A Four-chip
Strike Package
Four AI semiconductor-based products
to cover a wide range of AI Applications
Drop & Play™ DXNN
Software Development Kit
A comprehensive Software Development Kit
for DEEPX’s four AI chips
What we offer
Custom NPU
Design Service
Fully specialized NPU design service
for customer products
What we offer
NPU IP
Licensing
One of the most efficient NPU design IPs
for various customer applications
What we offer
SoC ASIC For
The Edge Devices
Commercial chip based solutions using DEEPX NPU
DEEPX
Technology
Strengths
State-of-the-art
DNN Algorithm
Support
Outstanding
AI Processing Performance
and Power efficiency
Memory Bandwidth
Footprint Optimization
Silicon-proven
Scalable Architecture
All-in-4 Edge
AI Total Solution
Unapparelled
Cost-Competitiveness
news
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- Media
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Korean AI Chip Startup Raises $80 Million Round Led By Ex-Samsung Executive’s Private Equity Firm
- 2024.07.03
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- Media
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AI Chipmaker DeepX’s Valuation Vaults Up in SkyLake-Led Funding
- 2024.07.03
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- Media
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AI chip startup DEEPX secures $80M Series C at a $529M valuation
- 2024.07.03
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- Press release
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Korean Semiconductor Industry Titans Back DEEPX in Series C Funding Round
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DEEPX, a prominent AI semiconductor technology startup under the leadership of CEO Lokwon Kim, is delighted to announce the successful conclusion of its Series C funding round, amassing $80.5M (KRW 110B). Led by esteemed private equity firms, this significant financial investment will accelerate the mass production of DEEPX's inaugural product line for global distribution and expedite the development and launch of its next-generation LLM on-device solutions. The round was spearheaded by SkyLake Equity Partners with participation from BNW Investments and AJU IB, alongside existing stakeholder TimeFolio Asset Management.
SkyLake Equity Partners, now DEEPX's second-largest shareholder, was founded by the esteemed Mr. DaeJe Chin – a former Minister of Information and Communication, widely recognized as "Mr. Semiconductor." His distinguished tenure at Samsung Electronics, where he pioneered the development of groundbreaking memory semiconductors, brings unparalleled expertise to DEEPX's growth. Additionally, Mr. Jea Wook Kim, Chairman of BNW Investment and another renowned semiconductor expert in Korea, having served as the former President of the Device Solutions Division at Samsung Electronics, contributes extensive industry knowledge from his roles, particularly in revolutionizing memory manufacturing processes.
CEO Lokwon Kim admired Mr. Chin, stating, "Mr. DaeJe Chin, who elevated the Korean semiconductor industry to global prominence, is the ideal person to validate DEEPX's achievements. His investment reaffirms our commitment to establishing DEEPX as a leading AI semiconductor technology pioneer and Korea's first global AI fabless company."
This funding round, predominantly from new private equity stakeholders, highlights DEEPX's technological prowess and potential for future profitability. It also demonstrates a valuation surge, increasing 8 times since the previous round, showcasing strong market confidence in DEEPX's disruptive potential.
DEEPX specializes in original on-device AI semiconductor and computing solutions across multiple sectors, including physical security, robotics, smart mobility, and artificial intelligence. Its portfolio boasts 259 patents, recognition as a Silicon 100 company by EE Times, a VSD Innovator Award Gold Medal, and multiple CES 2024 innovation awards.
- 2024.07.03
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- Event
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DEEPX Expands First-Generation AI Chips into Intelligent Security and Video Analytics Markets
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DEEPX, an on-device AI semiconductor company, is announcing plans to expand its first-generation AI chip lineup to focus on the intelligent video analytics and security system market — an expansion driven by key business alliances with global physical security companies, physical security device OEM/ODMs, and IDH companies. To this end, the company recently had an exclusive booth at ISC West (The International Security Conference and Exposition), the world's largest security exhibition held from April 9th to 12th in Las Vegas, USA, where it met with more than 400 companies and more than 600 business representatives from leading global security companies.
DEEPX will also have a booth #123 at the Secutech Taipei exhibition in Taiwan from April 24 to 26 to showcase its innovative solutions for AI of Things (AIoT) and to expand product collaborations with physical security companies and global industrial equipment manufacturers.
The global AI video analytics market is expected to grow at a CAGR of 33%, from $18.11 billion in 2023 to $75.35 billion by 2028. This is driven by the rapid expansion of industries applying vision AI capabilities, such as smart cities and transportation — including traffic control — smart factories, smart homes, retail, distribution, and healthcare.
Faced with communication delays, privacy issues, and network costs in systems that previously ran AI on the cloud or central servers, these markets require the realization of intelligent video analysis functions in real time using on-device AI semiconductors. In addition, reorganizing the physical security industry's global supply chains is creating an opportunity for DEEPX to accelerate the expansion of its on-device AI solutions.
Harnessing this opportunity to empower physical security companies worldwide, DEEPX's DX-M1, which uses a 5nano processing, has secured a significant lead compared to similar solutions on the global market by demonstrating overwhelming power consumption efficiency to performance. DX-M1 supports real-time AI computation processing of more than 30 frames per second (FPS) for more than 16 channels of multi-channel video on a single chip. Moreover, unlike other AI semiconductors, it has a wide spectrum of AI model support, from the most popular YOLOv5 model used for object recognition to the latest YOLOv9 and vision transformer models.
This technological and market advantage is made possible by more than 240 patents covering the underlying technology, which ensures low manufacturing costs, low power consumption, and competitive pricing—all key considerations for customers when purchasing AI semiconductors.
DEEPX is currently running an Early Engagement Customer Program (EECP) program to attract early customers, offering a small camera module with DX-V1 (5TOPS), an AI SoC solution; M.2 module with DX-M1 (25TOPS), an AI accelerator solution; DX-H1 quattro PCIe card (100TOPS), a product for AI servers; and DXNN®, DEEPX's developer environment. More than 100 global companies have received hardware and software from DXNN® through the program, which they are using to develop new AI-powered products for mass production.
After participating in ISC West and Secutech Taipei, DEEPX will attend the Embedded Vision Summit in Silicon Valley in May and COMPUTEX 2024 in Taipei in June to accelerate its global business expansion with local businesses and global distribution organizations. - 2024.07.03
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