DEEPX and Wind River to Advance Mission-critical Edge AI

windriver

DEEPX, a pioneering on-device AI semiconductor company, and Wind River, a global leader in delivering software for the intelligent edge, have collaborated on a hardware and software solution for next-generation edge AI.

 

The partnership combines DEEPX’s on-device AI semiconductors with Wind River’s VxWorks® real-time operating system (RTOS) and Wind River® Helix™ Virtualization Platform to help advance solutions for mission-critical industries such as aerospace, defense, industrial, and robotics.

 

“Edge AI is on a path to unlock incredible opportunities across a diverse range of industries. Together with Wind River’s long heritage in software for markets that are highly dependent on safety, security, reliability, and edge expertise, DEEPX can provide customers with innovative edge AI platforms that deliver exceptional performance, cost, and power efficiency,” said Lokwon Kim, CEO, DEEPX.

 

“The growth of real-time physical AI is creating immense potential for mission-critical environments while also presenting new, complex challenges. The collaboration between DEEPX’s advanced AI semiconductors and Wind River’s proven edge technologies will help advance AI to deliver tremendous outcomes across applications and industries,” said Avijit Sinha, Senior Vice President, Strategy and Global Business Development, Wind River.

 

With the enablement of DEEPX’s neural processing units (NPUs) on Wind River technologies, companies can easily add accelerated AI to their real-time or edge systems, at lower cost. DEEPX and Wind River work to deliver a pre-validated solution stack that addresses safety and security issues, helping companies significantly reduce complexity and development cycles.

 

A leader in on-device AI, DEEPX develops advanced AI semiconductors that optimize performance, reduce power consumption, and enhance cost efficiency across various industries, including smart camera modules, smart mobility, smart factories, consumer electronics, smart cities, surveillance systems, and AI servers. DEEPX’s cutting-edge AI chips are engineered for maximum efficiency and effortless integration into any device.

 

Market-leading VxWorks is the industry’s most trusted and widely deployed RTOS for mission-critical systems that must be secure and safe. The first commercial RTOS to support Open Container Initiative (OCI)–compliant containers, VxWorks enables companies to rapidly deploy new software-defined capabilities. Helix Platform is a hypervisor solution that enables engineering teams to consolidate multiple systems onto a single high-performance embedded system. It streamlines safety certification, reduces project risk, and accelerates time-to-market.

 

DEEPX and AIC sign strategic MOU at Computex

 

DEEPX, an innovator at the forefront of ultra-efficient on-device AI semiconductor technology, has announced a strategic partnership with AIC Inc., a global leader specializing in enterprise storage and server solutions. The partnership, formalized through a Memorandum of Understanding (MoU) at Computex Taipei 2025, is set to redefine AI capabilities in edge computing markets.

 

The official signing ceremony on May 21 at AIC’s booth unveiled ambitious plans to integrate DEEPX‘s advanced Neural Processing Units (NPUs) with AIC’s robust industrial-grade server platforms. This collaboration aims to deliver unprecedented computational power combined with significant energy efficiency and compact form factors tailored specifically for edge environments. Notably, the jointly developed servers—such as the AIC CB201-CP model equipped with eight DEEPX DX-H1 AI accelerators—have already met the stringent specifications required by major enterprise customers in the technology sector. This particular solution is currently undergoing verification as an on-premise AI server in collaboration with a leading South Korean IT conglomerate, demonstrating readiness for deployment in demanding commercial environments.

 

Through close collaboration, DEEPX and AIC will develop innovative AI-optimized hardware solutions, including reference architectures and demonstrative systems. These offerings will cater directly to global system integrators and OEM partners demanding reliable, scalable, and economically viable AI solutions at the edge. Target applications include smart retail analytics, industrial automation processes, intelligent surveillance systems, and edge data center operations. Additionally, this partnership enables DEEPX to enter new markets such as Media & Entertainment, broadening its reach and creating new growth opportunities.

 

This partnership aligns strategically with DEEPX’s ongoing global expansion and ecosystem-building efforts. By leveraging AIC’s deep-rooted expertise in system integration and its extensive global manufacturing capabilities, DEEPX is positioned to further democratize access to high-performance AI solutions, ensuring their applicability and practicality across diverse real-world scenarios.

 

Immediate plans involve rapid validation of integrated systems and accelerated joint engagements with key international customers. The combined strengths of DEEPX’s semiconductor innovation and AIC’s server expertise promise transformative AI solutions that respond directly to the surging demand for secure, scalable, and power-conscious AI deployments in surveillance, industrial, and edge computing environments. 

 

 

DEEPX and Nota AI sign MOU at Computex

 

DEEPX (CEO Lokwon Kim), a leading developer of ultra-low-power on-device AI semiconductors, and Nota AI (CEO Myungsu Chae), an expert in AI model optimization and on-device generative AI, have signed a strategic Memorandum of Understanding (MOU) at Computex Taipei 2025, the world’s largest ICT exhibition. This partnership aims to strengthen their global position in the rapidly growing on-device AI market.

 

Under the agreement, the two companies will co-develop AI solutions that combine DEEPX‘s advanced Neural Processing Units (NPUs) with Nota’s lightweight AI models, enabling high-performance AI functionality even in ultra-compact, power-constrained devices. These joint solutions will serve as proof-of-concept models for applications in industrial robotics, smart appliances, security systems, mobility platforms, and more—accelerating market penetration both in Korea and globally.

 

As part of the collaboration, DEEPX will provide its NPU SDKs and development kits to support the optimized integration of lightweight AI models. Nota AI will design and fine-tune application-specific models to meet diverse industry requirements. The partnership also includes co-marketing efforts, joint participation in global trade shows, and active engagement with B2B customers worldwide through proof-of-concept deployments.

 

“This agreement will be an important collaboration to expand the on-device AI ecosystem,” said Lokwon Kim, CEO of DEEPX. “By combining the strengths of both on-device AI hardware and software, we will strive to bring competitive AI solutions to the global market.”

 

“Our strategic partnership with DEEPX combines Nota AI’s proprietary AI optimization technologies with DEEPX’s world-class AI hardware innovation, positioning us as leaders in the global on-device AI market,” said Nota AI CEO Myungsu Chae. “Together, we will accelerate the deployment of optimized AI across a range of industrial applications.”

 

This MOU highlights the growing global recognition of Korean innovation in on-device AI technology, signaling a new phase of international expansion for domestically developed AI solutions.

 

DEEPX ramps up mass-production chip supply for the global market, bolstering tangible business expansion


AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.

Last month at CES 2025 – one of the world’s largest electronics trade shows – DEEPX was recognized as a “must-visit company” by the event’s organizer, the Consumer Technology Association (CTA), shining a spotlight on the global market. During the show, over 16,000 visitors stopped by the DEEPX booth, resulting in more than 100 requests for mass-production chip samples—strong indicators of the company’s expanding commercial prospects.

During CES, DEEPX showcased various applications of its chips in edge devices for smart cities, smart factories, and robotics, as well as in industrial equipment and edge servers for global enterprises. Demonstrations and on-site meetings were held with a wide range of customers and partners from the United States, Taiwan, Japan, and Europe. In addition, major Korean corporations, government officials, and investors visited the booth on tours to get a firsthand look at DEEPX’s technological strengths.

Among the highlights, DEEPX successfully ran its first-generation mass-production chips using AI algorithms developed by:

– Hyundai-Kia Motor Robotics Lab (robot platform)
– Inventec (smart factory)
– POSCO DX (smart factory & logistics automation)
– LG U+ (industrial and urban security)

This demonstration underscored the critical role of on-device AI semiconductors – beyond cloud-based approaches – in ushering in a new era of AI.

DEEPX also directly compared its solution to NVIDIA’s Jetson Orin, a GPU-based edge platform, demonstrating approximately 10 times the power efficiency and 20 times the price/performance efficiency of its own NPU-based product. By also conducting a ‘butter benchmark’ test against other leading global NPU technologies, DEEPX demonstrated its advantage in power efficiency, thermal management, and operational stability – critical factors for on-device AI.

To illustrate its broad compatibility, DEEPX showcased integrations with application processor (AP) systems-including NXP, Renesas, TI, Broadcom, Rockchip, and Intel-as well as small form factor computing solutions such as the popular Raspberry Pi. The company also demonstrated interoperability with partner industrial PCs and leading workstation and server systems from HP, Dell, Supermicro, Lenovo, Inventec, and others, highlighting the versatility and scalability of its solution.

Looking ahead, DEEPX will partner with LG U+ at MWC (Mobile World Congress) in Barcelona from March 3 to demonstrate on-device AI solutions powered by its first-generation chip. DEEPX will also host its own booth to showcase the roadmap for its DX-M2 on-device AI semiconductor, designed for large language models. Following MWC, DEEPX will head to Embedded World on March 11 in Nuremberg, Germany, where its products will be showcased at partner booths – including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, and Network Optix – as well as DEEPX’s own stand. The company will conduct additional live demos and meet with potential customers to explore new business opportunities.

News Source-(CTA) What Not to Miss at CES 2025

DEEPX Wins 2024 Product of the Year Award, Demonstrating Global AI Semiconductor Leadership


On-device AI semiconductor company DEEPX (CEO Lokwon Kim) announced on the 6th that it had received the 2024 Product of the Year award, hosted by Electronic Products, a publication under EE Times, a global electronics industry journal.

Now in its 49th year, this award is given based on criteria such as groundbreaking technological advancements, innovative design, superior price-performance ratio, and market potential. It is a prestigious accolade previously awarded to global semiconductor leaders such as NXP, Renesas, Marvell Technology, and Texas Instruments, marking DEEPX’s international recognition for its technological excellence.

DEEPX is leading the next-generation semiconductor market with its innovative AI technology and global competitiveness. The company has filed over 300 patents worldwide and registered over 70, securing world-class proprietary AI semiconductor technology assets.

Based on these technological achievements, DEEPX was awarded the Presidential Commendation at the 2023 Korea Intellectual Property Office’s ‘Invention Day’ event. The company was also recognized at Computex Taipei, a major global AI semiconductor event, winning an innovation award among 400 competing companies. Additionally, DEEPX won three CES 2024 Innovation Awards and became the first AI semiconductor company invited to the World Economic Forum’s ‘Davos Forum,’ where it led discussions on energy credit policies for AI computing.

Furthermore, DEEPX has been listed in the EE Times ‘Silicon 100’ for two consecutive years and was named the ‘Best Company in the AI Semiconductor Industry’ by U.S. market research firm Frost & Sullivan. DEEPX continues solidifying its position as a key player in the AI semiconductor market through its global achievements and recognition for its innovation and technological leadership.


News Source – Electronic Products

BIOSTAR showcases new partnership with DEEPX in conjunction with new x86-based Edge AI Solutions

x86 edge AI platform from Biostar and DeepX

 

BIOSTAR, a leading manufacturer of Edge AI embedded computers, IPC solutions motherboards, graphics cards, and PC peripherals, is excited to announce x86 Edge AI platform showcase at CES 2025. Scheduled to take place from January 7 to 10 in Las Vegas, Nevada, USA, BIOSTAR, in partnership with DEEPX, an AI semiconductor company from South Korea, will showcase cutting-edge x86 Edge AI solutions at DEEPX’s booth (#9045) in the North Hall of the Las Vegas Convention Center.

 

DEEPX is a pioneering company in on-device AI. It develops advanced AI semiconductors that optimize performance, reduce power consumption, and enhance cost efficiency across various industries, including smart camera modules, smart mobility, smart factories, consumer electronics, smart cities, surveillance systems, and AI servers. Building upon their successful collaborations, BIOSTAR and DEEPX set to unveil their latest joint innovations at CES 2025, further enhancing their prominence in the industrial computing ecosystem.

 

This strategic collaboration integrates BIOSTAR’s AMD B650 motherboards and storage device with DEEPX’s advanced AI accelerators—the DX-H1 PCIe x16 (Bifurcation x4x4x4x4) and DX-M1 (M.2) modules – operating on a Linux platform. The real-time demonstration will feature state-of-the-art object detection, highlighting the seamless integration and scalability of their combined technologies in Edge AI applications.

 

By integrating BIOSTAR’s x86 based edge AI platforms with DEEPX’s advanced AI capabilities, this partnership establishes a new benchmark for AI computing industry, highlighting BIOSTAR’s pivotal role in shaping the future of Edge AI technology. As DEEPX becomes synonymous with cutting-edge AI NPU technology, BIOSTAR’s collaboration with such an industry leader enhances its reputation as an innovative and reliable partner in the AI edge computing industry.

 

News Source-Tech Power up

 

Virtium Embedded Artists Introduces Integrated AI Accelerator DEEPX DX-M1 and iMX8M Mini Kit

DEEPX DX-M1 & i.MX8M Mini

 

Industrial and embedded computing specialist Virtium Embedded Artists has announced the launch of the DEEPX iMX8M Mini AI Kit, developed in partnership with DEEPX: a single-board computer (SBC) style development bundle with an “AI Booster” delivering 25 tera-operations per second (TOPS) of compute at a 5W power draw for on-device machine learning (ML) and artificial intelligence (AI) workloads.

 

“This product redefines the limits of edge AI performance, delivering unparalleled power and cost efficiency,” claims Virtium Embedded Artists managing director Anders Rosvall of the company’s newest launch. “The DEEPX iMX8M Mini AI Kit simplifies the evaluation process for design engineers, enabling them to determine if our solution meets their application requirements while accelerating time to market.”

 

The DEEPX iMX8M Mini AI Kit isn’t a true single-board computer, though it can be treated like one; rather, it’s three boards bundled together. The first is an iMX8M Mini uCOM computer-on-module, built around NXP Semiconductor’s i.MS 8M Mini processor — giving it four Arm Cortex-A53 cores running at up to 1.8GHz and a Cortex-M4 core running at up to 400MHz, a VeriSilicon Vivante GC Nano Ultra 2D graphics processor, and GC320 3D graphics processor. To this the company has added 1GB of LPDDR4 memory and 8GB of on-board eMMC storage.

 

The second board is DEEPX’s contribution: an M.2 module with the company’s DX-M1 AI Booster, delivering a claimed 25 tera-operations per second (TOPS) of minimum-precision compute at a 5W power draw — the highest cost efficiency, power efficiency, and performance efficiency in the world, the company boasts. The final board ties everything together: a carrier board for the uCOM module, which includes a gigabit Ethernet port, USB ports, microSD card slot, MIPI Display Serial Interface (DSI) and parallel RGB video outputs plus a bundled DSI-to-HDMI adapter, a MIPI Camera Serial Interface (CSI) input, mikroBUS header, expansion connectors, and a dedicated debug interface.

 

The kit, which can run pre-trained models or custom models compiled with a toolkit available from DEEPX, is now available to order for “qualified projects” on the Virtium Embedded Artists website; the company has not publicly disclosed pricing.

 

 

 

News Source (1) – ‘Energy-Efficient DEEPX iMX8M Mini AI Kit (Hacksters.io)

News Source (2) – Embedded Artists 

DFI and DEEPX Unveil Revolutionary Edge AI at CES 2025 to Power Smart Cities and Industries

Accelerating the real-world adoption of Edge AIoT solutions

 

DFI, a global leader in embedded motherboards and industrial computers, will join DEEPX at CES 2025 to unveil new industrial edge AI platforms integrated with the DX-M1 AI accelerator, targeting smart city applications. This collaboration reflects a shared commitment to advancing on-device and application-specific AI, paving the way for a more flexible, efficient, and sustainable edge AI adoption.

 

According to Research and Markets, the global edge AI market is projected to grow at a 20.54% CAGR, increasing from US$23.571 billion in 2024 to US$59.978 billion by 2029. To meet the growing demand for scalable and energy-efficient AI solutions, DFI integrates the DEEPX DX-M1 AI accelerator into its industrial hardware platforms, delivering cutting-edge performance tailored to modern industry needs.

 

The DEEPX DX-M1 excels with the ability to process over 16 video channels on a single chip, achieve real-time performance exceeding 30 fps with GPU-level precision, and deliver up to 25 TOPs of AI power while minimizing energy consumption. This combination of power and efficiency enables simultaneous execution of advanced AI algorithms, such as object recognition and image classification, making it a versatile solution for applications in industrial robotics, machine vision, AI-driven IPC and HPC, smart factories, and beyond.

To demonstrate this vision, DFI will showcase two fan-less embedded systems—the EC710-ASL and EC600-RPS—featuring the DEEPX DX-M1 M.2 AI accelerator. These platforms are designed to meet critical real-time demands in smart cities, enabling applications like smart transportation, surveillance, and accident prevention. The system are powered by Intel® Atom® and Intel® 14th/13th/12th Gen processors, and support Intel® Time Coordinated Computing (Intel® TCC) technology for precise real-time operations while maintaining low power consumption and minimal latency.

 

DFI continues to push the boundaries of industrial-grade embedded solutions with its latest product innovations, including the ASL253 single-board computer powered by Intel® Atom® processors, the EB100-MTU NUC system featuring Intel® Core™ Ultra processors, proprietary Out-of-Band (OOB) modules, and the versatile DFI Workload Platform. These advancements not only boost hardware performance but also enhance remote management through OOB capabilities and optimize AI efficiency to meet the growing demands of edge AIoT applications.

 

News Source – Embedded Computing Design

AI chips for all: DEEPX CEO Lokwon Kim’s vision to democratize AI technology

 

The applications of AI are becoming increasingly widespread in our daily lives. With the continuous iteration of generative AI and large language models, various innovative applications are emerging. These include, such as smart home appliances, autonomous vehicles, and robots to VR/AR applications.

 

These edge devices are equipped with AI processors that compute on the device directly, further accelerating the launch of innovative Edge AI applications. However, these devices also face several challenges, including excessive GPU power consumption and high costs limiting the widespread adoption of Edge AI products.

 

DEEPX, an AI chip startup from Korea, won three CES Innovation Awards 2024 in January for its unique AI chip ultra-gap source technology. The awards were in the categories of Computer Hardware, Embedded Technology, and Robotics, and Computer Hardware & components.

 

Their NPU processor boasts low power consumption and cost-effectiveness and addresses the issue of insufficient accuracy found in existing NPUs on the market. This technology was recognized by lots of semiconductor companies during CES 2024 and is scheduled for mass market release in late 2024.

 

 

Learn from ARM to build DEEPX into a leading On-device AI company

“The main battlegrounds in the AI era will move to the ‘edge’. Just as ARM dominated the CPU market with smartphones, the semiconductor company that dominates the edge will dominate the AI market,” DEEPX CEO Lokwon Kim said.

 

Kim, a former senior researcher in Apple’s Application Processor (AP) design, returned to South Korea to establish DEEPX after gaining extensive experience in semiconductor design at renowned companies like Broadcom, Cisco, and IBM T.J Watson. His goal is to build DEEPX into a leading AI company in the era of on-device AI, reminiscent of how ARM revolutionized the CPU market with its low-power technology.

 

On-device AI, which processes information within a mobile device without connecting to a server or cloud, is a burgeoning field. ARM broke Intel’s dominance in the CPU market with its efficient, low-power processors, which are now prevalent in smartphones and expanding into PCs and servers. Kim aspires for DEEPX to have a similar impact on the AI semiconductor industry.

 

Kim identified a weakness in Korea’s semiconductor ecosystem, particularly in system semiconductors. Drawing inspiration from Morris Chang, the founder of TSMC, who returned to Taiwan to establish a leading foundry after learning from the American semiconductor giant TI, Kim saw an opportunity to address these gaps in the South Korean market.

 

Chang predicted a demand-driven semiconductor market, leading to the creation of TSMC, which produces semiconductors on consignment. Similarly, Kim believes that the opening of the AI semiconductor market offers a chance for innovation and growth.

 

Democratizing AI Technology

Kim opposes the monopolization of AI semiconductor technology through strategic investments (SIs) that often lead to mergers, acquisitions, or alliances, resulting in technology being controlled by a single entity. His experience at Apple motivated him to advocate for more democratic and accessible AI semiconductor technology. He believes that AI semiconductors should be universally available and not restricted to proprietary use, emphasizing the importance of technology that everyone can utilize.

 

To pursue this vision, Kim established DEEPX in Pangyo, South Korea’s hub for fabless companies. He aims to create an AI semiconductor company with a unique value, promoting innovation over exclusivity.

DEEPX is positioned not as a competitor to global semiconductor giants but as a complementary force, enhancing the global semiconductor landscape by providing accessible and advanced AI technology.

 

 

Analyzing the Difference Between NPUs and GPUs: DEEPX’s Unique Solution

The necessity for developing specialized AI semiconductors, such as NPUs, stems from the limitations of GPUs, which have traditionally been used for AI computations. GPUs, originally designed to process graphic data, excel at handling large amounts of data simultaneously, making them suitable for AI learning tasks.

 

However, their high power consumption and operational costs present significant drawbacks. This makes them less ideal for “edge AI,” which involves running AI applications directly on devices like controllers, robots, and self-driving cars – collectively referred to as the “edge.”

 

NPUs (Neural Processing Units) are modeled after the human brain, offering the benefits of lower power consumption and reduced production costs. However, existing NPUs have struggled with accuracy and support for the latest AI algorithms. DEEPX stands out among fabless companies by addressing the core challenges of AI semiconductors in one comprehensive solution.

 

Unlike typical NPU vendors that release a single chip, DEEPX recognizes that different electronic devices require varying levels of semiconductor capabilities. For instance, AI for closed-circuit television (CCTV) primarily needs to analyze video, whereas AI for robots involves far more complex computations.

 

To address this, DEEPX has developed from low-end to high-end performance four chips at once: one that can connect a single electronic device for AI computations, and another that can link three or four devices for broader AI tasks. This universality across devices is a key reason DEEPX received the Innovation Award at CES 2024.

 

DEEPX’s commitment to high performance at lower power and cost also earned them the Innovation Award. The company’s latest AI algorithm, Yolo7, runs on their semiconductor DX-V1, produced using Samsung’s 28nm process.

 

This algorithm was previously incompatible with conventional NPUs. In addition, the DX-M1 chip boasts a design area one-third the size of other NPUs, and its manufacturing cost is similarly reduced by one-third. Combining low unit costs with high performance in a low-power NPU, DEEPX’s products are poised to lead the AI semiconductor market.

 

NPUs are categorized into data center-based NPUs, which handle large-scale inference, and edge-type NPUs, designed for use in electronic devices such as robots, smart cameras, smart factories, consumer electronics, etc. DEEPX targets both data center and edge NPU markets. DEEPX’s NPUs overcome the common shortcomings of existing NPUs by providing high accuracy and efficiency.

 

DEEPX’s innovation lies in creating NPUs that are not only small and cost-effective but also achieve accuracy comparable to, or even better than, GPUs. This success is attributed to DEEPX’s pioneering work in two core technologies: IQ8 (an INT8 model compression technology), and Smart Memory Access(minimizes D-RAM usage). DEEPX leads the market for low-power AI solutions, achieving the world’s highest power-to-performance ratio through proprietary advancements in hardware and software optimization.

 

Advancing Towards Mass Production

DEEPX has successfully demonstrated its original technology with sample units and is in the final stages of preparing its mass-production chip. Scheduled for market release in late 2024, the widespread adoption of products featuring DEEPX’s chips could establish the company as a technology leader in the on-device AI market by 2025.

 

The essence of on-device AI lies in low power consumption and the seamless integration of hardware and software. Since AI must operate on small devices, minimizing power consumption is crucial while maximizing AI performance within limited computing power.

 

Kim, drawing from his experience at Apple, emphasizes the importance of designing hardware and software with equal priority from the outset. Unlike Apple, which develops its own devices and services, DEEPX engaged with approximately 700 customers during product development to understand their needs and find the optimal development point. This customer-centric approach has been pivotal in refining DEEPX’s products.

 

Four companies from Israel and the U.S., including DEEPX, are vying for dominance in the emerging on-device AI market. As the market begins to flourish beyond the server market, this competition is crucial for setting future momentum.

 

Kim is confident in DEEPX’s strategy. He notes that while some competitors prioritize rapid product releases, DEEPX focuses on price and optimization first. Given the rapid evolution of AI application services, Kim believes it is more important to align with market trends and offer high-performance features at a competitive cost rather than rushing products to market.

 

DEEPX’s innovative approach to developing versatile, efficient, and cost-effective NPUs positions the company as a formidable contender in the on-device AI market. By prioritizing customer needs and maintaining a balanced focus on hardware and software optimization, DEEPX is set to lead the industry with cutting-edge AI semiconductor solutions.

 

 

DEEPX Company’s Philosophy: Valuing Technology Over Short-term Results

DEEPX is not focused on making AI semiconductors for autonomous cars or smartphones. Instead, DEEPX aims to advance the integration of AI into everyday life. The company’s products are designed to bring AI to areas such as CCTV and robots, pushing these technologies beyond outdated algorithms. DEEPX’s mission is to pioneer advancements that should have already been made in the AI semiconductor industry.

 

At the entrance of DEEPX, there is a note to employees that emphasizes the value of technology over monetary gains. It quotes Carl Sagan’s “pale blue dot,” reflecting the idea that life should be lived with value rather than chasing money and power. The message encourages the 70 employees to love their work and find it meaningful, aligning with the company’s ethos of creating technology for the greater good.

 

DEEPX believes in ‘technology that everyone shares.’ From a management perspective, AI is seen as one of humanity’s final inventions, marking the endpoint of human evolution. The goal is not to monopolize technology or chase profits but to lead the way in making AI accessible and beneficial for all. DEEPX’s AI semiconductors are the cornerstone of this vision, enabling widespread adoption of AI.

 

Future Plan: Global Expansion and Innovation

DEEPX’s visionary CEO, Kim, has outlined a strategic plan for the future:

– Global Market Entry: Starting from the second half of this year, DEEPX plans to aggressively enter the global market with its first-generation product, consisting of four AI chips. This move is set to usher in the era of “AI Everywhere.”

 

– Technological Innovation: DEEPX aims to develop new technologies that enable super-scale AI services with power consumption of less than 5W. This innovation will make advanced AI technologies more accessible and practical for widespread use.

 

– Leadership in AI: DEEPX is committed to becoming a leading comprehensive AI chip company globally. By focusing on power and cost efficiency, the company seeks to provide core technologies that transition giant AI advancements from the realm of science to everyday applications.

 

DEEPX’s mission is to integrate AI into everyday life, advancing technology in meaningful ways. By valuing innovation over profit and aiming for global leadership, DEEPX is set to play a pivotal role in the future of AI. The company’s commitment to shared technology and global expansion highlights its dedication to making AI accessible and beneficial for humanity.

 

News Source – Digitimes

DEEPX and Hyundai Motor Company and Kia Corporation are collaborating on AI semiconductor-based Robot Platforms

 

DEEPX, Hyundai Motor Company, and Kia Corporation will cooperate with technology development for on-device AI technology for robot platforms.

 

On March 24 (Friday) at the Uiwang Research Facility of Hyundai Motors & Kia Corporation, DEEPX announced its execution of the MOU on AI semiconductor collaboration use for robot platforms, with the representatives of both companies, including Lokwon Kim, CEO, and DongJin Hyun, Robotics Lab leader of Hyundai Motors & Kia Corporation.

 

DEEPX develops AI semiconductors and implements AI technology used in various electronic devices that exist outside of the data center with high-performance and low-power advantages. Currently, DEEPX has four kinds of AI semiconductors that are optimized for performance and function that can match various edge and server AI application fields and have secured more than 150 patents, both domestic and international, that are related to fundamental AI semiconductor technology. Domestically, DEEPX is evaluated as the leading AI semiconductor fabless company, and DEEPX is targeting the global edge AI market.

 

During the Proof-of-Concept (PoC) conducted over the past year by Hyundai Motor Group and Kia Robotics Lab, DEEPX demonstrated outstanding AI performance by providing higher AI accuracy with INT8bit than FP32bit. In addition, it has been proven that various robot application AI algorithms developed by the Robotics Lab can be smoothly operated, making it possible to implement AI models required by robots. In particular, it is evaluated as suitable for mass production of battery-powered robot products due to its exceptionally high AI computational efficiency and low power operation.

 

This agreement aims to cooperate on the application of DEEPX’s AI semiconductor technology to the robot platform currently under development with the aim of commercialization by Hyundai Motor Group and Kia. To achieve this, the two companies will incorporate AI functions for robots into DEEPX’s AI SoC (System on Chip) products, verify their operability and mass production for deployment in the final products developed by Robotics Lab. In this way, the AI technology can be implemented in the robots developed by the Robotics Lab.

 

Lokwon Kim, CEO, commented: “According to the global market research data, the size of the global smart mobility market is expected to grow to about 145 billion dollars by the year 2027. For the AI semiconductor, the core technology of this market, there are currently no optimized solutions for each detailed field. Therefore, it is possible to lead the market if a mass production-ready solution is prepared. Having technology cooperation with the global market leader Hyundai Motors and Kia Corporation will present DEEPX’s AI semiconductor with an opportunity to become the core solution of the future market in the related field. This is a great inspiration for us. DEEPX has succeeded in commercializing NPU IP in 2021, and I am grateful to earn the chance to demonstrate the test for mass production as soon as we reach the NPU development milestone this year”.

 

DongJin Hyun, leader of the Robotics Lab of Hyundai Motors & Kia Corporation, said, “I expect we can lead the excellent robotics service development in both performance and price by combining the SW technology of the Robotics Lab and DEEPX’s HW technology.” He added, “As soon as we confirm and examine the superiority of DEEPX NPU chip products, we will carry on with further cooperation and apply it to the robot under research and development.”

 

News Source – AP News