DEEPX Unveils Vision as a “Physical AI Infrastructure Company” at CES 2026

(Photo 1) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025
• Ultra-Low-Power AI Semiconductors to Redefine Global AI Infrastructure Landscape

• Next-gen 2nm AI chip DX-M2 and Open-Source Physical AI Alliance to be unveiled

• DEEPX technology drives Sixfab to win CES “Best of Innovation Award”, proving its role as a core AI infrastructure enabler

• Exclusive "CES Foundry" Event on Jan 8 to Feature Global Leaders from Hyundai Motor Group, Baidu, and Ultralytics

DEEPX, a global leader in ultra-low-power, high-performance AI semiconductors, announced today that it will unveil its strategic vision to become a foundational “Physical AI Infrastructure Company” at CES 2026 in Las Vegas.

 

At CES 2026, DEEPX will present a new paradigm for AI infrastructure—one designed for the physical world. As AI expands beyond data centers into robots, mobility, smart cities, factories, and intelligent devices, DEEPX positions itself at the core of this transformation with energy-efficient, real-time AI semiconductors purpose-built for Physical AI.

 

Much like Arm reshaped the CPU industry through low-power innovation, DEEPX aims to establish a new global standard for Physical AI by delivering ultra-efficient AI accelerators. DEEPX enables intelligence to operate reliably and sustainably in real-world environments, addressing the critical constraints of power, heat, and cost.

 

DEEPX’s technology leadership has already been validated in the global market. In addition to winning two CES Innovation Awards in the Computing Hardware and Embedded Technologies categories, DEEPX-powered solutions have achieved the industry’s highest recognition. Notably U.S.-based partner Sixfab received the CES Best of Innovation Award for its ALPON X5 AI Gateway, powered by DEEPX’s first-generation AI chip, DX-M1. This success serves as a testament to DEEPX’s solutions being more than just a component supply; they are recognized as a core engine and a game changer that elevates global partners’ products to a world-class level.

 

DEEPX will host a dedicated booth at the Las Vegas Convention Center (LVCC), North Hall – AI & Robotics Zone (#8945). The exhibit will showcase real-world deployments of AI semiconductors across robotics, drones, factory automation, retail, and intelligent infrastructure, proving that Physical AI has moved beyond concept and into commercial-scale deployment.

At the booth, DEEPX will showcase performance targets for its next-generation DX-M2 AI chip, built on an advanced 2nm process. The DX-M2 is designed as a foundational infrastructure chip for the Physical AI era, solving the fundamental power and scalability limitations of data-center-centric architectures.

Furthermore, DEEPX will launch its Open-Source Physical AI Alliance, formed in collaboration with leading AI software ecosystems including Baidu PaddlePaddle and Ultralytics’ YOLO community. This initiative reflects DEEPX’s strategy to tightly integrate hardware and software, accelerating global adoption of Physical AI through open, developer-friendly platforms.

 

Key CES 2026 Events Hosted by DEEPX

 

1. Media Briefing
January 6, 2026 | LVCC South Connector S231 | 16:15 PM
DEEPX will present its next-generation ultra-low-power AI technologies and global partner expansion strategy, outlining a new industry standard for Physical AI infrastructure.

 

2. CES Foundry: Unstoppable Rise of Physical AI, Intelligented by DEEPX
January 8, 2026 | Fontainebleau Las Vegas, Azure Ballroom (Level 4) | 10:30 AM
An exclusive DEEPX-hosted forum featuring global leaders from Hyundai Motor Group Robotics Lab, Baidu, Wind River, Ultralytics, and the Edge AI Foundation. The session will explore real-world challenges and collaborative pathways for scaling Physical AI across industries.

 

“CES 2026 marks a pivotal moment for DEEPX—not just showcasing technology achievements, but demonstrating how Physical AI becomes real infrastructure through global partnerships,” said Lokwon Kim, CEO of DEEPX.

(Photo 1) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025

(Photo 1) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025

(Photo 2) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025

CES 2025

South Korea’s DEEPX to supply AI chips for Baidu’s drones and robots

South Korean AI semiconductor developer DeepX has struck a deal to supply chips for Chinese tech giant Baidu, targeting applications in drones and robotics.

The partnership will integrate DeepX’s processors with Baidu’s PaddlePaddle open-source deep learning framework to co-develop AI solutions for global industrial markets.
According to Yonhap News Agency and TheElec, Baidu said the agreement will broaden edge AI applications from optical character recognition (OCR) in documents and images to autonomous aerial and robotic systems.

Performance rivals Nvidia, with lower power draw
DeepX’s DX-M1 AI chip is now fully compatible with the fifth-generation PP-OCR model on PaddlePaddle. Baidu said the jointly developed recognition system outperformed Nvidia’s GeForce RTX 2080 Ti in key benchmarks, delivering superior performance and energy efficiency.
The chip’s low-power, high-performance profile makes it well-suited for battery-constrained industrial AI devices such as inspection robots, equipment monitors, and automated document processors, enabling faster, more accurate, and longer-lasting operations.
Baidu plans to deliver the DX-M1 to around 20 customers, including drone manufacturers, with mass production to follow initial orders. The companies aim to extend their collaboration beyond OCR into a broader range of physical AI applications.

Next-gen chips for Baidu’s ERNIE 4.5
The two firms have also begun proof-of-concept testing of DeepX’s upcoming DX-M2 chip with Baidu’s large vision model (VLM) ERNIE 4.5. Early results show that ERNIE 4.5 maintains high accuracy while operating stably in ultra-low-power environments.
Because DeepX’s semiconductors are designed for edge computing rather than large-scale AI training servers, the products fall outside the scope of US export restrictions on China-bound AI chips.

News Source – https://www.digitimes.com/news/a20250812PD207/deepx-baidu-industrial-chips-ocr.html

DEEPX and Wind River to Advance Mission-critical Edge AI

windriver

DEEPX, a pioneering on-device AI semiconductor company, and Wind River, a global leader in delivering software for the intelligent edge, have collaborated on a hardware and software solution for next-generation edge AI.

 

The partnership combines DEEPX’s on-device AI semiconductors with Wind River’s VxWorks® real-time operating system (RTOS) and Wind River® Helix™ Virtualization Platform to help advance solutions for mission-critical industries such as aerospace, defense, industrial, and robotics.

 

“Edge AI is on a path to unlock incredible opportunities across a diverse range of industries. Together with Wind River’s long heritage in software for markets that are highly dependent on safety, security, reliability, and edge expertise, DEEPX can provide customers with innovative edge AI platforms that deliver exceptional performance, cost, and power efficiency,” said Lokwon Kim, CEO, DEEPX.

 

“The growth of real-time physical AI is creating immense potential for mission-critical environments while also presenting new, complex challenges. The collaboration between DEEPX’s advanced AI semiconductors and Wind River’s proven edge technologies will help advance AI to deliver tremendous outcomes across applications and industries,” said Avijit Sinha, Senior Vice President, Strategy and Global Business Development, Wind River.

 

With the enablement of DEEPX’s neural processing units (NPUs) on Wind River technologies, companies can easily add accelerated AI to their real-time or edge systems, at lower cost. DEEPX and Wind River work to deliver a pre-validated solution stack that addresses safety and security issues, helping companies significantly reduce complexity and development cycles.

 

A leader in on-device AI, DEEPX develops advanced AI semiconductors that optimize performance, reduce power consumption, and enhance cost efficiency across various industries, including smart camera modules, smart mobility, smart factories, consumer electronics, smart cities, surveillance systems, and AI servers. DEEPX’s cutting-edge AI chips are engineered for maximum efficiency and effortless integration into any device.

 

Market-leading VxWorks is the industry’s most trusted and widely deployed RTOS for mission-critical systems that must be secure and safe. The first commercial RTOS to support Open Container Initiative (OCI)–compliant containers, VxWorks enables companies to rapidly deploy new software-defined capabilities. Helix Platform is a hypervisor solution that enables engineering teams to consolidate multiple systems onto a single high-performance embedded system. It streamlines safety certification, reduces project risk, and accelerates time-to-market.

 

DEEPX and AIC sign strategic MOU at Computex

 

DEEPX, an innovator at the forefront of ultra-efficient on-device AI semiconductor technology, has announced a strategic partnership with AIC Inc., a global leader specializing in enterprise storage and server solutions. The partnership, formalized through a Memorandum of Understanding (MoU) at Computex Taipei 2025, is set to redefine AI capabilities in edge computing markets.

 

The official signing ceremony on May 21 at AIC’s booth unveiled ambitious plans to integrate DEEPX‘s advanced Neural Processing Units (NPUs) with AIC’s robust industrial-grade server platforms. This collaboration aims to deliver unprecedented computational power combined with significant energy efficiency and compact form factors tailored specifically for edge environments. Notably, the jointly developed servers—such as the AIC CB201-CP model equipped with eight DEEPX DX-H1 AI accelerators—have already met the stringent specifications required by major enterprise customers in the technology sector. This particular solution is currently undergoing verification as an on-premise AI server in collaboration with a leading South Korean IT conglomerate, demonstrating readiness for deployment in demanding commercial environments.

 

Through close collaboration, DEEPX and AIC will develop innovative AI-optimized hardware solutions, including reference architectures and demonstrative systems. These offerings will cater directly to global system integrators and OEM partners demanding reliable, scalable, and economically viable AI solutions at the edge. Target applications include smart retail analytics, industrial automation processes, intelligent surveillance systems, and edge data center operations. Additionally, this partnership enables DEEPX to enter new markets such as Media & Entertainment, broadening its reach and creating new growth opportunities.

 

This partnership aligns strategically with DEEPX’s ongoing global expansion and ecosystem-building efforts. By leveraging AIC’s deep-rooted expertise in system integration and its extensive global manufacturing capabilities, DEEPX is positioned to further democratize access to high-performance AI solutions, ensuring their applicability and practicality across diverse real-world scenarios.

 

Immediate plans involve rapid validation of integrated systems and accelerated joint engagements with key international customers. The combined strengths of DEEPX’s semiconductor innovation and AIC’s server expertise promise transformative AI solutions that respond directly to the surging demand for secure, scalable, and power-conscious AI deployments in surveillance, industrial, and edge computing environments. 

 

 

DEEPX and Nota AI sign MOU at Computex

 

DEEPX (CEO Lokwon Kim), a leading developer of ultra-low-power on-device AI semiconductors, and Nota AI (CEO Myungsu Chae), an expert in AI model optimization and on-device generative AI, have signed a strategic Memorandum of Understanding (MOU) at Computex Taipei 2025, the world’s largest ICT exhibition. This partnership aims to strengthen their global position in the rapidly growing on-device AI market.

 

Under the agreement, the two companies will co-develop AI solutions that combine DEEPX‘s advanced Neural Processing Units (NPUs) with Nota’s lightweight AI models, enabling high-performance AI functionality even in ultra-compact, power-constrained devices. These joint solutions will serve as proof-of-concept models for applications in industrial robotics, smart appliances, security systems, mobility platforms, and more—accelerating market penetration both in Korea and globally.

 

As part of the collaboration, DEEPX will provide its NPU SDKs and development kits to support the optimized integration of lightweight AI models. Nota AI will design and fine-tune application-specific models to meet diverse industry requirements. The partnership also includes co-marketing efforts, joint participation in global trade shows, and active engagement with B2B customers worldwide through proof-of-concept deployments.

 

“This agreement will be an important collaboration to expand the on-device AI ecosystem,” said Lokwon Kim, CEO of DEEPX. “By combining the strengths of both on-device AI hardware and software, we will strive to bring competitive AI solutions to the global market.”

 

“Our strategic partnership with DEEPX combines Nota AI’s proprietary AI optimization technologies with DEEPX’s world-class AI hardware innovation, positioning us as leaders in the global on-device AI market,” said Nota AI CEO Myungsu Chae. “Together, we will accelerate the deployment of optimized AI across a range of industrial applications.”

 

This MOU highlights the growing global recognition of Korean innovation in on-device AI technology, signaling a new phase of international expansion for domestically developed AI solutions.

 

DEEPX ramps up mass-production chip supply for the global market, bolstering tangible business expansion


AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.

Last month at CES 2025 – one of the world’s largest electronics trade shows – DEEPX was recognized as a “must-visit company” by the event’s organizer, the Consumer Technology Association (CTA), shining a spotlight on the global market. During the show, over 16,000 visitors stopped by the DEEPX booth, resulting in more than 100 requests for mass-production chip samples—strong indicators of the company’s expanding commercial prospects.

During CES, DEEPX showcased various applications of its chips in edge devices for smart cities, smart factories, and robotics, as well as in industrial equipment and edge servers for global enterprises. Demonstrations and on-site meetings were held with a wide range of customers and partners from the United States, Taiwan, Japan, and Europe. In addition, major Korean corporations, government officials, and investors visited the booth on tours to get a firsthand look at DEEPX’s technological strengths.

Among the highlights, DEEPX successfully ran its first-generation mass-production chips using AI algorithms developed by:

– Hyundai-Kia Motor Robotics Lab (robot platform)
– Inventec (smart factory)
– POSCO DX (smart factory & logistics automation)
– LG U+ (industrial and urban security)

This demonstration underscored the critical role of on-device AI semiconductors – beyond cloud-based approaches – in ushering in a new era of AI.

DEEPX also directly compared its solution to NVIDIA’s Jetson Orin, a GPU-based edge platform, demonstrating approximately 10 times the power efficiency and 20 times the price/performance efficiency of its own NPU-based product. By also conducting a ‘butter benchmark’ test against other leading global NPU technologies, DEEPX demonstrated its advantage in power efficiency, thermal management, and operational stability – critical factors for on-device AI.

To illustrate its broad compatibility, DEEPX showcased integrations with application processor (AP) systems-including NXP, Renesas, TI, Broadcom, Rockchip, and Intel-as well as small form factor computing solutions such as the popular Raspberry Pi. The company also demonstrated interoperability with partner industrial PCs and leading workstation and server systems from HP, Dell, Supermicro, Lenovo, Inventec, and others, highlighting the versatility and scalability of its solution.

Looking ahead, DEEPX will partner with LG U+ at MWC (Mobile World Congress) in Barcelona from March 3 to demonstrate on-device AI solutions powered by its first-generation chip. DEEPX will also host its own booth to showcase the roadmap for its DX-M2 on-device AI semiconductor, designed for large language models. Following MWC, DEEPX will head to Embedded World on March 11 in Nuremberg, Germany, where its products will be showcased at partner booths – including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, and Network Optix – as well as DEEPX’s own stand. The company will conduct additional live demos and meet with potential customers to explore new business opportunities.

News Source-(CTA) What Not to Miss at CES 2025

DEEPX Wins 2024 Product of the Year Award, Demonstrating Global AI Semiconductor Leadership


On-device AI semiconductor company DEEPX (CEO Lokwon Kim) announced on the 6th that it had received the 2024 Product of the Year award, hosted by Electronic Products, a publication under EE Times, a global electronics industry journal.

Now in its 49th year, this award is given based on criteria such as groundbreaking technological advancements, innovative design, superior price-performance ratio, and market potential. It is a prestigious accolade previously awarded to global semiconductor leaders such as NXP, Renesas, Marvell Technology, and Texas Instruments, marking DEEPX’s international recognition for its technological excellence.

DEEPX is leading the next-generation semiconductor market with its innovative AI technology and global competitiveness. The company has filed over 300 patents worldwide and registered over 70, securing world-class proprietary AI semiconductor technology assets.

Based on these technological achievements, DEEPX was awarded the Presidential Commendation at the 2023 Korea Intellectual Property Office’s ‘Invention Day’ event. The company was also recognized at Computex Taipei, a major global AI semiconductor event, winning an innovation award among 400 competing companies. Additionally, DEEPX won three CES 2024 Innovation Awards and became the first AI semiconductor company invited to the World Economic Forum’s ‘Davos Forum,’ where it led discussions on energy credit policies for AI computing.

Furthermore, DEEPX has been listed in the EE Times ‘Silicon 100’ for two consecutive years and was named the ‘Best Company in the AI Semiconductor Industry’ by U.S. market research firm Frost & Sullivan. DEEPX continues solidifying its position as a key player in the AI semiconductor market through its global achievements and recognition for its innovation and technological leadership.


News Source – Electronic Products

BIOSTAR showcases new partnership with DEEPX in conjunction with new x86-based Edge AI Solutions

x86 edge AI platform from Biostar and DeepX

 

BIOSTAR, a leading manufacturer of Edge AI embedded computers, IPC solutions motherboards, graphics cards, and PC peripherals, is excited to announce x86 Edge AI platform showcase at CES 2025. Scheduled to take place from January 7 to 10 in Las Vegas, Nevada, USA, BIOSTAR, in partnership with DEEPX, an AI semiconductor company from South Korea, will showcase cutting-edge x86 Edge AI solutions at DEEPX’s booth (#9045) in the North Hall of the Las Vegas Convention Center.

 

DEEPX is a pioneering company in on-device AI. It develops advanced AI semiconductors that optimize performance, reduce power consumption, and enhance cost efficiency across various industries, including smart camera modules, smart mobility, smart factories, consumer electronics, smart cities, surveillance systems, and AI servers. Building upon their successful collaborations, BIOSTAR and DEEPX set to unveil their latest joint innovations at CES 2025, further enhancing their prominence in the industrial computing ecosystem.

 

This strategic collaboration integrates BIOSTAR’s AMD B650 motherboards and storage device with DEEPX’s advanced AI accelerators—the DX-H1 PCIe x16 (Bifurcation x4x4x4x4) and DX-M1 (M.2) modules – operating on a Linux platform. The real-time demonstration will feature state-of-the-art object detection, highlighting the seamless integration and scalability of their combined technologies in Edge AI applications.

 

By integrating BIOSTAR’s x86 based edge AI platforms with DEEPX’s advanced AI capabilities, this partnership establishes a new benchmark for AI computing industry, highlighting BIOSTAR’s pivotal role in shaping the future of Edge AI technology. As DEEPX becomes synonymous with cutting-edge AI NPU technology, BIOSTAR’s collaboration with such an industry leader enhances its reputation as an innovative and reliable partner in the AI edge computing industry.

 

News Source-Tech Power up

 

Virtium Embedded Artists Introduces Integrated AI Accelerator DEEPX DX-M1 and iMX8M Mini Kit

DEEPX DX-M1 & i.MX8M Mini

 

Industrial and embedded computing specialist Virtium Embedded Artists has announced the launch of the DEEPX iMX8M Mini AI Kit, developed in partnership with DEEPX: a single-board computer (SBC) style development bundle with an “AI Booster” delivering 25 tera-operations per second (TOPS) of compute at a 5W power draw for on-device machine learning (ML) and artificial intelligence (AI) workloads.

 

“This product redefines the limits of edge AI performance, delivering unparalleled power and cost efficiency,” claims Virtium Embedded Artists managing director Anders Rosvall of the company’s newest launch. “The DEEPX iMX8M Mini AI Kit simplifies the evaluation process for design engineers, enabling them to determine if our solution meets their application requirements while accelerating time to market.”

 

The DEEPX iMX8M Mini AI Kit isn’t a true single-board computer, though it can be treated like one; rather, it’s three boards bundled together. The first is an iMX8M Mini uCOM computer-on-module, built around NXP Semiconductor’s i.MS 8M Mini processor — giving it four Arm Cortex-A53 cores running at up to 1.8GHz and a Cortex-M4 core running at up to 400MHz, a VeriSilicon Vivante GC Nano Ultra 2D graphics processor, and GC320 3D graphics processor. To this the company has added 1GB of LPDDR4 memory and 8GB of on-board eMMC storage.

 

The second board is DEEPX’s contribution: an M.2 module with the company’s DX-M1 AI Booster, delivering a claimed 25 tera-operations per second (TOPS) of minimum-precision compute at a 5W power draw — the highest cost efficiency, power efficiency, and performance efficiency in the world, the company boasts. The final board ties everything together: a carrier board for the uCOM module, which includes a gigabit Ethernet port, USB ports, microSD card slot, MIPI Display Serial Interface (DSI) and parallel RGB video outputs plus a bundled DSI-to-HDMI adapter, a MIPI Camera Serial Interface (CSI) input, mikroBUS header, expansion connectors, and a dedicated debug interface.

 

The kit, which can run pre-trained models or custom models compiled with a toolkit available from DEEPX, is now available to order for “qualified projects” on the Virtium Embedded Artists website; the company has not publicly disclosed pricing.

 

 

 

News Source (1) – ‘Energy-Efficient DEEPX iMX8M Mini AI Kit (Hacksters.io)

News Source (2) – Embedded Artists 

DFI and DEEPX Unveil Revolutionary Edge AI at CES 2025 to Power Smart Cities and Industries

Accelerating the real-world adoption of Edge AIoT solutions

 

DFI, a global leader in embedded motherboards and industrial computers, will join DEEPX at CES 2025 to unveil new industrial edge AI platforms integrated with the DX-M1 AI accelerator, targeting smart city applications. This collaboration reflects a shared commitment to advancing on-device and application-specific AI, paving the way for a more flexible, efficient, and sustainable edge AI adoption.

 

According to Research and Markets, the global edge AI market is projected to grow at a 20.54% CAGR, increasing from US$23.571 billion in 2024 to US$59.978 billion by 2029. To meet the growing demand for scalable and energy-efficient AI solutions, DFI integrates the DEEPX DX-M1 AI accelerator into its industrial hardware platforms, delivering cutting-edge performance tailored to modern industry needs.

 

The DEEPX DX-M1 excels with the ability to process over 16 video channels on a single chip, achieve real-time performance exceeding 30 fps with GPU-level precision, and deliver up to 25 TOPs of AI power while minimizing energy consumption. This combination of power and efficiency enables simultaneous execution of advanced AI algorithms, such as object recognition and image classification, making it a versatile solution for applications in industrial robotics, machine vision, AI-driven IPC and HPC, smart factories, and beyond.

To demonstrate this vision, DFI will showcase two fan-less embedded systems—the EC710-ASL and EC600-RPS—featuring the DEEPX DX-M1 M.2 AI accelerator. These platforms are designed to meet critical real-time demands in smart cities, enabling applications like smart transportation, surveillance, and accident prevention. The system are powered by Intel® Atom® and Intel® 14th/13th/12th Gen processors, and support Intel® Time Coordinated Computing (Intel® TCC) technology for precise real-time operations while maintaining low power consumption and minimal latency.

 

DFI continues to push the boundaries of industrial-grade embedded solutions with its latest product innovations, including the ASL253 single-board computer powered by Intel® Atom® processors, the EB100-MTU NUC system featuring Intel® Core™ Ultra processors, proprietary Out-of-Band (OOB) modules, and the versatile DFI Workload Platform. These advancements not only boost hardware performance but also enhance remote management through OOB capabilities and optimize AI efficiency to meet the growing demands of edge AIoT applications.

 

News Source – Embedded Computing Design