DEEPX, a global leader in ultra-low-power, high-performance AI semiconductors, announced today that it will unveil its strategic vision to become a foundational “Physical AI Infrastructure Company” at CES 2026 in Las Vegas.

At CES 2026, DEEPX will present a new paradigm for AI infrastructure—one designed for the physical world. As AI expands beyond data centers into robots, mobility, smart cities, factories, and intelligent devices, DEEPX positions itself at the core of this transformation with energy-efficient, real-time AI semiconductors purpose-built for Physical AI.

Much like Arm reshaped the CPU industry through low-power innovation, DEEPX aims to establish a new global standard for Physical AI by delivering ultra-efficient AI accelerators. DEEPX enables intelligence to operate reliably and sustainably in real-world environments, addressing the critical constraints of power, heat, and cost.

DEEPX’s technology leadership has already been validated in the global market. In addition to winning two CES Innovation Awards in the Computing Hardware and Embedded Technologies categories, DEEPX-powered solutions have achieved the industry’s highest recognition. Notably U.S.-based partner Sixfab received the CES Best of Innovation Award for its ALPON X5 AI Gateway, powered by DEEPX’s first-generation AI chip, DX-M1. This success serves as a testament to DEEPX’s solutions being more than just a component supply; they are recognized as a core engine and a game changer that elevates global partners’ products to a world-class level.

DEEPX will host a dedicated booth at the Las Vegas Convention Center (LVCC), North Hall – AI & Robotics Zone (#8945). The exhibit will showcase real-world deployments of AI semiconductors across robotics, drones, factory automation, retail, and intelligent infrastructure, proving that Physical AI has moved beyond concept and into commercial-scale deployment.

At the booth, DEEPX will showcase performance targets for its next-generation DX-M2 AI chip, built on an advanced 2nm process. The DX-M2 is designed as a foundational infrastructure chip for the Physical AI era, solving the fundamental power and scalability limitations of data-center-centric architectures.

Furthermore, DEEPX will launch its Open-Source Physical AI Alliance, formed in collaboration with leading AI software ecosystems including Baidu PaddlePaddle and Ultralytics’ YOLO community. This initiative reflects DEEPX’s strategy to tightly integrate hardware and software, accelerating global adoption of Physical AI through open, developer-friendly platforms.

Key CES 2026 Events Hosted by DEEPX

1. Media Briefing
January 6, 2026 | LVCC South Connector S231 | 16:15 PM
DEEPX will present its next-generation ultra-low-power AI technologies and global partner expansion strategy, outlining a new industry standard for Physical AI infrastructure.

2. CES Foundry: Unstoppable Rise of Physical AI, Intelligented by DEEPX
January 8, 2026 | Fontainebleau Las Vegas, Azure Ballroom (Level 4) | 10:30 AM
An exclusive DEEPX-hosted forum featuring global leaders from Hyundai Motor Group Robotics Lab, Baidu, Wind River, Ultralytics, and the Edge AI Foundation. The session will explore real-world challenges and collaborative pathways for scaling Physical AI across industries.

“CES 2026 marks a pivotal moment for DEEPX—not just showcasing technology achievements, but demonstrating how Physical AI becomes real infrastructure through global partnerships,” said Lokwon Kim, CEO of DEEPX.