DEEPX at Embedded World 2025: Showcasing Global Collaborations and Preparing for Mass Production March 11–14 | Nuremberg, Germany

 

  • DEEPX showcases on-device AI solutions at Embedded World in Nuremberg, unveiling global collaborations.
  • The company plans to launch its first mass-produced AI semiconductor product by mid-year.

Nuremberg, Germany – DEEPX (CEO Lokwon Kim) will participate in Embedded World, held from March 11 to 14 in Nuremberg, Germany, to expand the on-device AI market and ecosystem in Europe by partnering with embedded system manufacturers and distributors. At this year’s exhibition, DEEPX will unveil the results of its collaborations with global players and emphasize its readiness to supply on-device AI solutions that meet worldwide market demand. During the event, DEEPX is presenting outcomes from joint projects at partner booths—including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, Inventec, Network Optics, and Embedded Artist. These live demos illustrate DEEPX’s leadership in on-device AI and its growing influence in industrial automation, robotics, physical security, smart manufacturing, and IoT.

Industrial and Commercial IoT Hardware and Solutions

DEEPX is collaborating with Raspberry Pi, along with Sixfab—a global provider of hardware for remote monitoring, control, and data collection. By also partnering with Revolution Pi and Edutech, DEEPX is delivering customized, AI-enabled solutions designed for enterprise IoT scenarios.

Driving AI, IoT, and Edge Computing with Micron
DEEPX showcases high-performance AI computing by integrating Micron’s LPDDR4 and LPDDR5X memory into multiple form factors (such as M.2 and PCIe). As AI, IoT, and edge computing sectors expand, DEEPX and Micron together address diverse industry needs by combining advanced memory and AI semiconductor technologies.

Factory Automation and Robotics with Global Industrial PC Leaders
DEEPX demonstrates industrial computing products powered by its DX-M1 M.2 module through partnerships with Inventec, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, AWS Greengrass, and Onlogic. These AI-driven solutions enhance factory automation, medical systems, and smart factory operations. Portwell and DFI have publicly lauded DEEPX’s technology for delivering lower power consumption, reduced operating costs, and robust AI features—giving businesses remarkable efficiency, scalability, and stability.

Total AI Solutions for User-Friendly and Reliable Development
Working with Network Optics, a global leader in video management solutions (VMS), and Embedded Artist, which specializes in embedded system development and training platforms, DEEPX provides a complete AI solution for camera-based physical security, AIoT systems, and edge AI development environments. Notably, Network Optics’ VMS integrates seamlessly with DEEPX’s AI chip for real-time video analysis, anomaly detection, and object recognition. Embedded Artist further accelerates the adoption of DEEPX solutions, helping reduce time-to-market for IoT and AI projects across industries such as factory automation, logistics, and retail.

Aggressive Preparation for Mass Production
DEEPX is in the final stages of reliability testing and certification for its AI semiconductor chips and plans to launch its first mass-produced product in mid-2023. After conducting technology verifications with more than 300 global companies—spanning robotics, factory automation, physical security systems, and on-premise servers—DEEPX is now actively supporting the mass-production needs of over 20 clients.

DEEPX ramps up mass-production chip supply for the global market, bolstering tangible business expansion


AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.

Last month at CES 2025 – one of the world’s largest electronics trade shows – DEEPX was recognized as a “must-visit company” by the event’s organizer, the Consumer Technology Association (CTA), shining a spotlight on the global market. During the show, over 16,000 visitors stopped by the DEEPX booth, resulting in more than 100 requests for mass-production chip samples—strong indicators of the company’s expanding commercial prospects.

During CES, DEEPX showcased various applications of its chips in edge devices for smart cities, smart factories, and robotics, as well as in industrial equipment and edge servers for global enterprises. Demonstrations and on-site meetings were held with a wide range of customers and partners from the United States, Taiwan, Japan, and Europe. In addition, major Korean corporations, government officials, and investors visited the booth on tours to get a firsthand look at DEEPX’s technological strengths.

Among the highlights, DEEPX successfully ran its first-generation mass-production chips using AI algorithms developed by:

– Hyundai-Kia Motor Robotics Lab (robot platform)
– Inventec (smart factory)
– POSCO DX (smart factory & logistics automation)
– LG U+ (industrial and urban security)

This demonstration underscored the critical role of on-device AI semiconductors – beyond cloud-based approaches – in ushering in a new era of AI.

DEEPX also directly compared its solution to NVIDIA’s Jetson Orin, a GPU-based edge platform, demonstrating approximately 10 times the power efficiency and 20 times the price/performance efficiency of its own NPU-based product. By also conducting a ‘butter benchmark’ test against other leading global NPU technologies, DEEPX demonstrated its advantage in power efficiency, thermal management, and operational stability – critical factors for on-device AI.

To illustrate its broad compatibility, DEEPX showcased integrations with application processor (AP) systems-including NXP, Renesas, TI, Broadcom, Rockchip, and Intel-as well as small form factor computing solutions such as the popular Raspberry Pi. The company also demonstrated interoperability with partner industrial PCs and leading workstation and server systems from HP, Dell, Supermicro, Lenovo, Inventec, and others, highlighting the versatility and scalability of its solution.

Looking ahead, DEEPX will partner with LG U+ at MWC (Mobile World Congress) in Barcelona from March 3 to demonstrate on-device AI solutions powered by its first-generation chip. DEEPX will also host its own booth to showcase the roadmap for its DX-M2 on-device AI semiconductor, designed for large language models. Following MWC, DEEPX will head to Embedded World on March 11 in Nuremberg, Germany, where its products will be showcased at partner booths – including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, and Network Optix – as well as DEEPX’s own stand. The company will conduct additional live demos and meet with potential customers to explore new business opportunities.

News Source-(CTA) What Not to Miss at CES 2025

DEEPX Wins 2024 Product of the Year Award, Demonstrating Global AI Semiconductor Leadership


On-device AI semiconductor company DEEPX (CEO Lokwon Kim) announced on the 6th that it had received the 2024 Product of the Year award, hosted by Electronic Products, a publication under EE Times, a global electronics industry journal.

Now in its 49th year, this award is given based on criteria such as groundbreaking technological advancements, innovative design, superior price-performance ratio, and market potential. It is a prestigious accolade previously awarded to global semiconductor leaders such as NXP, Renesas, Marvell Technology, and Texas Instruments, marking DEEPX’s international recognition for its technological excellence.

DEEPX is leading the next-generation semiconductor market with its innovative AI technology and global competitiveness. The company has filed over 300 patents worldwide and registered over 70, securing world-class proprietary AI semiconductor technology assets.

Based on these technological achievements, DEEPX was awarded the Presidential Commendation at the 2023 Korea Intellectual Property Office’s ‘Invention Day’ event. The company was also recognized at Computex Taipei, a major global AI semiconductor event, winning an innovation award among 400 competing companies. Additionally, DEEPX won three CES 2024 Innovation Awards and became the first AI semiconductor company invited to the World Economic Forum’s ‘Davos Forum,’ where it led discussions on energy credit policies for AI computing.

Furthermore, DEEPX has been listed in the EE Times ‘Silicon 100’ for two consecutive years and was named the ‘Best Company in the AI Semiconductor Industry’ by U.S. market research firm Frost & Sullivan. DEEPX continues solidifying its position as a key player in the AI semiconductor market through its global achievements and recognition for its innovation and technological leadership.


News Source – Electronic Products

BIOSTAR showcases new partnership with DEEPX in conjunction with new x86-based Edge AI Solutions

 

BIOSTAR, a leading manufacturer of Edge AI embedded computers, IPC solutions motherboards, graphics cards, and PC peripherals, is excited to announce x86 Edge AI platform showcase at CES 2025. Scheduled to take place from January 7 to 10 in Las Vegas, Nevada, USA, BIOSTAR, in partnership with DEEPX, an AI semiconductor company from South Korea, will showcase cutting-edge x86 Edge AI solutions at DEEPX’s booth (#9045) in the North Hall of the Las Vegas Convention Center.

 

DEEPX is a pioneering company in on-device AI. It develops advanced AI semiconductors that optimize performance, reduce power consumption, and enhance cost efficiency across various industries, including smart camera modules, smart mobility, smart factories, consumer electronics, smart cities, surveillance systems, and AI servers. Building upon their successful collaborations, BIOSTAR and DEEPX set to unveil their latest joint innovations at CES 2025, further enhancing their prominence in the industrial computing ecosystem.

 

This strategic collaboration integrates BIOSTAR’s AMD B650 motherboards and storage device with DEEPX’s advanced AI accelerators—the DX-H1 PCIe x16 (Bifurcation x4x4x4x4) and DX-M1 (M.2) modules – operating on a Linux platform. The real-time demonstration will feature state-of-the-art object detection, highlighting the seamless integration and scalability of their combined technologies in Edge AI applications.

 

By integrating BIOSTAR’s x86 based edge AI platforms with DEEPX’s advanced AI capabilities, this partnership establishes a new benchmark for AI computing industry, highlighting BIOSTAR’s pivotal role in shaping the future of Edge AI technology. As DEEPX becomes synonymous with cutting-edge AI NPU technology, BIOSTAR’s collaboration with such an industry leader enhances its reputation as an innovative and reliable partner in the AI edge computing industry.

 

News Source-Tech Power up

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