CES 2026 Foundry: DEEPX Declares the Era of Physical AI with Global Partners

DEEPX, a pioneer in AI semiconductor technology, successfully hosted the “CES 2026 Foundry” session, an
official media event organized by the Consumer Technology Association (CTA). At the event, DEEPX and its global partners unveiled scalable solutions designed to move artificial intelligence beyond data centers and establish a robust infrastructure for “Physical AI.”

 

Themed “The Unstoppable Rise of Physical AI,” the panel brought together industry heavyweights actively deploying mass-production AI. Discussions centered on the practical challenges and critical requirements for operating AI reliably in real-world physical environments.

 

Opening the session, Lokwon Kim, Founder and CEO of DEEPX, emphasized that Physical AI is no longer a futuristic concept but an immediate reality.

“The center of gravity in AI is shifting from the cloud to the physical world,” Kim stated. “To accelerate this transition, we must achieve a seamless integration of hardware and software that can withstand real-world constraints.”

 

The panel featured senior executives from Hyundai Motor Group Robotics Lab, Baidu, Edge AI Foundation, Ultralytics, and Wind River, representing a diverse ecosystem spanning robotics, edge platforms, open-source frameworks, and mission-critical systems. A consensus emerged among the panelists: across robotics, smart factories, and edge IT services, the industry demands reduced reliance on data centers, ultra-low power consumption, thermal efficiency, and stable 24/7 operation.

 

Dongjin Hyun, Executive Director at Hyundai Motor Group Robotics Lab, remarked: “Robotics is becoming core infrastructure for both society and industry. Physical AI enables robots to make autonomous decisions on-device, even in unstable network environments. Through our collaboration with DEEPX, we have validated on-device AI capabilities in real-world conditions and plan to deploy these solutions in
our next-generation robots and security systems starting in 2026.”

 

Addressing the software ecosystem, Raine Hua, Global Ecosystem AI Manager at Baidu, noted: “In the era of Physical AI, success isn’t just about model performance, it’s about consistency. Models must run
reliably anywhere. Our collaboration with DEEPX offers a streamlined path to deploy models at the edge without the need for repeated redesigns.”

 

Pete Bernard, CEO of Edge AI Foundation, highlighted the structural limitations of current architectures:
“Data-center-centric AI faces clear constraints regarding cost, power, and latency. DEEPX is establishing Physical AI as a foundational infrastructure by combining tangible performance with robust ecosystem development.” The discussion also tackled barriers to large-scale deployment, such as fragmented toolchains and the re-optimization burden during model porting.

 

Francesco Mattioli, Lead Partner Engineer at Ultralytics, commented: “Developers can build models
quickly, but deployment remains the bottleneck. Our partnership with DEEPX simplifies the journey from training to deployment, delivering real-world performance without requiring developers to become hardware experts.”

 

Sandeep Modhvadia, CPO at Wind River, offered a perspective on mission-critical systems: “For AI to serve as infrastructure in defense, aerospace, and industrial sectors, security, predictability, and long-term stability are non-negotiable. DEEPX’s solutions enable trusted systems that operate reliably in the field.”

 

During the event, DEEPX also introduced its initiative to build an open-source-based Physical AI alliance, stressing that the widespread adoption of Physical AI depends on delivering “plug-and-play” environments through collaborative ecosystems.

 

Through the CES 2026 Foundry, DEEPX cemented its position as a key provider of Physical AI infrastructure, combining ultra-low-power, high-performance silicon with a thriving global partnership network.

CES 2026 Media Briefing: DEEPX Unveils Physical AI Vision & Roadmap

DEEPX, a pioneer in ultra-low-power on-device AI semiconductors, today unveiled its next-generation roadmap at a global media briefing during CES 2026. Headlining the announcement is the DX-M2, the company’s second-generation AI processor designed to run Large Language Models (LLMs) of up to 100 billion parameters at under 5 watts—a breakthrough set to liberate generative AI from the constraints of cloud data centers.

 

DX-M2: Bringing Generative AI to the Edge (Sub-5W) The DX-M2 roadmap targets on-device inference for 20B–100B parameter LLMs, including Mixture-of-Experts (MoE) architectures, within a remarkably low power envelope of sub-5W. This represents a paradigm shift, migrating generative AI workloads from centralized servers to independent edge devices operating in the physical world.

 

“Running a 100B parameter LLM under 5 watts isn’t just a performance upgrade—it redefines the fundamental possibilities of AI infrastructure,” said Young Cho, Vice President of DEEPX. “Generative AI will no longer be tethered to the cloud. It will be ubiquitous, embedded directly into the machines that perceive and interact with our world.”

 

This vision positions the DX-M2 as a critical enabler for “Physical AI”—empowering real-world machines to process, interpret, and act autonomously without reliance on network connectivity or energy-intensive server farms.

 

Impact on Infrastructure & Sustainability DEEPX forecasts that distributing inference workloads across billions of edge devices could slash data center traffic by over 80%, offering a viable solution to current energy bottlenecks and escalating operational costs. The DX-M2 leverages architectural insights from the mass production of the first-generation DX-M1, featuring enhanced power management, superior thermal efficiency, and optimized software stacks.

 

Scaling the Ecosystem: 3 Strategic Pillars Building on the commercial success of the DX-M1 platform—now deployed in over 50 projects across robotics, defense, and industrial sectors—DEEPX introduced a three-pillar strategy to accelerate global adoption:

 

1. Open-Source Physical AI Alliance

Partners: Ultralytics, Baidu PaddlePaddle

DEEPX is establishing a developer-centric software ecosystem tailored for real-world deployment. By integrating with leading frameworks like Ultralytics and Baidu PaddlePaddle, DEEPX ensures a seamless workflow from model development to edge deployment, minimizing friction for engineers.

 

2. Global Distribution Network

Partners: Avnet, DigiKey, WPG

To streamline supply chains and improve accessibility, DEEPX has secured partnerships with major global distributors including Avnet, DigiKey, and WPG. Chips, development kits, and reference modules are now readily available, accelerating time-to-market for customers worldwide.

 

3. “AI Player” Dev-Kit

The newly launched AI Player Dev-Kit lowers the barrier to entry for edge AI. Designed to simplify model evaluation, benchmarking, and system validation, this tool shortens the cycle from prototyping to mass production, abstracting hardware complexity for developers and integrators.

 

 

“While the DX-M1 proved the viability of large-scale vision AI at the edge, the DX-M2 marks the inflection point for generative AI,” a DEEPX spokesperson noted. “Our mission is to decouple AI from the cost and energy limitations of traditional centralized infrastructure.”

Caption: DEEPX executives pose for a photo following the CES 2026 Media Briefing. (From left) Tim Park (Director of Strategic Marketing), Lokwon Kim (CEO), and Young Cho (CFO)

Caption: DEEPX executives pose for a photo following the CES 2026 Media Briefing. (From left) Tim Park (Director of Strategic Marketing), Lokwon Kim (CEO), and Young Cho (CFO)

DEEPX: CTA’s “What Not To Miss” for 2nd Year at CES 2026

CES

DEEPX, a global leader in ultra-low-power AI semiconductors, has been featured in the Consumer Technology Association’s(CTA) “What Not To Miss” guide for CES 2026, marking its second consecutive year on this prestigious list.

 

In the official CES 2026 guide, DEEPX is highlighted alongside industry titans such as AMD, NVIDIA, Qualcomm, and Samsung Electronics as a key innovator shaping the future of AI. 

Each year, the CTA curates a list of standout technologies and exhibitors that attendees should prioritize. The 2026 edition places special emphasis on practical AI technologies deployed in real-world physical environments—a domain where DEEPX is leading the charge.

 

DEEPX Makes a Bold Statement on the Main Floor. With the opening of CES 2026, DEEPX unveiled an expansive standalone booth (#8745) in the North Hall of the Las Vegas Convention Center (LVCC). 

 

The exhibition goes beyond merely showcasing semiconductor chips; it offers an immersive experience demonstrating how DEEPX’s “Physical AI” technology is live-operating across diverse industrial environments, including robotics, mobility, smart factories, and intelligent infrastructure.

 

Three Key Highlights at CES 2026 

Showcasing Leadership on the Global Main Stage: DEEPX takes center stage in the LVCC North Hall, the hub for the world’s leading tech companies. This move reinforces its transition from a promising startup to a global AI infrastructure provider.

 

Global “Physical AI Alliance” Showcase: The booth features commercially deployable AI solutions developed in collaboration with global partners, including Hyundai Motor Group Robotics Lab, Baidu PaddlePaddle, Ultralytics, Advantech, AAEON, Sixfab, Dell, Supermicro, Ampere, and HP, spanning hardware, software, and system integration.

 

Driving Real Business Results: DEEPX is hosting relay meetings in private conference rooms within the booth to facilitate pre-scheduled one-on-one discussions with global buyers, partners, and investors, aiming to accelerate tangible business partnerships and contracts.

 

Official CES Programs: Media Briefing & CES Foundry During CES 2026, DEEPX will host an official CTA Media Briefing, where the company will share its business strategy and next-generation AI semiconductor roadmap with global media.

 

Additionally, DEEPX has been selected as a featured participant in CES Foundry, CTA’s newly launched studio program focused on AI and quantum technologies. The Foundry brings together innovators, investors, and policymakers, with DEEPX joining industry leaders like AMD and NVIDIA in featured sessions.

DEEPX ramps up mass-production chip supply for the global market, bolstering tangible business expansion


AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.

Last month at CES 2025 – one of the world’s largest electronics trade shows – DEEPX was recognized as a “must-visit company” by the event’s organizer, the Consumer Technology Association (CTA), shining a spotlight on the global market. During the show, over 16,000 visitors stopped by the DEEPX booth, resulting in more than 100 requests for mass-production chip samples—strong indicators of the company’s expanding commercial prospects.

During CES, DEEPX showcased various applications of its chips in edge devices for smart cities, smart factories, and robotics, as well as in industrial equipment and edge servers for global enterprises. Demonstrations and on-site meetings were held with a wide range of customers and partners from the United States, Taiwan, Japan, and Europe. In addition, major Korean corporations, government officials, and investors visited the booth on tours to get a firsthand look at DEEPX’s technological strengths.

Among the highlights, DEEPX successfully ran its first-generation mass-production chips using AI algorithms developed by:

– Hyundai-Kia Motor Robotics Lab (robot platform)
– Inventec (smart factory)
– POSCO DX (smart factory & logistics automation)
– LG U+ (industrial and urban security)

This demonstration underscored the critical role of on-device AI semiconductors – beyond cloud-based approaches – in ushering in a new era of AI.

DEEPX also directly compared its solution to NVIDIA’s Jetson Orin, a GPU-based edge platform, demonstrating approximately 10 times the power efficiency and 20 times the price/performance efficiency of its own NPU-based product. By also conducting a ‘butter benchmark’ test against other leading global NPU technologies, DEEPX demonstrated its advantage in power efficiency, thermal management, and operational stability – critical factors for on-device AI.

To illustrate its broad compatibility, DEEPX showcased integrations with application processor (AP) systems-including NXP, Renesas, TI, Broadcom, Rockchip, and Intel-as well as small form factor computing solutions such as the popular Raspberry Pi. The company also demonstrated interoperability with partner industrial PCs and leading workstation and server systems from HP, Dell, Supermicro, Lenovo, Inventec, and others, highlighting the versatility and scalability of its solution.

Looking ahead, DEEPX will partner with LG U+ at MWC (Mobile World Congress) in Barcelona from March 3 to demonstrate on-device AI solutions powered by its first-generation chip. DEEPX will also host its own booth to showcase the roadmap for its DX-M2 on-device AI semiconductor, designed for large language models. Following MWC, DEEPX will head to Embedded World on March 11 in Nuremberg, Germany, where its products will be showcased at partner booths – including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, and Network Optix – as well as DEEPX’s own stand. The company will conduct additional live demos and meet with potential customers to explore new business opportunities.

News Source-(CTA) What Not to Miss at CES 2025