• Mr. Jun, a 20-year veteran of leading global semiconductor and IT companies such as ST-Ericsson, TI, and NXP, will drive aggressive business expansion in North America.
• With its U.S. subsidiary poised for growth and plans to establish a new branch in Taiwan this year, DEEPX expects to gain a competitive advantage in the global AI semiconductor market and maximize sales potential.
  
  

SEOUL, South Korea, 10, March – DEEPX (CEO Lokwon Kim), a leading AI semiconductor company, announced the strategic appointment of former NXP Product Marketing Director Jaedoo Jun as Head of its U.S. subsidiary. This move is designed to secure a competitive edge in the rapidly evolving global AI semiconductor market and to drive significant revenue growth.

Mr. Jun is a seasoned professional with over two decades of experience spanning multiple prominent semiconductor and IT firms—including ST-Ericsson, TI (Texas Instruments), and NXP—across the United States, Europe, and Asia. Having built expertise in hardware design, technology marketing, and sales in mobile, automotive, and home entertainment sectors, he is uniquely equipped to propel DEEPX’s expansion in North America.

During his tenure at NXP, Mr. Jun oversaw product marketing for the Security & Connectivity Business Unit in both North America and Korea. In this role, he led initiatives in business development, customer collaboration, and product roadmap planning. Under his leadership, NXP secured stable revenue streams from global clients such as Samsung and LG, while actively pursuing next-generation semiconductor opportunities.

“As performance in AI semiconductors is heavily dependent on the tight integration of hardware and software, it’s crucial to develop differentiated technologies and provide solutions tailored to customer needs,” Mr. Jun said. “I look forward to leveraging my experience to broaden DEEPX’s market reach and to help cement the company’s position in the global AI semiconductor arena.”

DEEPX plans to deploy his leadership to spearhead a more aggressive expansion in the North American market. Alongside his appointment, the company is also actively recruiting additional business leaders and Field Application Engineers (FAEs) in the region—reinforcing its commitment to delivering advanced technical support and nurturing stronger customer relationships on the ground.

Moreover, DEEPX is accelerating global expansion by establishing a branch in Taiwan in the first half of this year. By strengthening communication with seasoned leaders in the global fabless industry and collaborating with local FAE teams, the company aims to operate in a more specialized, strategic manner within the Taiwanese market. Simultaneously, DEEPX is finalizing an agreement with a major global semiconductor distributor to solidify early worldwide distribution channels for its AI chip solutions. This comprehensive commercial push is anticipated to strengthen DEEPX’s competitiveness in major international markets, including the United States and Taiwan, as the company continues to aggressively pursue growth and market share.