DEEPX Targets the European Market at ‘Embedded World 2026’, Building a Comprehensive Alliance with 10 Global Partners

  • DEEPX technology dominates the Embedded World exhibition in Germany, showcasing an overwhelming physical AI ecosystem.
  • Simultaneous real-time live demos of DEEPX products to be featured at the booths of 10 global leading companies, including Renesas, Avnet, and Raspberry Pi.
  • Unveiling the mass-produced DX-M1M module and physical AI integrated accelerator ‘DX-AIPlayer’, while collaborating with global semiconductor distributor Avnet Silica to penetrate the European market.

(March 10, 2026, Germany) — Global physical AI semiconductor company DEEPX (CEO Lokwon Kim) announced its aggressive move to capture the European market by participating in the world’s largest embedded electronic technology exhibition, ‘Embedded World 2026’, held in Germany.

 

‘Embedded World’ is the premier global exhibition where the latest technologies in the embedded electronics industry converge, serving as a core business platform for global leading companies in automotive, robotics, and more to share hardware and software innovations.

 

At this exhibition, DEEPX will demonstrate its unrivaled technological ecosystem. In addition to its standalone booth, DEEPX’s technology will be simultaneously showcased through real-time live demos at the booths of 10 global leading partner companies located throughout the exhibition hall. Following its momentum at CES earlier this year, this achievement proves that DEEPX is establishing itself as the “global standard for physical AI hardware” at the heart of the embedded industry.

 

The partner demo lineup across the exhibition hall includes:

  • Renesas Electronics: Will unveil over three types of industrial boards combining Renesas APs and DEEPX NPUs, presenting solutions applicable to smart factories. This collaboration between a global AP semiconductor company and an AI chip company is expected to draw significant attention.

     
  • Sixfab and Raspberry Pi: Will conduct a real-time smart traffic analysis demo using the CES 2026 Best of Innovation award-winning AI PC ‘ALPON X5’ equipped with DEEPX products, and will globally debut the AI HAT model equipped with the DX-M1.

     
  • AAEON (ASUS subsidiary), IEI, WeLink, Endrich, Toradex, and Lanner: Industrial system developers will demonstrate customized AI hardware solutions for smart cities, automated logistics, and security systems powered by DEEPX products.

     
  • Ultralytics & Network Optix: Ultralytics, the developer of the global vision AI standard YOLO model, will showcase the achievements of the “Open-Source Physical AI Alliance” running via a one-click process on the DEEPX NPU. Network Optix will demonstrate an intelligent Video Management System (VMS) integrating and managing thousands of cameras in real-time using DEEPX products.

     

Through these powerful partnerships with highly influential global distributors and module manufacturers in the European market, DEEPX is introducing a massive array of solutions that can be immediately applied to actual industrial sites. This solidifies its unique position as a ‘Physical AI Infrastructure Company’ enabling developers worldwide to instantly implement commercial-level AI functions.

 

Furthermore, DEEPX will unveil two core mass-production product lines designed to solve technical challenges in European industrial sectors:


  • DX-M1M (M.2 Module): A standard M.2 form factor module equipped with the high-performance DX-M1 AI chip. Its strong point is high scalability, allowing users to add powerful AI inference capabilities instantly by plugging it into existing industrial PCs or edge server slots.

     
  • DX-AIPlayer: An edge AI integrated acceleration solution combining the DEEPX NPU and a high-efficiency CPU board. As a ‘one-stop’ product supporting the entire process from model development to industrial platform deployment, it provides an optimal development environment to implement intelligent vision AI without complex configurations.

DEEPX signed a distribution agreement with Avnet Silica, a leader in global technology distribution, last year, securing a supply chain across Europe. Avnet Silica is currently expanding purchase contracts after discovering over 30 customers in high-performance embedded sectors such as smart city infrastructure, Autonomous Mobile Robots (AMR), machine vision, and smart factories. Through this joint exhibition, both companies plan to accelerate the commercialization and mass production diversification of DEEPX products throughout Europe.

 

A DEEPX representative stated, “Through mass production collaborations with hardware leaders like Renesas and Raspberry Pi, as well as software standard companies like Baidu and Ultralytics, DEEPX aims to become the ‘physical AI hardware standard’ that developers worldwide choose first.” The representative added, “As Europe is the most active market for adopting physical AI in smart factories, robotics, and automotive, we will begin our global revenue growth in earnest based on these achievements.”

South Korea’s DEEPX to supply AI chips for Baidu’s drones and robots

South Korean AI semiconductor developer DeepX has struck a deal to supply chips for Chinese tech giant Baidu, targeting applications in drones and robotics.

The partnership will integrate DeepX’s processors with Baidu’s PaddlePaddle open-source deep learning framework to co-develop AI solutions for global industrial markets.
According to Yonhap News Agency and TheElec, Baidu said the agreement will broaden edge AI applications from optical character recognition (OCR) in documents and images to autonomous aerial and robotic systems.

Performance rivals Nvidia, with lower power draw
DeepX’s DX-M1 AI chip is now fully compatible with the fifth-generation PP-OCR model on PaddlePaddle. Baidu said the jointly developed recognition system outperformed Nvidia’s GeForce RTX 2080 Ti in key benchmarks, delivering superior performance and energy efficiency.
The chip’s low-power, high-performance profile makes it well-suited for battery-constrained industrial AI devices such as inspection robots, equipment monitors, and automated document processors, enabling faster, more accurate, and longer-lasting operations.
Baidu plans to deliver the DX-M1 to around 20 customers, including drone manufacturers, with mass production to follow initial orders. The companies aim to extend their collaboration beyond OCR into a broader range of physical AI applications.

Next-gen chips for Baidu’s ERNIE 4.5
The two firms have also begun proof-of-concept testing of DeepX’s upcoming DX-M2 chip with Baidu’s large vision model (VLM) ERNIE 4.5. Early results show that ERNIE 4.5 maintains high accuracy while operating stably in ultra-low-power environments.
Because DeepX’s semiconductors are designed for edge computing rather than large-scale AI training servers, the products fall outside the scope of US export restrictions on China-bound AI chips.

News Source – https://www.digitimes.com/news/a20250812PD207/deepx-baidu-industrial-chips-ocr.html