A Four-chip
Strike Package
Four AI semiconductor-based products
to cover a wide range of AI Applications
Drop & Play™ DXNN
Software Development Kit
A comprehensive Software Development Kit
for DEEPX’s four AI chips
What we offer
Custom NPU
Design Service
Fully specialized NPU design service
for customer products
What we offer
NPU IP
Licensing
One of the most efficient NPU design IPs
for various customer applications
What we offer
SoC ASIC For
The Edge Devices
Commercial chip based solutions using DEEPX NPU
DEEPX
Technology
Strengths
State-of-the-art
DNN Algorithm
Support
Outstanding
AI Processing Performance
and Power efficiency
Memory Bandwidth
Footprint Optimization
Silicon-proven
Scalable Architecture
All-in-4 Edge
AI Total Solution
Unapparelled
Cost-Competitiveness
news
- Press release
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DEEPX Honored with Three CES Innovation Awards 2024 for Leading-Edge AI Chip Tech
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DEEPX is honored with three CES Innovation Awards 2024 in its core focus areas: Computer Hardware, Embedded Technology, and Robotics
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The brand is a fabless AI chipmaker with world-leading innovation in cutting-edge source technologies — specifically ultra-gap source technology
DEEPX (CEO, Lokwon Kim), an AI chipmaking startup, is announcing that its proprietary ultra-gap source technology for AI chips has been recognized with three CES Innovation Awards 2024 — in Computer Hardware, Embedded Technology, and Robotics — ahead of the January 2024 CES trade show in Las Vegas, Nevada. Join DEEPX at Booth #9069, North Hall during CES 2024 to experience the latest in AI chip technology and explore DEEPX’s Early Access Customer Program. As the world's largest electronics exhibition since 1967, CES’ Innovation Awards, organized by the Consumer Technology Association (CTA), have served as a global beacon for technological innovation. DEEPX is the first AI chip company in the world to be honored with CES Innovation Awards in all three categories, and the brand anticipates that the positive recognition from these awards will soon be shared more broadly, through expanding international partnerships and attracting further investment. The following DEEPX solutions were recognized: • Embedded Technology category: An "All-in-4 AI Total Solution" consisting of four AI chips optimized for AI capabilities and performance that can be applied to various embedded systems • Computer Hardware category: The DX-H1, a technology specialized in minimizing energy consumption in high-performance AI computation processing in servers and data centers to reduce carbon emissions • Robotics category: The DX-M1 module, which innovatively realizes the intelligentization of edge devices such as robots for unmanned industrial sites and social infrastructure as well as daily life Each of these solutions utilizes DEEPX's ultra-gap source technology, its core and independently developed technology. The brand’s AI chip source solutions offer the latest AI algorithm support technology for edge AI applications, GPU-level high AI accuracy, and the world's highest effective power-to-performance ratio. DEEPX is also the only AI chip company in the world to offer: an all-in-4 AI total solution consisting of four products optimized for various AI applications; technology that minimizes on-chip SRAM and off-chip DRAM usage requirements to minimize AI technology implementation costs; and DEEPX Software Development Environment (DXNNTM) technology that can unify and support four AI chip products for development of various AI applications. In addition, DEEPX is actively honing the cutting edge of AI chip technology and striving to lead the way — it currently has over 200 patents pending in the U.S., China, and Korea, the most in the world for edge AI chip development. "DEEPX set out from the start to dominate the global market by developing the world's best AI chip source technology, and, through hard work and dynamic innovation, we have already set the standard for AI chip technology,” remarked DEEPX CEO Lokwon Kim. “The fact that the first solution we developed — ultra-gap source technology — has been recognized with three CES Innovation Awards is an immense honor and a truly promising start. As we move forward, we will continue to challenge ourselves to constantly develop new technologies so that the name 'DEEPX' will be synonymous with 'the world's best original technology company'." DEEPX will showcase the winning source technologies and more at Booth #9069, North Hall during CES 2024, January 9-12, 2024, in Las Vegas, NV, as it leads the way in shaping the future with innovation. -
- 2023.11.17
- Press release
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DEEPX Drives Innovation in the Evolving Edge AI Landscape with its State-of-the-Art AI Chip Product Lineup
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July 14th, 2023, Seoul, Korea: DEEPX, a leading AI semiconductor technology company, aims to drive innovation in the rapidly evolving edge AI landscape with its state-of-the-art, low-power, high-performance AI chip product lineup. With a focus on revolutionizing application areas such as smart cities, surveillance, smart factories, and other industries, DEEPX unveiled its latest AI semiconductor solutions at the 2023 Samsung Foundry Forum (SFF), under the theme of "For AI Everywhere." Recognizing the importance of collaboration and technological partnerships, DEEPX leveraged Samsung Electronics' foundry processes, harnessing the power of 5nm, 14nm, and 28nm technologies for its semiconductor chip designs. As a result, the company has developed a suite of four high-performance, energy-efficient AI semiconductor products: DX-L1, DX-L2, DX-M1, and DX-H1. Each product has been specifically engineered to cater to the unique demands of various market segments, from ultra-compact sensors with minimal data processing requirements to AI-intensive applications such as robotics, computer vision, autonomous vehicles, and many others. One of the key differentiators of DEEPX's AI chip product line lies in their technological prowess. The chips deliver high-performance AI capabilities while ensuring power efficiency, computational efficiency, AI accuracy, and support for the latest AI algorithms. This technological advantage has propelled DEEPX to the forefront of the AI semiconductor industry, surpassing global competitors' NPU (Neural Processing Unit) technology. Furthermore, DEEPX's AI chips offer superior cost competitiveness compared to GPUs and other market solutions, creating a significant edge in the NPU field. With a global outlook, the company is actively targeting key markets in the United States, Taiwan, China, and Europe, with a goal to drive adoption and make its technology the preferred choice for Edge AI applications. Through strategic collaborations with industry leaders, including Hyundai-Kia Motors, POSCO DX, Jahwa Electronics, and Coasia Electronics, DEEPX is actively engaged in production verification, further solidifying its position as a leader in the AI semiconductor market. DEEPX offers comprehensive solutions, including scalable AI chip products, commercial module solutions, reference boards, software development kits (SDKs), and application software packages, empowering customers and contributing to the growth of the domestic and global AI semiconductor ecosystem. CEO Lokwon Kim expressed his vision for DEEPX's future, stating, "We aspire to lead the global market with our unparalleled core technology while making significant contributions to the growth of Korea’s domestic semiconductor ecosystem. Our goal is to maintain technological excellence at the highest global level for the next 10 to 15 years and establish DEEPX as the global standard in the AI semiconductor market." - 2023.11.10
- Press release
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DEEPX Honored with the Gold Innovator Award 2023 From Vision System Design Magazine
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DEEPX’s first-generation NPU IP, DX-GEN1, received the gold medal from Vision System Design’s Innovation Virtual 2023 award program
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DEEPX also opened its US subsidiary, DEEPX US, and celebrated by showcasing its technology at the Embedded Vision Summit
DEEPX, an industry-leading artificial intelligence semiconductor technology company, today announced that the company has received Vision System Design Magazine’s Innovation Virtual 2023 Gold Medal. This recognition confirms that DEEPX’s Neural Processing Unit (NPU) IP, DX-GEN1, is one of the most innovative products in the field of machine vision this year. The prestigious award was announced at 'The Automate Show 2023,' held May 22, 2023, in Detroit, MI, USA. As part of opening its US-based subsidiary, DEEPX US, the company also recently unveiled its physical products at the Embedded Vision Summit 2023 held in Santa Clara, CA, USA. DEEPX’s entire family of AI chips was developed using the company’s DX-GEN1 technology. Over 20 of these innovative AI technologies, including real-time demos based on these chips, were shown at DEEPX’s booth, leaving a lasting impression on numerous global company representatives, who praised DEEPX's edge AI and machine learning technologies. Upon winning the Innovation Virtual award, DEEPX has further solidified its reputation for ingenuity and innovation in the global market's focal point of machine vision technology. In response to the award, DEEPX’s CEO, Lokwon Kim, expressed his gratitude stating, "I am honored to have received this recognition, which demonstrates DEEPX's originality and innovation in the field of machine vision technology." DEEPX's AI products are low-power, high-efficiency AI processors designed to achieve an IPS (Inferences Per Second) per watt that is a 10x performance improvement over standard GPU performance. DEEPX’s goal is to maintain a competitive edge in the core technologies necessary to apply GPU-level advanced AI capabilities to resource-constrained devices, thereby contributing to global leadership in the field. DX-GEN1 highlights DEEPX’s leadership in the field of AI technology, including image classification, object detection, and scene segmentation. It offers scalability ranging from 2.4 TOPS for DX-L1 to 22 TOPS for DX-H1 with 2K/4K/8K MAC combinations, supporting the latest AI algorithms. DEEPX's NPU technology also boasts AI computational accuracy on par with, if not surpassing, GPUs. With optimized hardware and software design for edge devices, DEEPX provides the world's top-performing embedded AI solution, offering high performance, low power consumption, and cost-effectiveness. Its exceptional power efficiency sets it apart from other products, ensuring superior performance efficiency for IoT devices. In collaboration with its global customers, DEEPX is actively conducting validation work for mass production of all its products, including: • DX-L1, capable of processing video from a single camera using AI capabilities; • DX-L2, capable of simultaneously processing video information from three cameras; • DX-M1, designed for processing video from over ten cameras; and, • DX-H1, built for simultaneous processing of video from of more than ten thousand cameras. These AI accelerator chips are expected to be implement in various scenarios such as robotics, smart factory and smart camera (CCTV) applications. Linda Wilson, the chief editor of VSD, praised DEEPX on receiving the Gold Medal at the 2023 VSD Innovation Awards. She emphasized the significance of this award, stating, "Each year this unbiased and increasingly competitive program aims to celebrate the most innovative products and systems in machine vision." Wilson also said, "The Vision Systems Design team would like to congratulate DEEPX for their score in the 2023 Innovators Awards program. The DEEPX team should be very proud." Vision Systems Design (VSD), a leading journal in the US machine vision industry, annually awards the Innovators Awards to recognize innovative products and solutions in the field of machine vision. As a reputable source, VSD provides insights into the latest technologies, applications, and service trends in vision systems worldwide. The esteemed panel of judges for this award consists of experts from system integration (SI) companies and end-user enterprises. Evaluation criteria include originality, innovation, the use of cutting-edge technologies, benefits to designers, SIs, and end users, as well as productivity enhancements. Previous winners of this prestigious award include global machine vision companies such as Cognex, Keyence, and Sony Imaging. -
- 2023.11.10
- Press release
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DEEPX Hosts the Largest Showcase at the Embedded Vision Summit, Continues to Expand Global Footprint
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DEEPX will hold the largest showcase for its global market debut at the ‘Embedded Vision Summit’, the largest technology event in the field of edge AI
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The ‘Embedded Vision Summit’ to be held in Silicon Valley, USA from May 22nd to May 24th is the largest exhibition in the field of edge vision AI and is a big event where more than 80 of leading global system semiconductor companies participate
The Embedded Vision Summit is the world's premier conference for global technology companies that embed computer vision and AI into products. The 2023 Embedded Vision Summit will take place from May 22nd to 24th. This conference is the largest and only event in the world focused on commercial computer vision and vision AI, and global companies that develop vision-related products will participate. Many global companies will participate in this conference with their developed vision-related products. At this conference, DEEPX will demonstrate in real-time its four AI chip solutions and edge AI technologies developed with its customers. DEEPX will show demos that include driving robot and facial recognition algorithms developed with Hyundai Robotics Lab, high-performance camera modules developed with Jahwa Electronics, and smart factory solutions developed in collaboration with POSCO DX. DEEPX has also prepared a tutorial on supporting cutting-edge algorithms, exceeding the limits of theoretical AI accuracy, and running DXNNTM software. The conference will host many globally renowned system semiconductor companies such as Qualcomm, ARM, Synopsys, Cadence, NXP, Renesas, and ST Microeletronics. It will provide opportunities to compare the technologies of global companies, including global start-ups of edge AI processors. DEEPX will be joining as the premium exhibitor with the largest showcases right at the entrance of the exhibition hall. Starting with the Embedded Vision Summit in May, DEEPX plans to promote its world-class NPU-based semiconductor products by taking part in various events, including Computex Taipei in June, the Design Automation Conference (DAC) in the United States in July, IFA Berlin in Europe in September, Super Computing 23 in the United States in November, and CES in January of next year. The company aims to tap into the global market by directly exploring the North American and European markets and promoting AI semiconductor products recognized in the globally. CEO Lokwon Kim said, “Leaving Silicon Valley six years ago, I founded DEEPX to have fundamental AI semiconductor technology developed in my country and have been successful in developing AI semiconductor products that can be recognized in the global market. Returning to Silicon Valley, the center of the high-tech business, to debut in the global market, it is very exciting to participate on the largest scale to show DEEPX’s world’s best technological competitiveness at the 'Embedded Vision Summit,’ the biggest event in which edge AI semiconductor companies from around the world participate. In addition, Lokwon Kim said, "Ultimately, DEEPX aims to become a global company with a strong business expansion strategy based on the world's best technology in the global market. We will do our best to show our unique technology that we have been developing and commercializing for a long time." Jeff Bier, the founder of Edge AI and Vision Alliance (EVA), the host of the Embedded Vision Summit, said, "At last year's Embedded Vision Summit, DEEPX had a small presence with an FPGA prototype, as they had not yet fabricated their first chip. Their FPGA-based demo was impressive, and we were excited to see what they could do. We were struck by their ambitious strategy to target the entire edge AI market by simultaneously developing four semiconductor products, and we were excited to give DEEPX the opportunity to make its global debut alongside the world's leading semiconductor companies at the Embedded Vision Summit, the largest showcase for edge AI semiconductors.” -
- 2023.11.10