마트 카메라, 스마트 로봇, 스마트 모빌리티, 자율주행차 등 배터리로 구동되는 다양한 엣지 디바이스를 지원하는 AI 반도체 및 컴퓨팅 솔루션의 원천기술을 개발하고 세계적인 AI 반도체 시장을 겨냥해 한국, 미국, 중국을 중심으로 특허를 출원하고 있다(5/12일 기준 157건). 더불어, 영상 처리 기반 AI 시스템 기술의 표준화를 위해 국제 MPEG-VCM (Video Coding for Machines) 그룹에 국내 최초로 참여해 저전력의 AI 반도체에 필요한 영상처리 표준 기술을 확보하여 글로벌 시장 장악도 적극적으로 모색하고 있다.

 

또한 창업 초기부터 AI 반도체 및 컴퓨팅 솔루션의 핵심 기술 보호를 위해 특허 전담인력을 확보하여, 핵심 기술의 특허 권리화를 적극적으로 시도했고 2020년부터 직무발명을 보호·장려하며 임직원의 직무에 관한 연구 개발 의욕을 고취시키기 위해 직무발명 제도를 시행하여 직무발명 우수기업 인증도 획득했다. 딥엑스는 지속적으로 선진형 R&D 체계를 통해 원천기술 개발 선도, 원천 기술 특허 확보, 최첨단 기술 사업화, 글로벌 시장 창출의 선순환 구조를 통해 글로벌 시장에서 대한민국 AI 반도체 선도 기업으로 성장하고 있다.

 

김녹원 대표는 “딥엑스는 창업 초기부터 선진 R&D 체계 구축을 통한 지속적인 기술혁신으로 연구성과는 특허출원을 진행하고 핵심 원천기술은 특허 가치평가를 받아 지식재산 인프라 구축을 통한 신기술 인증 및 지식재산 창출을 추구해왔다. 앞으로도 AI 반도체에서 초격차 원천 기술을 확보해서 국가의 미래 동력 산업인 시스템 반도체 기술의 경쟁력 강화에 최선을 다할 것이다.”라고 수상 소감을 밝혔다.

DEEPX Hosts the Largest Showcase at the Embedded Vision Summit, Continues to Expand Global Footprint

 

SEOUL, South Korea, May 10, 2023- DEEPX will hold the largest showcase for its global market debut at the ‘Embedded Vision Summit’, the largest technology event in the field of edge AI. The ‘Embedded Vision Summit’ to be held in Silicon Valley, USA from May 22nd to May 24th is the largest exhibition in the field of edge vision AI and is a big event where more than 80 of leading global system semiconductor companies participate.

 

At this conference, DEEPX will demonstrate in real-time its four AI chip solutions and edge AI technologies developed with its customers. DEEPX will show demos that include a driving robot and facial recognition algorithms developed with Hyundai Robotics Lab, high-performance camera modules developed with Jahwa Electronics, and smart factory solutions developed in collaboration with POSCO DX. DEEPX has also prepared a tutorial on supporting cutting-edge algorithms, exceeding the limits of theoretical AI accuracy, and running the DXNNTM software.

 

The conference will host many globally renowned system semiconductor companies such as Qualcomm, ARM, Synopsys, Cadence, NXP, Renesas, and ST Microelectronics. It will provide opportunities to compare the technologies of global companies, including global start-ups of edge AI processors. DEEPX will be joining as the premium exhibitor with the largest showcases right at the entrance of the exhibition hall.

Starting with the Embedded Vision Summit in May, DEEPX plans to promote its world-class NPU-based semiconductor products by taking part in various events, including Computex Taipei in June, the Design Automation Conference (DAC) in the United States in July, IFA Berlin in Europe in September, Super Computing 23 in the United States in November, and CES in January of next year. The company aims to tap into the global market by directly exploring the North American and European markets and promoting AI semiconductor products recognized in the globally.

 

CEO Lokwon Kim said, “Leaving Silicon Valley six years ago, I founded DEEPX to have fundamental AI semiconductor technology developed in my country and have been successful in developing AI semiconductor products that can be recognized in the global market. Returning to Silicon Valley, the center of the high-tech business, to debut in the global market, it is very exciting to participate on the largest scale to show DEEPX’s world’s best technological competitiveness at the ‘Embedded Vision Summit,’ the biggest event in which edge AI semiconductor companies from around the world participate.

 

In addition, Lokwon Kim said, “Ultimately, DEEPX aims to become a global company with a strong business expansion strategy based on the world’s best technology in the global market. We will do our best to show our unique technology that we have been developing and commercializing for a long time.”

 

Jeff Bier, the founder of Edge AI and Vision Alliance (EVA), the host of the Embedded Vision Summit, said, “At last year’s Embedded Vision Summit, DEEPX had a small presence with an FPGA prototype, as they had not yet fabricated their first chip. Their FPGA-based demo was impressive, and we were excited to see what they could do. We were struck by their ambitious strategy to target the entire edge AI market by simultaneously developing four semiconductor products, and we were excited to give DEEPX the opportunity to make its global debut alongside the world’s leading semiconductor companies at the Embedded Vision Summit, the largest showcase for edge AI semiconductors.”

딥엑스, ‘자화전자’와 협력해 AI 기반 스마트 카메라 모듈 시장 공략

  • 카메라 시장에도 온디바이스 AI 시대가 도래함에 따라 임베디드 비전 카메라 모듈 시장 진입을 위한 전략적 협력
  • 딥엑스의 AI 반도체를 탑재한 차량용 인-캐뚈 모니터링 시스템과 DMS 솔루션, 로봇 비전 플랫폼에 적용할 수 있는 스마트 카메라 모듈 공동 개발
  • 삼성전자와 현대자동차를 고객사로 확보하여 글로벌 시장에서 인정받는 자화전자의 카메라 장치 기술곟 딥엑스의 세계 최고 수준의 AI 반도체 기술이 결합되어 시너지 효과 기대

 

딥엑스(대표 김녹원)가 국내 대표 전자부품 제조기업 자화전자(코스피 033240, www.jahwa.co.kr)와 AI 반도체를 탑재한 AI 기반 스마트 카메라 모듈을 양산하는데 협력하기로 합의했다.

 

딥엑스는 4월 26일 수요일 자화전자에서 김녹원 대표이사, 자화전자 김찬용 대표이사등 양사 관계자들이 참석한 가운데 AI 반도체를 탑재한 AI 기반 스마트 카메라 모듈 양산을 위한 업무협약(MOU)을 체결했다고 밝혔다.

 

2023년 가트너의 발표에 따르면 1~2년 사이 AI가 가장 크게 사용될 시장으로 AI 기반 컴퓨터 비전 및 엣지 AI 시장을 손꼽고 있다(자료: 2023년 가트너 이머징 테크 레이더 보고서). 딥엑스는 온디바이스 AI(기기 내에서 자체적으로 정보를 수집하고 연산을 하는 하드웨어 컴퓨팅) 시대가 도래함에 따라 모든 전자기기에 임베디드 비전 스마트 카메라 솔루션이 필요하다고 판단하여 이 시장을 공략하기 위해 카메라 센서와 직접적으로 연결해 최신 AI 알고리즘을 구동할 수 있는 DX-L 시리즈(비전 프로세서)의 제품을 준비해 왔다. 글로벌 카메라 모듈 시장은 2020년 340억 달러에서 2026년 590억달러로 성장할 것으로 전망하고 있다(자료: Yole Group, 2021. 10). 전세계에서 연간 판매되는 이미지 센서만 해도 65억개에 이르고 사물 자율화 시대가 되면 이는 큰 폭으로 늘어날 것으로 예견된다(자료: Yole Group, 2021. 10). 또한 카메라뿐만 아니라, 레이더, 라이다, 초음파 등 다양한 센서 기반 모듈에서 AI 반도체 기반 실시간 AI 연산 처리를 필요로 하기 때문에 엣지 AI 반도체의 수요는 방대할 것으로 전망된다.

 

이번 협력은 차량 및 로봇, 드론, 스마트가전 등 AI 모니터링 및 자율주행을 위한 핵심 솔루션인 스마트 카메라 모듈 시장이 새로운 전성기를 맞이하며 성사되었다. 딥엑스와 자화전자는 각 사의 글로벌 수준의 기술과 노하우를 협력하여 글로벌 차세대 카메라 솔루션 시장을 공략에 나선다. 특히 차량뿐만 아니라 각종 응용 분야에 사용되는 카메라 모듈을 지능화하기 위해 협력한다.

 

자화전자와 딥엑스는 지난 1년간 AI 카메라 모듈 개발을 협력해왔다. 협력을 통해 자화전자는 AI 기반 카메라 모듈을 만들고 딥엑스는 FPGA 프로토타입 기반 NPU를 구현하여 연동하는 실험을 성공적으로 완수했다. 자화전자는 딥엑스 AI 반도체 기술의 우수성을 확인하고, 올해 딥엑스의 4가지 AI 반도체 제품이 출시됨에 따라 FPGA 프로토타입 대신에 AI 반도체를 탑재하여 시제품 개발을 계획하고 있다.

 

양사는 이번 협력을 통해 자화전자의 고도화된 카메라 장치에 딥엑스의 AI 반도체를 탑재해 자율주행차에서 실내 상태를 모니터링하는 인캐빈(In-Cabin) 모니터링 및 운전자 모니터링 시스템(Drive Monitoring System, DMS)과 자율주행 로봇 플랫폼에 적용할 수 있는 스마트 카메라 모듈을 양산하기 위한 기술을 공동 개발할 계획이다. 자화전자는 독일 프리미엄 완성차 업체의 1세대 DMS(운전자 모니터링 시스템)을 위한 카메라 모듈 공급해 왔고, 차세대 제품에서 딥엑스의 AI 반도체를 탑재하여 DMS 시스템 모듈로 적용하여 글로벌 시장 공략도 추진할 계획이다.

 

김녹원 대표이사는 “딥엑스는 카메라의 센서, 모듈, 시스템까지 AI 반도체를 탑재해 임베디드 컴퓨터 비전 솔루션의 스마트화를 이뤄내는 것이 중요한 목표 중에 하나다. 이번 자화전자의 협업은 스마트 카메라를 위한 생태계를 구축하는 첫 출발점으로 보고 있다.”며 “딥엑스는 존재하는 모든 카메라 기반 응용 기기를 위해 차세대 비전 프로세서를 구현하여 각종 카메라 기업들과 협업하여 거대 카메라 시장에 세계 최고 수준의 AI 반도체를 탑재하고자 한다. 이러한 카메라 모듈을 통해서, 로봇, 스마트모빌리티, CCTV, ITC, 스마트 시티, 가전 등 다양한 엣지 디바이스를 지능화시켜 초지능 문명으로 나아가는데 견인차 역할을 하겠다”라고 포부를 밝혔다.

딥엑스, 포스코DX와 AI 반도체 기반 공장 자동화 및 지능형 물류 시스템 상용화 협력

  • 딥엑스 AI 반도체를 활용하여 공장 자동화 및 지능형 돟뼘 시스템에 활용할 수 있는 대단위 AI 연산 처댏기반 AI 솔루션 공동 개발
  • 사전 검증 과정에서 딥엑스의 컴파일러가 포함된 소프트웨어 ‘DXNN’을 배포해 딥엑스 NPU의 최신 알고리즘 지원, 우수한 AI 정확도, 높은 연산 효율 확인
  • “딥엑스의 AI 반도체가 고성능과 고효율을 앞세워 산업현장에서 수만대의 카메라를 동시 AI 연산 처리하고 자동화할 수 있는 혁신적인 솔루션이 될 것”

딥엑스가 AI 반도체 기반 공장 자동화 및 지능화 물류 시스템의 상용화를 위해 포스코DX와 기술 개발을 협력한다. 딥엑스는 4월 6일 목요일에 김녹원 대표이사, 포스코DX 기술연구소 윤일용 상무 등 양사 관계자들이 참석한 가운데 포스코DX와 AI 반도체를 활용한 제조, 로봇, 물류, 안전 등 산업현장에 적용 가능한 AI 솔루션 기술의 상용화를 위해 업무협약을 체결했다고 밝혔다.

딥엑스는 포스코DX와 진행된 사전 기술 검증 과정에서 딥엑스의 컴파일러가 포함된 소프트웨어 개발 키트(SDK, Software Development Kit)인 ‘DXNN’을 배포해 자사의 하드웨어와 소프트웨어의 구동성을 검증한 후 딥엑스 기술의 우수함을 입증했다. 특히 전력 대비 인공지능 연산 성능 효율이 높아 산업 현장의 자동화를 위한 AI 솔루션으로 상용화하기에 적합한 것으로 평가받았다.

양사는 이번 협력을 통해 포스코DX의 공장 자동화 및 지능화 물류 설비제어시스템인 포스마스터(PosMaster-PLC)에 딥엑스의 AI 반도체 기술을 탑재해 산업현장 설비시스템의 운영을 자동화할 수 있는 대단위 AI 솔루션을 공동 개발할 계획이다. 이번 협약으로 양사는 스마트 팩토리 구동부에 사용될 AI 기능을 딥엑스의 AI SoC(System on Chip) 제품에 탑재하고 구동성 및 양산 가능성 등을 검증한 이후 적용범위를 확대해 나갈 계획이다.

 

이번 협약으로 딥엑스는 IPC(Industrial PC, 산업용 PC) 1대 정도의 AI 성능이 필요한 분야에 적용할 수 있는 ‘DX-M1(23TOPS)’ 제품으로 올해 포스코DX와 테스트를 진행하고 공장에 적용할 계획이며, 추가적으로 대규모 단위 AI 연산이 필요한 서버 솔루션인 ‘DX-H1(서버당 22POPS – 초당 2.2경회 인공지능 연산)’도 테스트를 진행할 예정이다. 해당 칩 솔루션은 다양한 산업 현장의 설비시스템에 M.2 모듈 및 PCIe 카드 형태로 설치해 수십만대의 카메라 및 센서를 통해 들어오는 데이터를 신속하게 분석할 수 있는 고성능 제품 라인이다.   

 

딥엑스는 모든 곳에 AI 컴퓨팅을 구현하기 위한 AI 반도체를 개발하는 회사로서, AI 기술을 모든 곳에 존재하는 다양한 전자기기에 고성능•저전력으로 구현할 수 있다. 현재 다양한 엣지 및 서버 AI 응용 분야에 맞춰 성능과 기능이 최적화된 AI 반도체 4종을 보유하고 있으며, AI 반도체 원천기술과 관련한 국내외 특허도 150여개 이상 확보한 상황이다. 국내에서는 대표적인 AI 반도체 팹리스로 평가받으며 글로벌 AI 반도체 시장을 목표로 한다.

 

김녹원 대표이사는 “포스코DX의 스마트 팩토리 기술과 딥엑스의 AI 반도체 기술을 결합하면 유럽형 4차 산업 혁명의 목표인 AI 기반 공장 자동화를 구축할 수 있어, 제조 산업 현장의 혁신을 선도할 수 있을 것으로 기대한다. 대규모 인공지능 연산 처리를 위해 딥엑스가 준비한 AI 반도체 기반 서버 솔루션인 DX-H1을 실증할 수 있는 기회를 얻게 되어 기쁘다”라며 “포스코DX와의 협업으로 포항제철의 2만대의 카메라 정보를 동시 처리하여 자동화 함으로써, 미래 스마트 팩토리 시장을 선도하는 데 중요한 기반을 구축할 수 있도록 지속적으로 협력할 것”이라고 말했다.

 

포스코DX 기술연구소 윤일용 상무는 “포스코DX의 인공지능 SW 및 제어 융합 기술과 딥러닝에 최적화된 인공지능 반도체의 연산 능력이 더해져 하나의 통합된 자동화/무인화 시스템을 구성할 수 있는 뜻깊은 협업 기회로 생각한다.”며 이를 통해 GPU에서 탈피한 더 고효율 연산 성능과 신뢰성 있는 솔루션을 제공하며 유연한 분산형 구조의 아키텍처를 제안함과 동시에 전력소비를 줄여 ESG경영에도 기여할 수 있을 것”이라고 전했다.

DEEPX and Hyundai Motor Company and Kia Corporation are collaborating on AI semiconductor-based Robot Platforms

 

  • Both companies will strategically cooperate in embedding AI chips into robot platforms
  • For the past year, in the process of examining in advance, various AI algorithms for robots were operated to check for the latest AI algorithm support, excellent AI accuracy, and high computing efficiency of the DEEPX NPU
  • “This will be an opportunity for DEEPX’s AI semiconductor to become the mass-production-ready core solution in the global smart mobility market.”

SEOUL, South Korea, April 7, 2023– DEEPX and Hyundai Motor Company and Kia Corporation will cooperate with technology development for on-device AI technology for robot platforms.

On March 24 (Friday) at the Uiwang Research Facility of Hyundai Motors & Kia Corporation, DEEPX announced its execution of the MOU on AI semiconductor collaboration use for robot platforms, with the representatives of both companies, including Lokwon Kim, CEO, and DongJin Hyun, Robotics Lab leader of Hyundai Motors & Kia Corporation.

DEEPX develops AI semiconductors and implements AI technology used in various electronic devices that exist outside of the data center with high-performance and low-power advantages. Currently, DEEPX has four kinds of AI semiconductors that are optimized for performance and function that can match various edge and server AI application fields and have secured more than 150 patents, both domestic and international, that are related to fundamental AI semiconductor technology. Domestically, DEEPX is evaluated as the leading AI semiconductor fabless company, and DEEPX is targeting the global edge AI market.

 

During the Proof-of-Concept (PoC) conducted over the past year by Hyundai Motor Group and Kia Robotics Lab, DEEPX demonstrated outstanding AI performance by providing higher AI accuracy with INT8bit than FP32bit. In addition, it has been proven that various robot application AI algorithms developed by the Robotics Lab can be smoothly operated, making it possible to implement AI models required by robots. In particular, it is evaluated as suitable for mass production of battery-powered robot products due to its exceptionally high AI computational efficiency and low power operation.

This agreement aims to cooperate on the application of DEEPX’s AI semiconductor technology to the robot platform currently under development with the aim of commercialization by Hyundai Motor Group and Kia. To achieve this, the two companies will incorporate AI functions for robots into DEEPX’s AI SoC (System on Chip) products, verify their operability and mass production for deployment in the final products developed by Robotics Lab. In this way, the AI technology can be implemented in the robots developed by the Robotics Lab.

Lokwon Kim, CEO, commented: “According to the global market research data, the size of the global smart mobility market is expected to grow to about 145 billion dollars by the year 2027. For the AI semiconductor, the core technology of this market, there are currently no optimized solutions for each detailed field. Therefore, it is possible to lead the market if a mass production-ready solution is prepared. Having technology cooperation with the global market leader Hyundai Motors and Kia Corporation will present DEEPX’s AI semiconductor with an opportunity to become the core solution of the future market in the related field. This is a great inspiration for us. DEEPX has succeeded in commercializing NPU IP in 2021, and I am grateful to earn the chance to demonstrate the test for mass production as soon as we reach the NPU development milestone this year”.

DongJin Hyun, leader of the Robotics Lab of Hyundai Motors & Kia Corporation, said, “I expect we can lead the excellent robotics service development in both performance and price by combining the SW technology of the Robotics Lab and DEEPX’s HW technology.” He also added, “As soon as we confirm and examine the superiority of DEEPX NPU chip products, we will carry on with further cooperation and apply it to the robot that is under research and development.”