A Four-chip
Strike Package
Four AI semiconductor-based products
to cover a wide range of AI Applications
Drop & Play™ DXNN
Software Development Kit
A comprehensive Software Development Kit
for DEEPX’s four AI chips
What we offer
Custom NPU
Design Service
Fully specialized NPU design service
for customer products
What we offer
NPU IP
Licensing
One of the most efficient NPU design IPs
for various customer applications
What we offer
SoC ASIC For
The Edge Devices
Commercial chip based solutions using DEEPX NPU
DEEPX
Technology
Strengths
State-of-the-art
DNN Algorithm
Support
Outstanding
AI Processing Performance
and Power efficiency
Memory Bandwidth
Footprint Optimization
Silicon-proven
Scalable Architecture
All-in-4 Edge
AI Total Solution
Unapparelled
Cost-Competitiveness
news
-
- Press release
-
DEEPX - POSCO DX to collaborate on developing AI semiconductor-based factory automation solutions
-
-
DEEPX's AI semiconductor technology into POSCO DX's factory automation and intelligent logistics equipment control system
-
During the preliminary technical verification process DEEPX distributed a software development kit (SDK) called "DXNN", which includes the DEEPX compiler, and received recognition for the superior accuracy and performance
-
Through collaboration, DEEPX will build a crucial foundation for leading the future smart factory market by automating the processing of ten thousands of camera data simultaneously
On April 6th, Yoon Ilyong, the Executive Director of POSCO DX Technology Research Institute, participated in a commemorative photo session after signing a business agreement with Kim Lokwon, the CEO of DeepX, for the commercialization of AI solution technology using AI semiconductors in various industrial fields such as manufacturing, robotics, logistics, and safety. The event took place at the POSCO DX Pangyo Office in Bundang-gu, Seongnam, Gyeonggi Province.
On April 6th, DEEPX announced that it has signed a business agreement with POSCO DX, a subsidiary of POSCO, to develop factory automation solutions using artificial intelligence (AI) semiconductors. The two companies plan to jointly develop AI solutions that automate industrial site operations by integrating DEEPX's AI semiconductor technology into POSCO DX's factory automation and intelligent logistics equipment control system called "PosMaster." The goal is to validate the AI capabilities embedded in DEEPX's AI system-on-chip (SoC) for use in smart factories and to expand the scope of application after verifying its performance and mass production potential. During the preliminary technical verification process with POSCO DX, DeepX distributed a software development kit (SDK) called "DXNN", which includes the DEEPX compiler, and received recognition for the operability of its hardware and software. It has been evaluated as a suitable solution for automation in industrial sites due to its high AI computational performance efficiency compared to power consumption. Established in 2018, DEEPX has obtained more than 150 domestic and international patents related to AI semiconductor core technologies. It is known for having top-level technology in neural network processing units (NPUs) optimized for AI model inference. It also possesses four types of AI semiconductors optimized for various edge and server AI applications. Kim Lokwon, CEO of DEEPX, stated, "Through collaboration, we will build a crucial foundation for leading the future smart factory market by automating the processing of 20,000 camera data simultaneously from POSCO Steelworks." Yoon Ilyong, Executive Director of POSCO DX's Technology Research Institute, commented, "The integration of POSCO DX's AI software (SW) and control fusion technology with AI semiconductors optimized for deep learning presents a significant collaborative opportunity to build an integrated automation and unmanned system. It is expected to contribute to ESG (Environmental, Social, and Governance) management by reducing power consumption." -
- 2023.08.22
-
- Press release
-
DEEPX, the First AI Semiconductor Company to Receive the Presidential Commendation on 'Inventors Day'
-
-
DEEPX was recognized for its development of world-class AI semiconductor hardware and software technologies and its contribution to securing more than 157 patents future core technologies necessary for the Korean system semiconductor industry
-
They actively pursued the patent rights of core technologies and implemented the employee invention system to protect and encourage employee inventions
-
Kim Lokwon, the CEO of DEEPX, stated, "We will continue to secure leading-edge core technologies in AI semiconductors and make our best efforts to enhance the competitiveness of system semiconductor technology, which is a future driving force for our country
Kim Nokwon, the CEO, is being awarded a commendation by President Yoon Seokyeol
DEEPX, a Korean artificial intelligence (AI) semiconductor startup, announced on the 12th that it received the "Presidential Commendation for Inventors' Encouragement," the highest award in the group category, at the 58th Inventors' Day commemorative ceremony. This is the first time an AI semiconductor company has received the Presidential Commendation for Inventors' Day. The Korean Intellectual Property Office identifies and rewards inventors who have made significant contributions to the advancement of the nation's industries through invention promotion every year on Inventors' Day. At the ceremony held at COEX in Seoul, DEEPX was recognized for its development of world-class AI semiconductor hardware and software technologies and its contribution to securing future core technologies necessary for the Korean system semiconductor industry. As a result, they received the highest award in the group category. The system semiconductor industry is dominated by the technologically advanced United States, which hold over 68% of the core technology patents, while domestic industries have been dependent on foreign technologies, paying astronomical royalties for decades. DEEPX aims to secure core technology for AI semiconductors and independently develop world-class products. DEEPX is developing core technologies for AI semiconductor and computing solutions that support various edge devices powered by batteries such as smart cameras, smart robots, smart mobility, and autonomous vehicles. They are targeting the global AI semiconductor market and have filed patents in Korea, the United States, and China. As of May 12th, they hold 157 technology patents. To standardize AI system technology for video processing, DEEPX became the first Korean company to participate in the international MPEG-VCM (Video Coding for Machines) group, actively seeking to secure video processing standard technologies required for low-power AI semiconductors and exploring global market dominance. Furthermore, from the early stages of its foundation, DEEPX has secured patent-dedicated personnel to protect the core technology of AI semiconductors and computing solutions. They actively pursued the patent rights of core technologies and implemented the employee invention system to protect and encourage employee inventions, thereby enhancing employees' research and development enthusiasm. With this contribution, DEEPX obtained certification as an excellent company in employee inventions in 2020. Kim Lokwon, the CEO of DEEPX, stated, "DEEPX has pursued continuous technological innovation through the establishment of an advanced R&D system since its foundation. Research achievements have been filed for patent applications, and the core foundational technologies have undergone patent valuation to establish an intellectual property infrastructure, aiming to certify new technologies and generate intellectual property assets. We will continue to secure leading-edge core technologies in AI semiconductors and make our best efforts to enhance the competitiveness of system semiconductor technology, which is a future driving force for our country. -
- 2023.08.22
-
- Press release
-
DEEPX and Hyundai Motor Company and Kia Corporation are collaborating on AI semiconductor-based Robot Platforms
-
-
Both companies will strategically cooperate in embedding AI chips into robot platforms
-
For the past year in the process of examining in advance, various AI algorithms for robots were operated to check for the latest AI algorithm support, excellent AI accuracy, and high computing efficiency of the DEEPX NPU
-
"This will be an opportunity for DEEPX's AI semiconductor to become the mass-production ready core solution in the global smart mobility market"
On the 24th (Friday) at the Uiwang Research Facility of Hyundai Motors & Kia Corporation, DEEPX announced its conclusion of an MOU on AI semiconductor load for robot platforms, with the representatives of both companies including Kim, Lokwon, CEO, and Hyun, Dong-jin, Robotics lab leader of Hyundai Motors & Kia Corporation present.
DEEPX will cooperate technology development with Hyundai Motor Company and Kia Corporation for on-device AI technology for robot platforms. On the 24th (Friday) at the Uiwang Research Facility of Hyundai Motors & Kia Corporation, DEEPX announced its conclusion of an MOU on AI semiconductor load for robot platforms, with the representatives of both companies including Kim, Nok-won, CEO, and Hyun, Dong-jin, Robotics lab leader of Hyundai Motors & Kia Corporation present. DEEPX develops AI semiconductor for on-device AI computing, and implements AI technology to various electronic devices that exists outside of the data center at high-performance and low-power. Currently they possess 4 kinds of AI semiconductors that are optimized for performance and function that can match with various edge and server AI application fields, and have secured more than 150 patents, both domestic and international, that are related to AI semiconductor source technology. Domestically, they are evaluated as the leading AI semiconductor fabless company, and are targeting the global edge AI market. For the past year, DEEPX has proceeded with advance technology examination with the robotics lab of Hyundai Motors and Kia Corporation, and the AI accuracy provided by them was in no way inferior to the robotics lab's existing GPGPU, proving the excellency of their AI technology. It managed to operate various robot application AI algorithms self-developed by robotics lab flawless, thus proved they could implement an AI model needed by robots. They have been evaluated as suitable to mass-produce battery-powered robot products with their extraordinarily high AI computing performance efficiency. The purpose of this agreement is for the agreement of technology to apply DEEPX's AI semiconductor technology to the robot platform which is under development by Hyundai Motors and Kia Corporation for commercialization. Both parties will examine the operation ability and mass-productivity by loading the AI function that will be used for robots on the DEEPX's AI SoC (System on Chip) product, and to mount on the mass produced product, and ultimately implement the said AI technology on the robot that will be developed by the robotics lab. Kim, Lokwon, CEO commented: “According to the global market research agency, the size of the global smart mobility is expected to grow to be 144.54 billion dollars by the year 2027. For the AI semiconductor, the core technology of this market, currently there are no optimized solutions for each detailed fields, therefore it is possible to lead the market if a mass-producible solution is prepared. To have a technology cooperation with Hyundai Motors and Kia Corporation, who are expected to lead the global market, will present DEEPX's AI semiconductor an opportunity to become the core solution of the future market in the related field, which is a great inspiration for us. DEEPX has succeeded in commercializing NPU IP in 2021, and I am grateful to earn the chance for demonstration test for mass-production as soon as we developed NPU chip this year.” Hyun, Dong-jin, Robotics lab leader of Hyundai Motors & Kia Corporation said, “I expect we could lead the excellent robotics service development both performance- and price-wise by combining the SW technology of robotics lab and DEEPX's HW technology.” He went on, “As soon as we confirm and examine the superiority of DEEPX NPU that have been produced as chip, we will carry on with further cooperation and apply it to the robot that is under research and development.” -
- 2023.08.10
-
- Press release
-
딥엑스, 현대차∙기아와 로봇 플랫폼용 AI 반도체 탑재 협력
-
-
온디바이스 AI 기술을 탑재한 로봇 플랫폼을 위해 양사 전략적 기술 협력
-
지난 1년간 사전 기술 검증 과정에서 다양한 로봇용 AI 알고리즘을 구동하여 딥엑스 NPU의 최신 AI 알고리즘 지원, 우수한 AI 정확도, 높은 연산 효율 확인
-
"전세계 스마트 모빌리티 시장에서 딥엑스의 AI 반도체가 양산 가능한 핵심 솔루션으로 자리잡는 기회가 될 것”
<사진 설명>딥엑스는 24일(금) 현대차∙기아 의왕연구소에서 딥엑스 김녹원 대표이사, 현대차∙기아 현동진 로보틱스랩장 등 양사 관계자들이 참석한 가운데 현대차그룹과 ‘로봇 플랫폼용 AI 반도체 탑재를 위한 업무협약(MOU)’을 체결했다고 밝혔다.
딥엑스가 로봇플랫폼용 온디바이스 AI 기술을 위해 현대자동차∙기아와 기술 개발을 협력한다. 딥엑스는 24일(금) 현대차∙기아 의왕연구소에서 김녹원 대표이사, 현동진 현대차∙기아 로보틱스랩장 등 양사 관계자들이 참석한 가운데 현대차∙기아와 로봇 플랫폼용 AI 반도체 탑재를 위한 업무협약(MOU)을 체결했다고 밝혔다. 딥엑스는 온디바이스 AI 컴퓨팅을 위한 AI 반도체를 개발하는 회사로서, AI 기술을 데이터센터 밖에 존재하는 다양한 전자기기에 고성능저전력으로 구현할 수 있다. 현재다양한 엣지 및 서버 AI 응용 분야에 맞춰 성능과 기능이 최적화된 AI 반도체 4종을 보유하고 있고 AI 반도체 원천기술과 관련한 국내외 특허도 150여개 이상 확보한 상황이다. 국내에서는 대표적인 AI 반도체 팹리스로 평가받으며 글로벌 엣지 AI 시장을 목표로 한다. 딥엑스는 지난 1년여간 현대차∙기아 로보틱스랩과 진행된 사전 기술 검증 과정에서 로보틱스랩이 기존에 사용하던 GPGPU와 비교해도 손색없는 AI 정확도를 제공해 AI 기능의 우수함을 입증했다. 또한 로보틱스랩이 자체 개발한 다양한 로봇 응용 AI 알고리즘들을 원활하게 구동함으로써 로봇이 필요로 하는 AI 모델이 구현 가능하다는 것도 증명하였다. 특히, 인공지능 연산 성능 효율이 월등히 높아 배터리로 구동되는 로봇 제품의 양산에 적합할 것으로 평가받았다. 이번 협약은 현대차∙기아에서 상용화를 목표로 개발 중인 로봇플랫폼에 딥엑스의 AI 반도체 기술을 적용하기 위한 기술 협력을 목표로 한다. 이를 위해 양사는 로봇에 사용될 AI 기능을 딥엑스의 AI SoC(System on Chip) 제품에 탑재하고 양산 제품에 실장하기 위해 구동성 및 양산성을 검증해 최종적으로 로보틱스랩이 개발하는 로봇에 해당 AI 기술을 구현할 것이다. 김녹원 대표이사는 “글로벌 시장 조사기관에 따르면, 2027년 전세계 스마트 모빌리티 시장의 규모가 1,445억 4천만 달러 성장할 것으로 전망한다. 반면 이 시장에 핵심 기술인 AI 반도체는 세부 분야 별로 최적화된 솔루션이 부재한 상태로, 양산 가능한 솔루션이 준비되면 시장을 선도할 수 있는 상황이다.”라며 “글로벌 시장을 리드할 것으로 예상되는 현대차∙기아와의 기술 협력은 딥엑스의 AI 반도체가 해당 분야의 미래 시장에서 핵심 솔루션으로 자리잡게 되는 기회가 될 것으로 기대되어 매우 고무적이다. 딥엑스는 2021년 NPU IP를 상용화한데 이어서 올해 NPU 칩을 제작하자마자 양산성에 대한 실증 테스트의 기회를 얻게 되어 감사하게 생각한다.”고 말했다. 현대차∙기아 로보틱스랩 현동진 상무는 “로보틱스랩의 SW 기술과 딥엑스의 HW 기술을 결합하여 성능과 가격 면에서 우수한 로보틱스 서비스 개발을 선도할 수 있을 것으로 기대한다”고 밝히며, “칩으로 제작된 딥엑스 NPU의 우수성에 대한 확인과 검토 후에 추가 협력과 연구개발 중인 로봇에 활용할 계획이다.”고 전했다. -
- 2023.03.30
-
- Press release
-
딥엑스, AI 스마트가전 상용화에 앞장선다
-
- 딥엑스가 독자 개발한 시스템 반도체를 400여개의 광주지역 가전기업에 제공, 일반 가전에 추론과 제어기능을 탑재한 AI 스마트가전 제작 예정
- 딥엑스의 국산 시스템 반도체 원천기술을 국내 가전기업에 제공해 글로벌 시장에 진출할 수 있도록 기술 혁신 및 경쟁력 강화 가능
(주)딥엑스(대표 김녹원, 이하 딥엑스)가 AI 반도체 개발 기업 중 최초로 일반 가전에 추론기능과 제어기능을 탑재해 스스로 최적의 성능을 발휘할 수 있는 AI 스마트가전 상용화에 앞장선다. 딥엑스는 광주광역시와 (재)광주테크노파크가 지원하는 ‘AI가전사업 육성을 위한 상용화 지원플랫폼 구축사업’에 AI 반도체 및 보드 개발 지원 업체로 최종 선정되었다. 이 사업을 통해 딥엑스가 독자 개발한 NPU(Neural Processing Unit) 기반 시스템온칩을 400여개의 광주지역 가전기업에 제공해 실환경모사 테스트베드 진행 후 시제품을 제작할 계획이다. 400여개의 가전기업에 제공될 딥엑스의 NPU는 낮은 전력 소모를 가지고 높은 AI 연산처리 성능을 제공하는 인공지능 응용을 위한 시스템 반도체로, 딥엑스가 독자 개발한 하드웨어와 소프트웨어의 원천기술이 응집되어 있다. EfficientNet, Yolov7, PIDNet 등 최첨단 AI 알고리즘 연산 처리를 지원하고, 세계 최고 수준의 실효 AI 추론 연산 성능(FPS/TOPS)을 제공하며, 최신 AI 알고리즘의 연산 결과인 인공지능 정확도는 GPU 수준으로 확보하여 글로벌 엣지 NPU 시장에서 경쟁력과 기술력을 갖추었다. 또한 딥엑스의 NPU는 데이터 처리량이 적은 초소형 센서부터 최고 성능의 AI 알고리즘 연산을 요구하는 자율주행차, 추론형 AI 서버까지 체급별 AI 연산 성능과 다양한 기능 조합이 가능한데, 이를 위해 올해 하반기부터 고효율·고성능·고품질의 AI 프로세서 제품 4종을 삼성 파운드리 5나노, 14나노, 28나노 공정에서 각각 제작한다. 각각의 제품은 초당 2조 4000억번 연산(2.4TOPS)이 가능한 AI 기능으로 단일 카메라 영상을 처리하는 DX-L1, 6.4TOPS로 카메라 3대의 영상 정보를 처리할 수 있는 DX-L2, 카메라 10대 이상을 처리할 수 있는 30TOPS의 DX-M1, 28POPS(초당 경번 처리)로 동시에 1만대 카메라를 AI 기반으로 처리하는 DX-H1다. 이로써 AI 응용에 필요한 모든 AI 프로세서 요구에 대한 대응이 가능하다. 딥엑스의 김녹원 대표는 “광주시가 AI 혁신 거점으로 AI 기업들을 지원하기 위해 공공부문에서 서버용과 엣지용 NPU 기반 응용에서 실증 테스트 베드를 구축하고 시장에 제품을 출시할 수 있도록 견인차 역할을 해주고 있다.”며 “이번 딥엑스와 광주시의 협력을 통해 스마트 가전 뿐만 아니라 향후 다른 엣지 응용 분야와 데이터센터 서버 등 다양한 AI 반도체 혁신 제품을 출시하고 시장에서 경쟁력을 갖추는 기반을 마련할 것이다.”라며 기대감을 표했다. 딥엑스의 비전은 서버 안에만 갇혀 있던 AI 연산 처리를 웨어러블, 집 안, 자동차 안, 추론형 AI 서버 등 일상생활의 반경으로 끌어와 ‘도처에 존재하는 AI(Pervasive AI 또는 Ubiquitous AI)’를 실현하는데 기여하는 것이다. 김 대표는 “이번 AI 스마트가전 상용화 사업을 통해 유비쿼터스 AI 시대의 초석을 마련할 수 있게 됐다. 딥엑스는 NPU 시장에서 세계 최고의 기술 경쟁력을 확보하여 모든 AI 반도체 응용 분야에 도전할 것”이라고 강조했다. - 2022.09.07