DEEPX Targets the European Market at ‘Embedded World 2026’, Building a Comprehensive Alliance with 10 Global Partners

  • DEEPX technology dominates the Embedded World exhibition in Germany, showcasing an overwhelming physical AI ecosystem.
  • Simultaneous real-time live demos of DEEPX products to be featured at the booths of 10 global leading companies, including Renesas, Avnet, and Raspberry Pi.
  • Unveiling the mass-produced DX-M1M module and physical AI integrated accelerator ‘DX-AIPlayer’, while collaborating with global semiconductor distributor Avnet Silica to penetrate the European market.

(March 10, 2026, Germany) — Global physical AI semiconductor company DEEPX (CEO Lokwon Kim) announced its aggressive move to capture the European market by participating in the world’s largest embedded electronic technology exhibition, ‘Embedded World 2026’, held in Germany.

 

‘Embedded World’ is the premier global exhibition where the latest technologies in the embedded electronics industry converge, serving as a core business platform for global leading companies in automotive, robotics, and more to share hardware and software innovations.

 

At this exhibition, DEEPX will demonstrate its unrivaled technological ecosystem. In addition to its standalone booth, DEEPX’s technology will be simultaneously showcased through real-time live demos at the booths of 10 global leading partner companies located throughout the exhibition hall. Following its momentum at CES earlier this year, this achievement proves that DEEPX is establishing itself as the “global standard for physical AI hardware” at the heart of the embedded industry.

 

The partner demo lineup across the exhibition hall includes:

  • Renesas Electronics: Will unveil over three types of industrial boards combining Renesas APs and DEEPX NPUs, presenting solutions applicable to smart factories. This collaboration between a global AP semiconductor company and an AI chip company is expected to draw significant attention.

     

  • Sixfab and Raspberry Pi: Will conduct a real-time smart traffic analysis demo using the CES 2026 Best of Innovation award-winning AI PC ‘ALPON X5’ equipped with DEEPX products, and will globally debut the AI HAT model equipped with the DX-M1.

     

  • AAEON (ASUS subsidiary), IEI, WeLink, Endrich, Toradex, and Lanner: Industrial system developers will demonstrate customized AI hardware solutions for smart cities, automated logistics, and security systems powered by DEEPX products.

     

  • Ultralytics & Network Optix: Ultralytics, the developer of the global vision AI standard YOLO model, will showcase the achievements of the “Open-Source Physical AI Alliance” running via a one-click process on the DEEPX NPU. Network Optix will demonstrate an intelligent Video Management System (VMS) integrating and managing thousands of cameras in real-time using DEEPX products.

     

Through these powerful partnerships with highly influential global distributors and module manufacturers in the European market, DEEPX is introducing a massive array of solutions that can be immediately applied to actual industrial sites. This solidifies its unique position as a ‘Physical AI Infrastructure Company’ enabling developers worldwide to instantly implement commercial-level AI functions.

 

Furthermore, DEEPX will unveil two core mass-production product lines designed to solve technical challenges in European industrial sectors:


  • DX-M1M (M.2 Module): A standard M.2 form factor module equipped with the high-performance DX-M1 AI chip. Its strong point is high scalability, allowing users to add powerful AI inference capabilities instantly by plugging it into existing industrial PCs or edge server slots.

     

  • DX-AIPlayer: An edge AI integrated acceleration solution combining the DEEPX NPU and a high-efficiency CPU board. As a ‘one-stop’ product supporting the entire process from model development to industrial platform deployment, it provides an optimal development environment to implement intelligent vision AI without complex configurations.

DEEPX signed a distribution agreement with Avnet Silica, a leader in global technology distribution, last year, securing a supply chain across Europe. Avnet Silica is currently expanding purchase contracts after discovering over 30 customers in high-performance embedded sectors such as smart city infrastructure, Autonomous Mobile Robots (AMR), machine vision, and smart factories. Through this joint exhibition, both companies plan to accelerate the commercialization and mass production diversification of DEEPX products throughout Europe.

 

A DEEPX representative stated, “Through mass production collaborations with hardware leaders like Renesas and Raspberry Pi, as well as software standard companies like Baidu and Ultralytics, DEEPX aims to become the ‘physical AI hardware standard’ that developers worldwide choose first.” The representative added, “As Europe is the most active market for adopting physical AI in smart factories, robotics, and automotive, we will begin our global revenue growth in earnest based on these achievements.”

DEEPX Signs Strategic Partnership with Avnet Silica, Accelerating Expansion into theEMEA

 
  • DEEPX to expand the supply of ultra-low-power NPUs across Europe, the Middle East, and Africa through Avnet’s global distribution network.
  • Delivering South Korean AI semiconductor innovation to core European industries, including smart cities and robotics.

DEEPX, a pioneer in ultra-low-power on-device AI semiconductors, today announced the signing of a new franchise agreement with Avnet Silica, the semiconductor specialist division of Avnet (NASDAQ: AVT), a leading global technology distributor. This strategic partnership marks the full-scale launch of DEEPX’s expansion into the European market.


This collaboration combines DEEPX’s world-class low-power, high-performance AI semiconductor technology with Avnet Silica’s extensive global supply chain to proactively address the rapidly growing demand in the Edge AI market.


Engineers across Europe’s industrial sectors face a critical challenge: delivering high-performance AI computing within strict power and thermal constraints. Traditional microcontrollers (MCUs) often lack the necessary performance, while GPUs consume too much power for widespread edge deployment.


Through this partnership, DEEPX positions itself as the solution to bridge this technological gap. Customers across the EMEA (Europe, Middle East, and Africa) region can now easily access DEEPX’s NPU solutions through Avnet Silica’s distribution network. The adoption of DEEPX chips is expected to accelerate, particularly in high-performance embedded applications such as smart city infrastructure, autonomous mobile robots (AMRs), machine vision, and smart factories.


“We are continually focused on helping our customers bridge the gap between high-performance AI demands and the realities of constrained power budgets at the Edge,” said Michael Uyttersprot, Manager System Solutions, AI/ML & Vision System Solutions at Avnet Silica. “DEEPX delivers the essential NPU architecture and efficiency required to deploy sophisticated models in power- and thermal-sensitive environments, significantly enhancing the options across our existing linecard.”

 

“We are excited to partner with Avnet, a world-class technology distributor with deep expertise in bringing cutting-edge solutions to market,” said Tim Park, Strategy Marketing Director at DEEPX. “ By combining Avnet’s global reach and design support capabilities with  DEEPX’s ultra-efficient Edge AI NPUs, we will help customers build AI systems that are more scalable, more sustainable, and easier to deploy. Together, we aim to accelerate the shift from data center-centric AI to a new era of Physical AI at the edge.”

 

Starting with this agreement, DEEPX plans to broaden its touchpoints with local customers
through major industrial exhibitions and technical seminars in Europe, further solidifying its
position in the global AI semiconductor market.

 

DEEPX in AVNET Product Shop: View URL Link

South Korea’s DEEPX to supply AI chips for Baidu’s drones and robots

South Korean AI semiconductor developer DeepX has struck a deal to supply chips for Chinese tech giant Baidu, targeting applications in drones and robotics.

The partnership will integrate DeepX’s processors with Baidu’s PaddlePaddle open-source deep learning framework to co-develop AI solutions for global industrial markets.
According to Yonhap News Agency and TheElec, Baidu said the agreement will broaden edge AI applications from optical character recognition (OCR) in documents and images to autonomous aerial and robotic systems.

Performance rivals Nvidia, with lower power draw
DeepX’s DX-M1 AI chip is now fully compatible with the fifth-generation PP-OCR model on PaddlePaddle. Baidu said the jointly developed recognition system outperformed Nvidia’s GeForce RTX 2080 Ti in key benchmarks, delivering superior performance and energy efficiency.
The chip’s low-power, high-performance profile makes it well-suited for battery-constrained industrial AI devices such as inspection robots, equipment monitors, and automated document processors, enabling faster, more accurate, and longer-lasting operations.
Baidu plans to deliver the DX-M1 to around 20 customers, including drone manufacturers, with mass production to follow initial orders. The companies aim to extend their collaboration beyond OCR into a broader range of physical AI applications.

Next-gen chips for Baidu’s ERNIE 4.5
The two firms have also begun proof-of-concept testing of DeepX’s upcoming DX-M2 chip with Baidu’s large vision model (VLM) ERNIE 4.5. Early results show that ERNIE 4.5 maintains high accuracy while operating stably in ultra-low-power environments.
Because DeepX’s semiconductors are designed for edge computing rather than large-scale AI training servers, the products fall outside the scope of US export restrictions on China-bound AI chips.

News Source – https://www.digitimes.com/news/a20250812PD207/deepx-baidu-industrial-chips-ocr.html

DEEPX ramps up mass-production chip supply for the global market, bolstering tangible business expansion


AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.

Last month at CES 2025 – one of the world’s largest electronics trade shows – DEEPX was recognized as a “must-visit company” by the event’s organizer, the Consumer Technology Association (CTA), shining a spotlight on the global market. During the show, over 16,000 visitors stopped by the DEEPX booth, resulting in more than 100 requests for mass-production chip samples—strong indicators of the company’s expanding commercial prospects.

During CES, DEEPX showcased various applications of its chips in edge devices for smart cities, smart factories, and robotics, as well as in industrial equipment and edge servers for global enterprises. Demonstrations and on-site meetings were held with a wide range of customers and partners from the United States, Taiwan, Japan, and Europe. In addition, major Korean corporations, government officials, and investors visited the booth on tours to get a firsthand look at DEEPX’s technological strengths.

Among the highlights, DEEPX successfully ran its first-generation mass-production chips using AI algorithms developed by:

– Hyundai-Kia Motor Robotics Lab (robot platform)
– Inventec (smart factory)
– POSCO DX (smart factory & logistics automation)
– LG U+ (industrial and urban security)

This demonstration underscored the critical role of on-device AI semiconductors – beyond cloud-based approaches – in ushering in a new era of AI.

DEEPX also directly compared its solution to NVIDIA’s Jetson Orin, a GPU-based edge platform, demonstrating approximately 10 times the power efficiency and 20 times the price/performance efficiency of its own NPU-based product. By also conducting a ‘butter benchmark’ test against other leading global NPU technologies, DEEPX demonstrated its advantage in power efficiency, thermal management, and operational stability – critical factors for on-device AI.

To illustrate its broad compatibility, DEEPX showcased integrations with application processor (AP) systems-including NXP, Renesas, TI, Broadcom, Rockchip, and Intel-as well as small form factor computing solutions such as the popular Raspberry Pi. The company also demonstrated interoperability with partner industrial PCs and leading workstation and server systems from HP, Dell, Supermicro, Lenovo, Inventec, and others, highlighting the versatility and scalability of its solution.

Looking ahead, DEEPX will partner with LG U+ at MWC (Mobile World Congress) in Barcelona from March 3 to demonstrate on-device AI solutions powered by its first-generation chip. DEEPX will also host its own booth to showcase the roadmap for its DX-M2 on-device AI semiconductor, designed for large language models. Following MWC, DEEPX will head to Embedded World on March 11 in Nuremberg, Germany, where its products will be showcased at partner booths – including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, and Network Optix – as well as DEEPX’s own stand. The company will conduct additional live demos and meet with potential customers to explore new business opportunities.

News Source-(CTA) What Not to Miss at CES 2025

BIOSTAR showcases new partnership with DEEPX in conjunction with new x86-based Edge AI Solutions

x86 edge AI platform from Biostar and DeepX

 

BIOSTAR, a leading manufacturer of Edge AI embedded computers, IPC solutions motherboards, graphics cards, and PC peripherals, is excited to announce x86 Edge AI platform showcase at CES 2025. Scheduled to take place from January 7 to 10 in Las Vegas, Nevada, USA, BIOSTAR, in partnership with DEEPX, an AI semiconductor company from South Korea, will showcase cutting-edge x86 Edge AI solutions at DEEPX’s booth (#9045) in the North Hall of the Las Vegas Convention Center.

 

DEEPX is a pioneering company in on-device AI. It develops advanced AI semiconductors that optimize performance, reduce power consumption, and enhance cost efficiency across various industries, including smart camera modules, smart mobility, smart factories, consumer electronics, smart cities, surveillance systems, and AI servers. Building upon their successful collaborations, BIOSTAR and DEEPX set to unveil their latest joint innovations at CES 2025, further enhancing their prominence in the industrial computing ecosystem.

 

This strategic collaboration integrates BIOSTAR’s AMD B650 motherboards and storage device with DEEPX’s advanced AI accelerators—the DX-H1 PCIe x16 (Bifurcation x4x4x4x4) and DX-M1 (M.2) modules – operating on a Linux platform. The real-time demonstration will feature state-of-the-art object detection, highlighting the seamless integration and scalability of their combined technologies in Edge AI applications.

 

By integrating BIOSTAR’s x86 based edge AI platforms with DEEPX’s advanced AI capabilities, this partnership establishes a new benchmark for AI computing industry, highlighting BIOSTAR’s pivotal role in shaping the future of Edge AI technology. As DEEPX becomes synonymous with cutting-edge AI NPU technology, BIOSTAR’s collaboration with such an industry leader enhances its reputation as an innovative and reliable partner in the AI edge computing industry.

 

News Source-Tech Power up

 

Virtium Embedded Artists Introduces Integrated AI Accelerator DEEPX DX-M1 and iMX8M Mini Kit

DEEPX DX-M1 & i.MX8M Mini

 

Industrial and embedded computing specialist Virtium Embedded Artists has announced the launch of the DEEPX iMX8M Mini AI Kit, developed in partnership with DEEPX: a single-board computer (SBC) style development bundle with an “AI Booster” delivering 25 tera-operations per second (TOPS) of compute at a 5W power draw for on-device machine learning (ML) and artificial intelligence (AI) workloads.

 

“This product redefines the limits of edge AI performance, delivering unparalleled power and cost efficiency,” claims Virtium Embedded Artists managing director Anders Rosvall of the company’s newest launch. “The DEEPX iMX8M Mini AI Kit simplifies the evaluation process for design engineers, enabling them to determine if our solution meets their application requirements while accelerating time to market.”

 

The DEEPX iMX8M Mini AI Kit isn’t a true single-board computer, though it can be treated like one; rather, it’s three boards bundled together. The first is an iMX8M Mini uCOM computer-on-module, built around NXP Semiconductor’s i.MS 8M Mini processor — giving it four Arm Cortex-A53 cores running at up to 1.8GHz and a Cortex-M4 core running at up to 400MHz, a VeriSilicon Vivante GC Nano Ultra 2D graphics processor, and GC320 3D graphics processor. To this the company has added 1GB of LPDDR4 memory and 8GB of on-board eMMC storage.

 

The second board is DEEPX’s contribution: an M.2 module with the company’s DX-M1 AI Booster, delivering a claimed 25 tera-operations per second (TOPS) of minimum-precision compute at a 5W power draw — the highest cost efficiency, power efficiency, and performance efficiency in the world, the company boasts. The final board ties everything together: a carrier board for the uCOM module, which includes a gigabit Ethernet port, USB ports, microSD card slot, MIPI Display Serial Interface (DSI) and parallel RGB video outputs plus a bundled DSI-to-HDMI adapter, a MIPI Camera Serial Interface (CSI) input, mikroBUS header, expansion connectors, and a dedicated debug interface.

 

The kit, which can run pre-trained models or custom models compiled with a toolkit available from DEEPX, is now available to order for “qualified projects” on the Virtium Embedded Artists website; the company has not publicly disclosed pricing.

 

 

 

News Source (1) – ‘Energy-Efficient DEEPX iMX8M Mini AI Kit (Hacksters.io)

News Source (2) – Embedded Artists 

DFI and DEEPX Unveil Revolutionary Edge AI at CES 2025 to Power Smart Cities and Industries

Accelerating the real-world adoption of Edge AIoT solutions

 

DFI, a global leader in embedded motherboards and industrial computers, will join DEEPX at CES 2025 to unveil new industrial edge AI platforms integrated with the DX-M1 AI accelerator, targeting smart city applications. This collaboration reflects a shared commitment to advancing on-device and application-specific AI, paving the way for a more flexible, efficient, and sustainable edge AI adoption.

 

According to Research and Markets, the global edge AI market is projected to grow at a 20.54% CAGR, increasing from US$23.571 billion in 2024 to US$59.978 billion by 2029. To meet the growing demand for scalable and energy-efficient AI solutions, DFI integrates the DEEPX DX-M1 AI accelerator into its industrial hardware platforms, delivering cutting-edge performance tailored to modern industry needs.

 

The DEEPX DX-M1 excels with the ability to process over 16 video channels on a single chip, achieve real-time performance exceeding 30 fps with GPU-level precision, and deliver up to 25 TOPs of AI power while minimizing energy consumption. This combination of power and efficiency enables simultaneous execution of advanced AI algorithms, such as object recognition and image classification, making it a versatile solution for applications in industrial robotics, machine vision, AI-driven IPC and HPC, smart factories, and beyond.

To demonstrate this vision, DFI will showcase two fan-less embedded systems—the EC710-ASL and EC600-RPS—featuring the DEEPX DX-M1 M.2 AI accelerator. These platforms are designed to meet critical real-time demands in smart cities, enabling applications like smart transportation, surveillance, and accident prevention. The system are powered by Intel® Atom® and Intel® 14th/13th/12th Gen processors, and support Intel® Time Coordinated Computing (Intel® TCC) technology for precise real-time operations while maintaining low power consumption and minimal latency.

 

DFI continues to push the boundaries of industrial-grade embedded solutions with its latest product innovations, including the ASL253 single-board computer powered by Intel® Atom® processors, the EB100-MTU NUC system featuring Intel® Core™ Ultra processors, proprietary Out-of-Band (OOB) modules, and the versatile DFI Workload Platform. These advancements not only boost hardware performance but also enhance remote management through OOB capabilities and optimize AI efficiency to meet the growing demands of edge AIoT applications.

 

News Source – Embedded Computing Design