DFI and DEEPX Unveil Revolutionary Edge AI at CES 2025 to Power Smart Cities and Industries

 

DFI, a global leader in embedded motherboards and industrial computers, will join DEEPX at CES 2025 to unveil new industrial edge AI platforms integrated with the DX-M1 AI accelerator, targeting smart city applications. This collaboration reflects a shared commitment to advancing on-device and application-specific AI, paving the way for a more flexible, efficient, and sustainable edge AI adoption.

 

According to Research and Markets, the global edge AI market is projected to grow at a 20.54% CAGR, increasing from US$23.571 billion in 2024 to US$59.978 billion by 2029. To meet the growing demand for scalable and energy-efficient AI solutions, DFI integrates the DEEPX DX-M1 AI accelerator into its industrial hardware platforms, delivering cutting-edge performance tailored to modern industry needs.

 

The DEEPX DX-M1 excels with the ability to process over 16 video channels on a single chip, achieve real-time performance exceeding 30 fps with GPU-level precision, and deliver up to 25 TOPs of AI power while minimizing energy consumption. This combination of power and efficiency enables simultaneous execution of advanced AI algorithms, such as object recognition and image classification, making it a versatile solution for applications in industrial robotics, machine vision, AI-driven IPC and HPC, smart factories, and beyond.

To demonstrate this vision, DFI will showcase two fan-less embedded systems—the EC710-ASL and EC600-RPS—featuring the DEEPX DX-M1 M.2 AI accelerator. These platforms are designed to meet critical real-time demands in smart cities, enabling applications like smart transportation, surveillance, and accident prevention. The system are powered by Intel® Atom® and Intel® 14th/13th/12th Gen processors, and support Intel® Time Coordinated Computing (Intel® TCC) technology for precise real-time operations while maintaining low power consumption and minimal latency.

 

DFI continues to push the boundaries of industrial-grade embedded solutions with its latest product innovations, including the ASL253 single-board computer powered by Intel® Atom® processors, the EB100-MTU NUC system featuring Intel® Core™ Ultra processors, proprietary Out-of-Band (OOB) modules, and the versatile DFI Workload Platform. These advancements not only boost hardware performance but also enhance remote management through OOB capabilities and optimize AI efficiency to meet the growing demands of edge AIoT applications.

 

News Source – Embedded Computing Design

DEEPX ramps up mass-production chip supply for the global market, bolstering tangible business expansion


AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.

Last month at CES 2025 – one of the world’s largest electronics trade shows – DEEPX was recognized as a “must-visit company” by the event’s organizer, the Consumer Technology Association (CTA), shining a spotlight on the global market. During the show, over 16,000 visitors stopped by the DEEPX booth, resulting in more than 100 requests for mass-production chip samples—strong indicators of the company’s expanding commercial prospects.

During CES, DEEPX showcased various applications of its chips in edge devices for smart cities, smart factories, and robotics, as well as in industrial equipment and edge servers for global enterprises. Demonstrations and on-site meetings were held with a wide range of customers and partners from the United States, Taiwan, Japan, and Europe. In addition, major Korean corporations, government officials, and investors visited the booth on tours to get a firsthand look at DEEPX’s technological strengths.

Among the highlights, DEEPX successfully ran its first-generation mass-production chips using AI algorithms developed by:

– Hyundai-Kia Motor Robotics Lab (robot platform)
– Inventec (smart factory)
– POSCO DX (smart factory & logistics automation)
– LG U+ (industrial and urban security)

This demonstration underscored the critical role of on-device AI semiconductors – beyond cloud-based approaches – in ushering in a new era of AI.

DEEPX also directly compared its solution to NVIDIA’s Jetson Orin, a GPU-based edge platform, demonstrating approximately 10 times the power efficiency and 20 times the price/performance efficiency of its own NPU-based product. By also conducting a ‘butter benchmark’ test against other leading global NPU technologies, DEEPX demonstrated its advantage in power efficiency, thermal management, and operational stability – critical factors for on-device AI.

To illustrate its broad compatibility, DEEPX showcased integrations with application processor (AP) systems-including NXP, Renesas, TI, Broadcom, Rockchip, and Intel-as well as small form factor computing solutions such as the popular Raspberry Pi. The company also demonstrated interoperability with partner industrial PCs and leading workstation and server systems from HP, Dell, Supermicro, Lenovo, Inventec, and others, highlighting the versatility and scalability of its solution.

Looking ahead, DEEPX will partner with LG U+ at MWC (Mobile World Congress) in Barcelona from March 3 to demonstrate on-device AI solutions powered by its first-generation chip. DEEPX will also host its own booth to showcase the roadmap for its DX-M2 on-device AI semiconductor, designed for large language models. Following MWC, DEEPX will head to Embedded World on March 11 in Nuremberg, Germany, where its products will be showcased at partner booths – including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, and Network Optix – as well as DEEPX’s own stand. The company will conduct additional live demos and meet with potential customers to explore new business opportunities.

DEEPX Surpasses 300 Customer Validations Through Its “Early Engagement Customer Program” Prepares to Launch Mass Production in Mid-Year and Accelerate Global Market Entry

 

  • Over the past year, DEEPX has used MPW-based products for real-world testing, identifying practical on-site requirements and enhancing product completeness.
  • According to Omdia, the global AI chip market is expected to reach approximately USD 243 billion by 2028. On-device AI is emerging as a key sector to watch.

SEOUL, South Korea, 31, March–DEEPX, a company specializing in on-device AI semiconductors, announced that its “Early Engagement Customer Program” (EECP)—run over the past year in preparation for the mid-year mass-production launch of its first product—has received more than 300 customer validation requests worldwide for its DX-M1 prototype.

 

This milestone reflects strong global interest in the upcoming mid-year release of DEEPX’s first mass-produced chip, the “DX-M1.” Through the program, the company has confirmed surging demand for on-device AI technology across a broad range of industries.

 

Since last year, DEEPX has participated in over 20 global events to promote its prototype products and expand its international business footprint. The program specifically targeted companies requiring AI semiconductors—including those in surveillance systems, smart mobility, robotics, factory automation, and camera systems—by providing MPW (Multi-Project Wafer) based prototypes and technical support. By showcasing prototype capabilities in real-world environments, DEEPX proactively collected industry feedback and swiftly pinpointed areas needing further refinement.

 

These efforts went well beyond simple readiness for mass production. They delivered valuable insights into each industry’s requirements and emerging market trends, while also securing diverse use cases from a wide spectrum of customers. DEEPX noted that the data and feedback gathered through this program have been instrumental in boosting both the technical robustness of the DX-M1, scheduled for release in mid-year, and its user convenience.

 

DEEPX has also highlighted its technical strengths at leading industry events worldwide. By tailoring its response to specific technical needs—well before mass production—the company has garnered multiple awards from international organizations. Notably, DEEPX secured three innovation awards at CES 2024 for its original technologies, and at COMPUTEX Taipei, one of the largest AI semiconductor tradeshows, it won a startup terrace award in a competition against more than 400 companies. At this year’s CES, the Consumer Technology Association (CTA) even named DEEPX a “must-visit company,” drawing over 16,000 booth visitors—an all-time high.

 

Additionally, DEEPX was recognized as the “2024 Company of the Year – In the Global Artificial Intelligence Chip Industry” by market research firm Frost & Sullivan, and the DX-M1 was named “the 2024 Product of the Year” by global IT publication EETimes. These accolades highlight DEEPX’s strong technological foundation and have heightened expectations for robust worldwide sales as soon as mass production officially launches mid-year.

 

According to market research firm Omdia, the global AI chip market is set to reach approximately USD 243 billion by 2028, propelled by an emerging market of around USD 69 billion in sectors such as surveillance systems, smart mobility, and robotics. Recognizing these opportunities, DEEPX is expanding global partnerships in key regions including the United States, Taiwan, and Europe, continuously strengthening its product competitiveness through close collaboration with potential customers.

 

DEEPX’s CEO Lokwon Kim stated, “Over the past year, more than 300 companies worldwide have carried out customer validations with us, underscoring the rapid spread of on-device AI technology. With the official mid-year launch of the DX-M1, we aim to address market needs head-on and firmly establish DEEPX as a foremost global player in the on-device AI industry.”

 

About DEEPX

Founded in anticipation of an era when artificial intelligence will be as pervasive as electricity and Wi-Fi, DEEPX develops core technology for high-performance AI semiconductors and computing solutions that bring intelligence to electronic devices. DEEPX currently holds over 326 patents pending in the U.S., China, and Korea—one of the largest patent portfolios in the world for on-device AI chip development.

 

DEEPX’s AI semiconductors are optimized for various applications, improving energy efficiency while enabling advanced AI functionality. The company is collaborating with customers such as Hyundai Kia Motors Robotics Lab, POSCO DX, Jahwa Electronics, LGU+, and Inventec on mass-production developments. In addition, DEEPX works with more than 120 global organizations in areas like smart cameras, surveillance systems (AI NVR), smart factories, robotic platforms, and AI servers, and conducts strategic global promotions in the United States, China, Taiwan, and Europe.