CES 2026 Foundry: DEEPX Declares the Era of Physical AI with Global Partners

DEEPX, a pioneer in AI semiconductor technology, successfully hosted the “CES 2026 Foundry” session, an
official media event organized by the Consumer Technology Association (CTA). At the event, DEEPX and its global partners unveiled scalable solutions designed to move artificial intelligence beyond data centers and establish a robust infrastructure for “Physical AI.”

 

Themed “The Unstoppable Rise of Physical AI,” the panel brought together industry heavyweights actively deploying mass-production AI. Discussions centered on the practical challenges and critical requirements for operating AI reliably in real-world physical environments.

 

Opening the session, Lokwon Kim, Founder and CEO of DEEPX, emphasized that Physical AI is no longer a futuristic concept but an immediate reality.

“The center of gravity in AI is shifting from the cloud to the physical world,” Kim stated. “To accelerate this transition, we must achieve a seamless integration of hardware and software that can withstand real-world constraints.”

 

The panel featured senior executives from Hyundai Motor Group Robotics Lab, Baidu, Edge AI Foundation, Ultralytics, and Wind River, representing a diverse ecosystem spanning robotics, edge platforms, open-source frameworks, and mission-critical systems. A consensus emerged among the panelists: across robotics, smart factories, and edge IT services, the industry demands reduced reliance on data centers, ultra-low power consumption, thermal efficiency, and stable 24/7 operation.

 

Dongjin Hyun, Executive Director at Hyundai Motor Group Robotics Lab, remarked: “Robotics is becoming core infrastructure for both society and industry. Physical AI enables robots to make autonomous decisions on-device, even in unstable network environments. Through our collaboration with DEEPX, we have validated on-device AI capabilities in real-world conditions and plan to deploy these solutions in
our next-generation robots and security systems starting in 2026.”

 

Addressing the software ecosystem, Raine Hua, Global Ecosystem AI Manager at Baidu, noted: “In the era of Physical AI, success isn’t just about model performance, it’s about consistency. Models must run
reliably anywhere. Our collaboration with DEEPX offers a streamlined path to deploy models at the edge without the need for repeated redesigns.”

 

Pete Bernard, CEO of Edge AI Foundation, highlighted the structural limitations of current architectures:
“Data-center-centric AI faces clear constraints regarding cost, power, and latency. DEEPX is establishing Physical AI as a foundational infrastructure by combining tangible performance with robust ecosystem development.” The discussion also tackled barriers to large-scale deployment, such as fragmented toolchains and the re-optimization burden during model porting.

 

Francesco Mattioli, Lead Partner Engineer at Ultralytics, commented: “Developers can build models
quickly, but deployment remains the bottleneck. Our partnership with DEEPX simplifies the journey from training to deployment, delivering real-world performance without requiring developers to become hardware experts.”

 

Sandeep Modhvadia, CPO at Wind River, offered a perspective on mission-critical systems: “For AI to serve as infrastructure in defense, aerospace, and industrial sectors, security, predictability, and long-term stability are non-negotiable. DEEPX’s solutions enable trusted systems that operate reliably in the field.”

 

During the event, DEEPX also introduced its initiative to build an open-source-based Physical AI alliance, stressing that the widespread adoption of Physical AI depends on delivering “plug-and-play” environments through collaborative ecosystems.

 

Through the CES 2026 Foundry, DEEPX cemented its position as a key provider of Physical AI infrastructure, combining ultra-low-power, high-performance silicon with a thriving global partnership network.

CES 2026 Media Briefing: DEEPX Unveils Physical AI Vision & Roadmap

DEEPX, a pioneer in ultra-low-power on-device AI semiconductors, today unveiled its next-generation roadmap at a global media briefing during CES 2026. Headlining the announcement is the DX-M2, the company’s second-generation AI processor designed to run Large Language Models (LLMs) of up to 100 billion parameters at under 5 watts—a breakthrough set to liberate generative AI from the constraints of cloud data centers.

 

DX-M2: Bringing Generative AI to the Edge (Sub-5W) The DX-M2 roadmap targets on-device inference for 20B–100B parameter LLMs, including Mixture-of-Experts (MoE) architectures, within a remarkably low power envelope of sub-5W. This represents a paradigm shift, migrating generative AI workloads from centralized servers to independent edge devices operating in the physical world.

 

“Running a 100B parameter LLM under 5 watts isn’t just a performance upgrade—it redefines the fundamental possibilities of AI infrastructure,” said Young Cho, Vice President of DEEPX. “Generative AI will no longer be tethered to the cloud. It will be ubiquitous, embedded directly into the machines that perceive and interact with our world.”

 

This vision positions the DX-M2 as a critical enabler for “Physical AI”—empowering real-world machines to process, interpret, and act autonomously without reliance on network connectivity or energy-intensive server farms.

 

Impact on Infrastructure & Sustainability DEEPX forecasts that distributing inference workloads across billions of edge devices could slash data center traffic by over 80%, offering a viable solution to current energy bottlenecks and escalating operational costs. The DX-M2 leverages architectural insights from the mass production of the first-generation DX-M1, featuring enhanced power management, superior thermal efficiency, and optimized software stacks.

 

Scaling the Ecosystem: 3 Strategic Pillars Building on the commercial success of the DX-M1 platform—now deployed in over 50 projects across robotics, defense, and industrial sectors—DEEPX introduced a three-pillar strategy to accelerate global adoption:

 

1. Open-Source Physical AI Alliance

Partners: Ultralytics, Baidu PaddlePaddle

DEEPX is establishing a developer-centric software ecosystem tailored for real-world deployment. By integrating with leading frameworks like Ultralytics and Baidu PaddlePaddle, DEEPX ensures a seamless workflow from model development to edge deployment, minimizing friction for engineers.

 

2. Global Distribution Network

Partners: Avnet, DigiKey, WPG

To streamline supply chains and improve accessibility, DEEPX has secured partnerships with major global distributors including Avnet, DigiKey, and WPG. Chips, development kits, and reference modules are now readily available, accelerating time-to-market for customers worldwide.

 

3. “AI Player” Dev-Kit

The newly launched AI Player Dev-Kit lowers the barrier to entry for edge AI. Designed to simplify model evaluation, benchmarking, and system validation, this tool shortens the cycle from prototyping to mass production, abstracting hardware complexity for developers and integrators.

 

 

“While the DX-M1 proved the viability of large-scale vision AI at the edge, the DX-M2 marks the inflection point for generative AI,” a DEEPX spokesperson noted. “Our mission is to decouple AI from the cost and energy limitations of traditional centralized infrastructure.”

Caption: DEEPX executives pose for a photo following the CES 2026 Media Briefing. (From left) Tim Park (Director of Strategic Marketing), Lokwon Kim (CEO), and Young Cho (CFO)

Caption: DEEPX executives pose for a photo following the CES 2026 Media Briefing. (From left) Tim Park (Director of Strategic Marketing), Lokwon Kim (CEO), and Young Cho (CFO)

DEEPX: CTA’s “What Not To Miss” for 2nd Year at CES 2026

CES

DEEPX, a global leader in ultra-low-power AI semiconductors, has been featured in the Consumer Technology Association’s(CTA) “What Not To Miss” guide for CES 2026, marking its second consecutive year on this prestigious list.

 

In the official CES 2026 guide, DEEPX is highlighted alongside industry titans such as AMD, NVIDIA, Qualcomm, and Samsung Electronics as a key innovator shaping the future of AI. 

Each year, the CTA curates a list of standout technologies and exhibitors that attendees should prioritize. The 2026 edition places special emphasis on practical AI technologies deployed in real-world physical environments—a domain where DEEPX is leading the charge.

 

DEEPX Makes a Bold Statement on the Main Floor. With the opening of CES 2026, DEEPX unveiled an expansive standalone booth (#8745) in the North Hall of the Las Vegas Convention Center (LVCC). 

 

The exhibition goes beyond merely showcasing semiconductor chips; it offers an immersive experience demonstrating how DEEPX’s “Physical AI” technology is live-operating across diverse industrial environments, including robotics, mobility, smart factories, and intelligent infrastructure.

 

Three Key Highlights at CES 2026 

Showcasing Leadership on the Global Main Stage: DEEPX takes center stage in the LVCC North Hall, the hub for the world’s leading tech companies. This move reinforces its transition from a promising startup to a global AI infrastructure provider.

 

Global “Physical AI Alliance” Showcase: The booth features commercially deployable AI solutions developed in collaboration with global partners, including Hyundai Motor Group Robotics Lab, Baidu PaddlePaddle, Ultralytics, Advantech, AAEON, Sixfab, Dell, Supermicro, Ampere, and HP, spanning hardware, software, and system integration.

 

Driving Real Business Results: DEEPX is hosting relay meetings in private conference rooms within the booth to facilitate pre-scheduled one-on-one discussions with global buyers, partners, and investors, aiming to accelerate tangible business partnerships and contracts.

 

Official CES Programs: Media Briefing & CES Foundry During CES 2026, DEEPX will host an official CTA Media Briefing, where the company will share its business strategy and next-generation AI semiconductor roadmap with global media.

 

Additionally, DEEPX has been selected as a featured participant in CES Foundry, CTA’s newly launched studio program focused on AI and quantum technologies. The Foundry brings together innovators, investors, and policymakers, with DEEPX joining industry leaders like AMD and NVIDIA in featured sessions.

DEEPX Unveils Vision as a “Physical AI Infrastructure Company” at CES 2026

(Photo 1) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025
• Ultra-Low-Power AI Semiconductors to Redefine Global AI Infrastructure Landscape

• Next-gen 2nm AI chip DX-M2 and Open-Source Physical AI Alliance to be unveiled

• DEEPX technology drives Sixfab to win CES “Best of Innovation Award”, proving its role as a core AI infrastructure enabler

• Exclusive "CES Foundry" Event on Jan 8 to Feature Global Leaders from Hyundai Motor Group, Baidu, and Ultralytics

DEEPX, a global leader in ultra-low-power, high-performance AI semiconductors, announced today that it will unveil its strategic vision to become a foundational “Physical AI Infrastructure Company” at CES 2026 in Las Vegas.

 

At CES 2026, DEEPX will present a new paradigm for AI infrastructure—one designed for the physical world. As AI expands beyond data centers into robots, mobility, smart cities, factories, and intelligent devices, DEEPX positions itself at the core of this transformation with energy-efficient, real-time AI semiconductors purpose-built for Physical AI.

 

Much like Arm reshaped the CPU industry through low-power innovation, DEEPX aims to establish a new global standard for Physical AI by delivering ultra-efficient AI accelerators. DEEPX enables intelligence to operate reliably and sustainably in real-world environments, addressing the critical constraints of power, heat, and cost.

 

DEEPX’s technology leadership has already been validated in the global market. In addition to winning two CES Innovation Awards in the Computing Hardware and Embedded Technologies categories, DEEPX-powered solutions have achieved the industry’s highest recognition. Notably U.S.-based partner Sixfab received the CES Best of Innovation Award for its ALPON X5 AI Gateway, powered by DEEPX’s first-generation AI chip, DX-M1. This success serves as a testament to DEEPX’s solutions being more than just a component supply; they are recognized as a core engine and a game changer that elevates global partners’ products to a world-class level.

 

DEEPX will host a dedicated booth at the Las Vegas Convention Center (LVCC), North Hall – AI & Robotics Zone (#8945). The exhibit will showcase real-world deployments of AI semiconductors across robotics, drones, factory automation, retail, and intelligent infrastructure, proving that Physical AI has moved beyond concept and into commercial-scale deployment.

At the booth, DEEPX will showcase performance targets for its next-generation DX-M2 AI chip, built on an advanced 2nm process. The DX-M2 is designed as a foundational infrastructure chip for the Physical AI era, solving the fundamental power and scalability limitations of data-center-centric architectures.

Furthermore, DEEPX will launch its Open-Source Physical AI Alliance, formed in collaboration with leading AI software ecosystems including Baidu PaddlePaddle and Ultralytics’ YOLO community. This initiative reflects DEEPX’s strategy to tightly integrate hardware and software, accelerating global adoption of Physical AI through open, developer-friendly platforms.

 

Key CES 2026 Events Hosted by DEEPX

 

1. Media Briefing
January 6, 2026 | LVCC South Connector S231 | 16:15 PM
DEEPX will present its next-generation ultra-low-power AI technologies and global partner expansion strategy, outlining a new industry standard for Physical AI infrastructure.

 

2. CES Foundry: Unstoppable Rise of Physical AI, Intelligented by DEEPX
January 8, 2026 | Fontainebleau Las Vegas, Azure Ballroom (Level 4) | 10:30 AM
An exclusive DEEPX-hosted forum featuring global leaders from Hyundai Motor Group Robotics Lab, Baidu, Wind River, Ultralytics, and the Edge AI Foundation. The session will explore real-world challenges and collaborative pathways for scaling Physical AI across industries.

 

“CES 2026 marks a pivotal moment for DEEPX—not just showcasing technology achievements, but demonstrating how Physical AI becomes real infrastructure through global partnerships,” said Lokwon Kim, CEO of DEEPX.

(Photo 1) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025

(Photo 1) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025

(Photo 2) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025

CES 2025

DEEPX Signs Strategic Partnership with Avnet Silica, Accelerating Expansion into theEMEA

 
  • DEEPX to expand the supply of ultra-low-power NPUs across Europe, the Middle East, and Africa through Avnet’s global distribution network.
  • Delivering South Korean AI semiconductor innovation to core European industries, including smart cities and robotics.

DEEPX, a pioneer in ultra-low-power on-device AI semiconductors, today announced the signing of a new franchise agreement with Avnet Silica, the semiconductor specialist division of Avnet (NASDAQ: AVT), a leading global technology distributor. This strategic partnership marks the full-scale launch of DEEPX’s expansion into the European market.


This collaboration combines DEEPX’s world-class low-power, high-performance AI semiconductor technology with Avnet Silica’s extensive global supply chain to proactively address the rapidly growing demand in the Edge AI market.


Engineers across Europe’s industrial sectors face a critical challenge: delivering high-performance AI computing within strict power and thermal constraints. Traditional microcontrollers (MCUs) often lack the necessary performance, while GPUs consume too much power for widespread edge deployment.


Through this partnership, DEEPX positions itself as the solution to bridge this technological gap. Customers across the EMEA (Europe, Middle East, and Africa) region can now easily access DEEPX’s NPU solutions through Avnet Silica’s distribution network. The adoption of DEEPX chips is expected to accelerate, particularly in high-performance embedded applications such as smart city infrastructure, autonomous mobile robots (AMRs), machine vision, and smart factories.


“We are continually focused on helping our customers bridge the gap between high-performance AI demands and the realities of constrained power budgets at the Edge,” said Michael Uyttersprot, Manager System Solutions, AI/ML & Vision System Solutions at Avnet Silica. “DEEPX delivers the essential NPU architecture and efficiency required to deploy sophisticated models in power- and thermal-sensitive environments, significantly enhancing the options across our existing linecard.”

 

“We are excited to partner with Avnet, a world-class technology distributor with deep expertise in bringing cutting-edge solutions to market,” said Tim Park, Strategy Marketing Director at DEEPX. “ By combining Avnet’s global reach and design support capabilities with  DEEPX’s ultra-efficient Edge AI NPUs, we will help customers build AI systems that are more scalable, more sustainable, and easier to deploy. Together, we aim to accelerate the shift from data center-centric AI to a new era of Physical AI at the edge.”

 

Starting with this agreement, DEEPX plans to broaden its touchpoints with local customers
through major industrial exhibitions and technical seminars in Europe, further solidifying its
position in the global AI semiconductor market.

 

DEEPX in AVNET Product Shop: View URL Link

South Korea’s DEEPX to supply AI chips for Baidu’s drones and robots

South Korean AI semiconductor developer DeepX has struck a deal to supply chips for Chinese tech giant Baidu, targeting applications in drones and robotics.

The partnership will integrate DeepX’s processors with Baidu’s PaddlePaddle open-source deep learning framework to co-develop AI solutions for global industrial markets.
According to Yonhap News Agency and TheElec, Baidu said the agreement will broaden edge AI applications from optical character recognition (OCR) in documents and images to autonomous aerial and robotic systems.

Performance rivals Nvidia, with lower power draw
DeepX’s DX-M1 AI chip is now fully compatible with the fifth-generation PP-OCR model on PaddlePaddle. Baidu said the jointly developed recognition system outperformed Nvidia’s GeForce RTX 2080 Ti in key benchmarks, delivering superior performance and energy efficiency.
The chip’s low-power, high-performance profile makes it well-suited for battery-constrained industrial AI devices such as inspection robots, equipment monitors, and automated document processors, enabling faster, more accurate, and longer-lasting operations.
Baidu plans to deliver the DX-M1 to around 20 customers, including drone manufacturers, with mass production to follow initial orders. The companies aim to extend their collaboration beyond OCR into a broader range of physical AI applications.

Next-gen chips for Baidu’s ERNIE 4.5
The two firms have also begun proof-of-concept testing of DeepX’s upcoming DX-M2 chip with Baidu’s large vision model (VLM) ERNIE 4.5. Early results show that ERNIE 4.5 maintains high accuracy while operating stably in ultra-low-power environments.
Because DeepX’s semiconductors are designed for edge computing rather than large-scale AI training servers, the products fall outside the scope of US export restrictions on China-bound AI chips.

News Source – https://www.digitimes.com/news/a20250812PD207/deepx-baidu-industrial-chips-ocr.html

DEEPX and Wind River to Advance Mission-critical Edge AI

windriver

DEEPX, a pioneering on-device AI semiconductor company, and Wind River, a global leader in delivering software for the intelligent edge, have collaborated on a hardware and software solution for next-generation edge AI.

 

The partnership combines DEEPX’s on-device AI semiconductors with Wind River’s VxWorks® real-time operating system (RTOS) and Wind River® Helix™ Virtualization Platform to help advance solutions for mission-critical industries such as aerospace, defense, industrial, and robotics.

 

“Edge AI is on a path to unlock incredible opportunities across a diverse range of industries. Together with Wind River’s long heritage in software for markets that are highly dependent on safety, security, reliability, and edge expertise, DEEPX can provide customers with innovative edge AI platforms that deliver exceptional performance, cost, and power efficiency,” said Lokwon Kim, CEO, DEEPX.

 

“The growth of real-time physical AI is creating immense potential for mission-critical environments while also presenting new, complex challenges. The collaboration between DEEPX’s advanced AI semiconductors and Wind River’s proven edge technologies will help advance AI to deliver tremendous outcomes across applications and industries,” said Avijit Sinha, Senior Vice President, Strategy and Global Business Development, Wind River.

 

With the enablement of DEEPX’s neural processing units (NPUs) on Wind River technologies, companies can easily add accelerated AI to their real-time or edge systems, at lower cost. DEEPX and Wind River work to deliver a pre-validated solution stack that addresses safety and security issues, helping companies significantly reduce complexity and development cycles.

 

A leader in on-device AI, DEEPX develops advanced AI semiconductors that optimize performance, reduce power consumption, and enhance cost efficiency across various industries, including smart camera modules, smart mobility, smart factories, consumer electronics, smart cities, surveillance systems, and AI servers. DEEPX’s cutting-edge AI chips are engineered for maximum efficiency and effortless integration into any device.

 

Market-leading VxWorks is the industry’s most trusted and widely deployed RTOS for mission-critical systems that must be secure and safe. The first commercial RTOS to support Open Container Initiative (OCI)–compliant containers, VxWorks enables companies to rapidly deploy new software-defined capabilities. Helix Platform is a hypervisor solution that enables engineering teams to consolidate multiple systems onto a single high-performance embedded system. It streamlines safety certification, reduces project risk, and accelerates time-to-market.

 

DEEPX and AIC sign strategic MOU at Computex

 

DEEPX, an innovator at the forefront of ultra-efficient on-device AI semiconductor technology, has announced a strategic partnership with AIC Inc., a global leader specializing in enterprise storage and server solutions. The partnership, formalized through a Memorandum of Understanding (MoU) at Computex Taipei 2025, is set to redefine AI capabilities in edge computing markets.

 

The official signing ceremony on May 21 at AIC’s booth unveiled ambitious plans to integrate DEEPX‘s advanced Neural Processing Units (NPUs) with AIC’s robust industrial-grade server platforms. This collaboration aims to deliver unprecedented computational power combined with significant energy efficiency and compact form factors tailored specifically for edge environments. Notably, the jointly developed servers—such as the AIC CB201-CP model equipped with eight DEEPX DX-H1 AI accelerators—have already met the stringent specifications required by major enterprise customers in the technology sector. This particular solution is currently undergoing verification as an on-premise AI server in collaboration with a leading South Korean IT conglomerate, demonstrating readiness for deployment in demanding commercial environments.

 

Through close collaboration, DEEPX and AIC will develop innovative AI-optimized hardware solutions, including reference architectures and demonstrative systems. These offerings will cater directly to global system integrators and OEM partners demanding reliable, scalable, and economically viable AI solutions at the edge. Target applications include smart retail analytics, industrial automation processes, intelligent surveillance systems, and edge data center operations. Additionally, this partnership enables DEEPX to enter new markets such as Media & Entertainment, broadening its reach and creating new growth opportunities.

 

This partnership aligns strategically with DEEPX’s ongoing global expansion and ecosystem-building efforts. By leveraging AIC’s deep-rooted expertise in system integration and its extensive global manufacturing capabilities, DEEPX is positioned to further democratize access to high-performance AI solutions, ensuring their applicability and practicality across diverse real-world scenarios.

 

Immediate plans involve rapid validation of integrated systems and accelerated joint engagements with key international customers. The combined strengths of DEEPX’s semiconductor innovation and AIC’s server expertise promise transformative AI solutions that respond directly to the surging demand for secure, scalable, and power-conscious AI deployments in surveillance, industrial, and edge computing environments. 

 

 

DEEPX and Nota AI sign MOU at Computex

 

DEEPX (CEO Lokwon Kim), a leading developer of ultra-low-power on-device AI semiconductors, and Nota AI (CEO Myungsu Chae), an expert in AI model optimization and on-device generative AI, have signed a strategic Memorandum of Understanding (MOU) at Computex Taipei 2025, the world’s largest ICT exhibition. This partnership aims to strengthen their global position in the rapidly growing on-device AI market.

 

Under the agreement, the two companies will co-develop AI solutions that combine DEEPX‘s advanced Neural Processing Units (NPUs) with Nota’s lightweight AI models, enabling high-performance AI functionality even in ultra-compact, power-constrained devices. These joint solutions will serve as proof-of-concept models for applications in industrial robotics, smart appliances, security systems, mobility platforms, and more—accelerating market penetration both in Korea and globally.

 

As part of the collaboration, DEEPX will provide its NPU SDKs and development kits to support the optimized integration of lightweight AI models. Nota AI will design and fine-tune application-specific models to meet diverse industry requirements. The partnership also includes co-marketing efforts, joint participation in global trade shows, and active engagement with B2B customers worldwide through proof-of-concept deployments.

 

“This agreement will be an important collaboration to expand the on-device AI ecosystem,” said Lokwon Kim, CEO of DEEPX. “By combining the strengths of both on-device AI hardware and software, we will strive to bring competitive AI solutions to the global market.”

 

“Our strategic partnership with DEEPX combines Nota AI’s proprietary AI optimization technologies with DEEPX’s world-class AI hardware innovation, positioning us as leaders in the global on-device AI market,” said Nota AI CEO Myungsu Chae. “Together, we will accelerate the deployment of optimized AI across a range of industrial applications.”

 

This MOU highlights the growing global recognition of Korean innovation in on-device AI technology, signaling a new phase of international expansion for domestically developed AI solutions.

 

DEEPX ramps up mass-production chip supply for the global market, bolstering tangible business expansion


AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.

Last month at CES 2025 – one of the world’s largest electronics trade shows – DEEPX was recognized as a “must-visit company” by the event’s organizer, the Consumer Technology Association (CTA), shining a spotlight on the global market. During the show, over 16,000 visitors stopped by the DEEPX booth, resulting in more than 100 requests for mass-production chip samples—strong indicators of the company’s expanding commercial prospects.

During CES, DEEPX showcased various applications of its chips in edge devices for smart cities, smart factories, and robotics, as well as in industrial equipment and edge servers for global enterprises. Demonstrations and on-site meetings were held with a wide range of customers and partners from the United States, Taiwan, Japan, and Europe. In addition, major Korean corporations, government officials, and investors visited the booth on tours to get a firsthand look at DEEPX’s technological strengths.

Among the highlights, DEEPX successfully ran its first-generation mass-production chips using AI algorithms developed by:

– Hyundai-Kia Motor Robotics Lab (robot platform)
– Inventec (smart factory)
– POSCO DX (smart factory & logistics automation)
– LG U+ (industrial and urban security)

This demonstration underscored the critical role of on-device AI semiconductors – beyond cloud-based approaches – in ushering in a new era of AI.

DEEPX also directly compared its solution to NVIDIA’s Jetson Orin, a GPU-based edge platform, demonstrating approximately 10 times the power efficiency and 20 times the price/performance efficiency of its own NPU-based product. By also conducting a ‘butter benchmark’ test against other leading global NPU technologies, DEEPX demonstrated its advantage in power efficiency, thermal management, and operational stability – critical factors for on-device AI.

To illustrate its broad compatibility, DEEPX showcased integrations with application processor (AP) systems-including NXP, Renesas, TI, Broadcom, Rockchip, and Intel-as well as small form factor computing solutions such as the popular Raspberry Pi. The company also demonstrated interoperability with partner industrial PCs and leading workstation and server systems from HP, Dell, Supermicro, Lenovo, Inventec, and others, highlighting the versatility and scalability of its solution.

Looking ahead, DEEPX will partner with LG U+ at MWC (Mobile World Congress) in Barcelona from March 3 to demonstrate on-device AI solutions powered by its first-generation chip. DEEPX will also host its own booth to showcase the roadmap for its DX-M2 on-device AI semiconductor, designed for large language models. Following MWC, DEEPX will head to Embedded World on March 11 in Nuremberg, Germany, where its products will be showcased at partner booths – including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, and Network Optix – as well as DEEPX’s own stand. The company will conduct additional live demos and meet with potential customers to explore new business opportunities.

News Source-(CTA) What Not to Miss at CES 2025