DEEPX Unveils Total AI Solutions for NVRs and Cameras at ISC West Elevates On-Device AI Ecosystem for Real-Time Video Analysis



Las Vegas, NV – [March 31] – DEEPX, a leading provider of high-performance, low-power AI accelerator solutions, is unveiling its latest innovations at ISC West 2025 in Las Vegas (March 31-April 4, 2025). The company is debuting a complete lineup of advanced AI products, including M.2 and PCIe-based acceleration solutions for Smart NVRs and edge servers, as well as the powerful V3 AI SoC designed for smart cameras and AI home hubs.

Built on DEEPX’s proprietary neural processing architecture, the new M.2 and PCIe AI accelerator cards deliver exceptional power efficiency and compute performance. These solutions enable OEMs and ODMs to reduce total cost of ownership (TCO) while dramatically enhancing real-time video analytics and AI inference capabilities. The compact M.2 cards, delivering up to 25 TOPS, are ideal for upgrading legacy NVRs with on-board AI. Meanwhile, the PCIe solutions offer over 100 TOPS of scalable acceleration for multi-stream, high-resolution video workloads in edge servers and gateways.

Also featured at this show is the DEEPX V3 AI SoC, purpose-built for smart cameras and home AI hubs. With 13 TOPS of AI performance, the V3 enables on-device vision intelligence such as facial recognition, person detection, and event-based alerts—all with ultra-low power consumption. Integrated H.265/H.264 encoding and decoding, along with an advanced ISP pipeline, make it a complete edge AI solution for next-generation smart home devices.

Why DEEPX Outperforms GPUs
DEEPX’s specialized AI architecture is designed for inference, delivering higher performance per watt than traditional GPUs. By focusing on matrix-based operations at the hardware level, DEEPX accelerators handle large-scale data in real time with significantly lower power and without cooling requirements—ideal for edge deployments with tight thermal and power constraints. Their scalable performance also helps OEMs and ODMs balance cost, size, and throughput. With on-device AI capabilities, DEEPX solutions further reduce latency and reliance on data centers, creating a more secure and efficient deployment environment.

Total AI Solutions for User-Friendly and Reliable Development
By partnering with Network Optics and CVEDIA—global leaders in video management solutions (VMS)—DEEPX delivers an all-encompassing AI solution that empowers physical security companies to quickly adopt advanced camera-based surveillance, AIoT frameworks, and edge AI capabilities. The seamless integration of DEEPX’s high-performance AI chip with Network Optics and CVEDIA’s VMS ensures real-time video analysis, anomaly detection, and object recognition, helping security enterprises efficiently detect and respond to threats. This collaborative effort not only reduces operational burdens and enhances situational awareness but also enables new revenue opportunities through scalable, user-friendly AI-driven services tailored to the evolving demands of modern security environments.

“We are witnessing explosive growth opportunities for edge devices in the physical security sector—such as AI-enabled cameras and IoT sensors,” said Mr. Jun, DEEPX’s Global Sales Lead. “We believe the on-device AI technology DEEPX is showcasing at ISC West will set a new standard for the market.” DEEPX invites ISC West attendees to visit Booth [33064] for live demonstrations of its full AI portfolio and to meet with technical and business leaders about integration opportunities.

DEEPX at Embedded World 2025: Showcasing Global Collaborations and Preparing for Mass Production March 11–14 | Nuremberg, Germany

 

  • DEEPX showcases on-device AI solutions at Embedded World in Nuremberg, unveiling global collaborations.
  • The company plans to launch its first mass-produced AI semiconductor product by mid-year.

Nuremberg, Germany – DEEPX (CEO Lokwon Kim) will participate in Embedded World, held from March 11 to 14 in Nuremberg, Germany, to expand the on-device AI market and ecosystem in Europe by partnering with embedded system manufacturers and distributors. At this year’s exhibition, DEEPX will unveil the results of its collaborations with global players and emphasize its readiness to supply on-device AI solutions that meet worldwide market demand. During the event, DEEPX is presenting outcomes from joint projects at partner booths—including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, Inventec, Network Optics, and Embedded Artist. These live demos illustrate DEEPX’s leadership in on-device AI and its growing influence in industrial automation, robotics, physical security, smart manufacturing, and IoT.

Industrial and Commercial IoT Hardware and Solutions

DEEPX is collaborating with Raspberry Pi, along with Sixfab—a global provider of hardware for remote monitoring, control, and data collection. By also partnering with Revolution Pi and Edutech, DEEPX is delivering customized, AI-enabled solutions designed for enterprise IoT scenarios.

Driving AI, IoT, and Edge Computing with Micron
DEEPX showcases high-performance AI computing by integrating Micron’s LPDDR4 and LPDDR5X memory into multiple form factors (such as M.2 and PCIe). As AI, IoT, and edge computing sectors expand, DEEPX and Micron together address diverse industry needs by combining advanced memory and AI semiconductor technologies.

Factory Automation and Robotics with Global Industrial PC Leaders
DEEPX demonstrates industrial computing products powered by its DX-M1 M.2 module through partnerships with Inventec, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, AWS Greengrass, and Onlogic. These AI-driven solutions enhance factory automation, medical systems, and smart factory operations. Portwell and DFI have publicly lauded DEEPX’s technology for delivering lower power consumption, reduced operating costs, and robust AI features—giving businesses remarkable efficiency, scalability, and stability.

Total AI Solutions for User-Friendly and Reliable Development
Working with Network Optics, a global leader in video management solutions (VMS), and Embedded Artist, which specializes in embedded system development and training platforms, DEEPX provides a complete AI solution for camera-based physical security, AIoT systems, and edge AI development environments. Notably, Network Optics’ VMS integrates seamlessly with DEEPX’s AI chip for real-time video analysis, anomaly detection, and object recognition. Embedded Artist further accelerates the adoption of DEEPX solutions, helping reduce time-to-market for IoT and AI projects across industries such as factory automation, logistics, and retail.

Aggressive Preparation for Mass Production
DEEPX is in the final stages of reliability testing and certification for its AI semiconductor chips and plans to launch its first mass-produced product in mid-2023. After conducting technology verifications with more than 300 global companies—spanning robotics, factory automation, physical security systems, and on-premise servers—DEEPX is now actively supporting the mass-production needs of over 20 clients.

DEEPX with global leaders at CES 2025 showcasing AI semiconductor mass-production-ready achievements


DEEPX an on-device AI semiconductor company, announced that it will participate in CES 2025, the world’s largest electronics expo in Las Vegas, USA, next January to showcase its AI semiconductor mass-production ready achievements with global leaders.

At the exhibition, DEEPX will emphasize its core business strategy of “All-in All-On”. Recently, global companies have been declaring an ‘All-in’ strategy for the adoption of AI technology, and as AI commercialization is in full swing, an ‘All-on’ strategy for on-device AI technology that enables AI anytime, anywhere is also gaining attention. DEEPX’s “All-in All-on” strategy is a strategic step toward becoming a global leader in on-device AI semiconductors and serving as a catalyst for all of its customers to drive their AI strategies.

With this strategy, DEEPX is contributing to the reshaping of all camera-based systems, computing systems of all kinds, and autonomous mobile vehicle technologies based on AI solutions. To realize this, DEEPX has been developing low-power, high-performance AI semiconductor solutions. By realizing high-performance AI computation on-device, it delivers superior performance in areas where real-time AI processing is essential, such as unmanned and automated devices, robots, smart retail, and industrial PCs.

At CES, DEEPX will showcase its high-performance AI solutions in collaboration with global server and workstation companies such as Dell, HP, Supermicro, Lenovo, and Kaytus, as well as demonstrate innovations in robotics, smart cities, and smart with Hyundai Motor Robotics Lab, LG U+, and POSCO DX. In addition, we will unveil AI solutions applied to various SBC (Single Board Computer) boards like Raspberry Pi, Orange Pi, NXP Board, Renesas Board, and industrial PCs in collaboration with Advantec, Inventec, DFI, iEi, Biostar, etc. to high-performance, low-power, and demonstrate competitiveness in the global.

“CES 2025 is an important stage for us to showcase our achievements in mass-production verification of AI semiconductors and interoperability between various application systems with global leaders,” said Lokwon Kim, CEO of DEEPX. “Based on our ‘All-in, All-on’ strategy, we will continue to work with global partners to create a world where AI runs anytime, anywhere, and lead the global on-device AI market.”

Coverage of the DEEPX booth at CES 2025

– When: Tuesday, Jan. 7 through Friday, Jan. 10, 2025
– Location: North Hall (AI Zone), Las Vegas Convention Center, Las Vegas, USA
– DEEPX Booth Location: 9045
– DEEPX CES 2025 Teaser Video: Dive in On-device AI