DEEPX ramps up mass-production chip supply for the global market, bolstering tangible business expansion


AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.

Last month at CES 2025 – one of the world’s largest electronics trade shows – DEEPX was recognized as a “must-visit company” by the event’s organizer, the Consumer Technology Association (CTA), shining a spotlight on the global market. During the show, over 16,000 visitors stopped by the DEEPX booth, resulting in more than 100 requests for mass-production chip samples—strong indicators of the company’s expanding commercial prospects.

During CES, DEEPX showcased various applications of its chips in edge devices for smart cities, smart factories, and robotics, as well as in industrial equipment and edge servers for global enterprises. Demonstrations and on-site meetings were held with a wide range of customers and partners from the United States, Taiwan, Japan, and Europe. In addition, major Korean corporations, government officials, and investors visited the booth on tours to get a firsthand look at DEEPX’s technological strengths.

Among the highlights, DEEPX successfully ran its first-generation mass-production chips using AI algorithms developed by:

– Hyundai-Kia Motor Robotics Lab (robot platform)
– Inventec (smart factory)
– POSCO DX (smart factory & logistics automation)
– LG U+ (industrial and urban security)

This demonstration underscored the critical role of on-device AI semiconductors – beyond cloud-based approaches – in ushering in a new era of AI.

DEEPX also directly compared its solution to NVIDIA’s Jetson Orin, a GPU-based edge platform, demonstrating approximately 10 times the power efficiency and 20 times the price/performance efficiency of its own NPU-based product. By also conducting a ‘butter benchmark’ test against other leading global NPU technologies, DEEPX demonstrated its advantage in power efficiency, thermal management, and operational stability – critical factors for on-device AI.

To illustrate its broad compatibility, DEEPX showcased integrations with application processor (AP) systems-including NXP, Renesas, TI, Broadcom, Rockchip, and Intel-as well as small form factor computing solutions such as the popular Raspberry Pi. The company also demonstrated interoperability with partner industrial PCs and leading workstation and server systems from HP, Dell, Supermicro, Lenovo, Inventec, and others, highlighting the versatility and scalability of its solution.

Looking ahead, DEEPX will partner with LG U+ at MWC (Mobile World Congress) in Barcelona from March 3 to demonstrate on-device AI solutions powered by its first-generation chip. DEEPX will also host its own booth to showcase the roadmap for its DX-M2 on-device AI semiconductor, designed for large language models. Following MWC, DEEPX will head to Embedded World on March 11 in Nuremberg, Germany, where its products will be showcased at partner booths – including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, and Network Optix – as well as DEEPX’s own stand. The company will conduct additional live demos and meet with potential customers to explore new business opportunities.

News Source-(CTA) What Not to Miss at CES 2025

BIOSTAR showcases new partnership with DEEPX in conjunction with new x86-based Edge AI Solutions

 

BIOSTAR, a leading manufacturer of Edge AI embedded computers, IPC solutions motherboards, graphics cards, and PC peripherals, is excited to announce x86 Edge AI platform showcase at CES 2025. Scheduled to take place from January 7 to 10 in Las Vegas, Nevada, USA, BIOSTAR, in partnership with DEEPX, an AI semiconductor company from South Korea, will showcase cutting-edge x86 Edge AI solutions at DEEPX’s booth (#9045) in the North Hall of the Las Vegas Convention Center.

 

DEEPX is a pioneering company in on-device AI. It develops advanced AI semiconductors that optimize performance, reduce power consumption, and enhance cost efficiency across various industries, including smart camera modules, smart mobility, smart factories, consumer electronics, smart cities, surveillance systems, and AI servers. Building upon their successful collaborations, BIOSTAR and DEEPX set to unveil their latest joint innovations at CES 2025, further enhancing their prominence in the industrial computing ecosystem.

 

This strategic collaboration integrates BIOSTAR’s AMD B650 motherboards and storage device with DEEPX’s advanced AI accelerators—the DX-H1 PCIe x16 (Bifurcation x4x4x4x4) and DX-M1 (M.2) modules – operating on a Linux platform. The real-time demonstration will feature state-of-the-art object detection, highlighting the seamless integration and scalability of their combined technologies in Edge AI applications.

 

By integrating BIOSTAR’s x86 based edge AI platforms with DEEPX’s advanced AI capabilities, this partnership establishes a new benchmark for AI computing industry, highlighting BIOSTAR’s pivotal role in shaping the future of Edge AI technology. As DEEPX becomes synonymous with cutting-edge AI NPU technology, BIOSTAR’s collaboration with such an industry leader enhances its reputation as an innovative and reliable partner in the AI edge computing industry.

 

News Source-Tech Power up

 

Virtium Embedded Artists Introduces Integrated AI Accelerator DEEPX DX-M1 and iMX8M Mini Kit

 

Industrial and embedded computing specialist Virtium Embedded Artists has announced the launch of the DEEPX iMX8M Mini AI Kit, developed in partnership with DEEPX: a single-board computer (SBC) style development bundle with an “AI Booster” delivering 25 tera-operations per second (TOPS) of compute at a 5W power draw for on-device machine learning (ML) and artificial intelligence (AI) workloads.

 

“This product redefines the limits of edge AI performance, delivering unparalleled power and cost efficiency,” claims Virtium Embedded Artists managing director Anders Rosvall of the company’s newest launch. “The DEEPX iMX8M Mini AI Kit simplifies the evaluation process for design engineers, enabling them to determine if our solution meets their application requirements while accelerating time to market.”

 

The DEEPX iMX8M Mini AI Kit isn’t a true single-board computer, though it can be treated like one; rather, it’s three boards bundled together. The first is an iMX8M Mini uCOM computer-on-module, built around NXP Semiconductor’s i.MS 8M Mini processor — giving it four Arm Cortex-A53 cores running at up to 1.8GHz and a Cortex-M4 core running at up to 400MHz, a VeriSilicon Vivante GC Nano Ultra 2D graphics processor, and GC320 3D graphics processor. To this the company has added 1GB of LPDDR4 memory and 8GB of on-board eMMC storage.

 

The second board is DEEPX’s contribution: an M.2 module with the company’s DX-M1 AI Booster, delivering a claimed 25 tera-operations per second (TOPS) of minimum-precision compute at a 5W power draw — the highest cost efficiency, power efficiency, and performance efficiency in the world, the company boasts. The final board ties everything together: a carrier board for the uCOM module, which includes a gigabit Ethernet port, USB ports, microSD card slot, MIPI Display Serial Interface (DSI) and parallel RGB video outputs plus a bundled DSI-to-HDMI adapter, a MIPI Camera Serial Interface (CSI) input, mikroBUS header, expansion connectors, and a dedicated debug interface.

 

The kit, which can run pre-trained models or custom models compiled with a toolkit available from DEEPX, is now available to order for “qualified projects” on the Virtium Embedded Artists website; the company has not publicly disclosed pricing.

 

 

 

News Source (1) – ‘Energy-Efficient DEEPX iMX8M Mini AI Kit (Hacksters.io)

News Source (2) – Embedded Artists 

DFI and DEEPX Unveil Revolutionary Edge AI at CES 2025 to Power Smart Cities and Industries

 

DFI, a global leader in embedded motherboards and industrial computers, will join DEEPX at CES 2025 to unveil new industrial edge AI platforms integrated with the DX-M1 AI accelerator, targeting smart city applications. This collaboration reflects a shared commitment to advancing on-device and application-specific AI, paving the way for a more flexible, efficient, and sustainable edge AI adoption.

 

According to Research and Markets, the global edge AI market is projected to grow at a 20.54% CAGR, increasing from US$23.571 billion in 2024 to US$59.978 billion by 2029. To meet the growing demand for scalable and energy-efficient AI solutions, DFI integrates the DEEPX DX-M1 AI accelerator into its industrial hardware platforms, delivering cutting-edge performance tailored to modern industry needs.

 

The DEEPX DX-M1 excels with the ability to process over 16 video channels on a single chip, achieve real-time performance exceeding 30 fps with GPU-level precision, and deliver up to 25 TOPs of AI power while minimizing energy consumption. This combination of power and efficiency enables simultaneous execution of advanced AI algorithms, such as object recognition and image classification, making it a versatile solution for applications in industrial robotics, machine vision, AI-driven IPC and HPC, smart factories, and beyond.

To demonstrate this vision, DFI will showcase two fan-less embedded systems—the EC710-ASL and EC600-RPS—featuring the DEEPX DX-M1 M.2 AI accelerator. These platforms are designed to meet critical real-time demands in smart cities, enabling applications like smart transportation, surveillance, and accident prevention. The system are powered by Intel® Atom® and Intel® 14th/13th/12th Gen processors, and support Intel® Time Coordinated Computing (Intel® TCC) technology for precise real-time operations while maintaining low power consumption and minimal latency.

 

DFI continues to push the boundaries of industrial-grade embedded solutions with its latest product innovations, including the ASL253 single-board computer powered by Intel® Atom® processors, the EB100-MTU NUC system featuring Intel® Core™ Ultra processors, proprietary Out-of-Band (OOB) modules, and the versatile DFI Workload Platform. These advancements not only boost hardware performance but also enhance remote management through OOB capabilities and optimize AI efficiency to meet the growing demands of edge AIoT applications.

 

News Source – Embedded Computing Design