DEEPX Signs Strategic Partnership with Avnet Silica, Accelerating Expansion into theEMEA

 
  • DEEPX to expand the supply of ultra-low-power NPUs across Europe, the Middle East, and Africa through Avnet’s global distribution network.
  • Delivering South Korean AI semiconductor innovation to core European industries, including smart cities and robotics.

DEEPX, a pioneer in ultra-low-power on-device AI semiconductors, today announced the signing of a new franchise agreement with Avnet Silica, the semiconductor specialist division of Avnet (NASDAQ: AVT), a leading global technology distributor. This strategic partnership marks the full-scale launch of DEEPX’s expansion into the European market.


This collaboration combines DEEPX’s world-class low-power, high-performance AI semiconductor technology with Avnet Silica’s extensive global supply chain to proactively address the rapidly growing demand in the Edge AI market.


Engineers across Europe’s industrial sectors face a critical challenge: delivering high-performance AI computing within strict power and thermal constraints. Traditional microcontrollers (MCUs) often lack the necessary performance, while GPUs consume too much power for widespread edge deployment.


Through this partnership, DEEPX positions itself as the solution to bridge this technological gap. Customers across the EMEA (Europe, Middle East, and Africa) region can now easily access DEEPX’s NPU solutions through Avnet Silica’s distribution network. The adoption of DEEPX chips is expected to accelerate, particularly in high-performance embedded applications such as smart city infrastructure, autonomous mobile robots (AMRs), machine vision, and smart factories.


“We are continually focused on helping our customers bridge the gap between high-performance AI demands and the realities of constrained power budgets at the Edge,” said Michael Uyttersprot, Manager System Solutions, AI/ML & Vision System Solutions at Avnet Silica. “DEEPX delivers the essential NPU architecture and efficiency required to deploy sophisticated models in power- and thermal-sensitive environments, significantly enhancing the options across our existing linecard.”

 

“We are excited to partner with Avnet, a world-class technology distributor with deep expertise in bringing cutting-edge solutions to market,” said Tim Park, Strategy Marketing Director at DEEPX. “ By combining Avnet’s global reach and design support capabilities with  DEEPX’s ultra-efficient Edge AI NPUs, we will help customers build AI systems that are more scalable, more sustainable, and easier to deploy. Together, we aim to accelerate the shift from data center-centric AI to a new era of Physical AI at the edge.”

 

Starting with this agreement, DEEPX plans to broaden its touchpoints with local customers
through major industrial exhibitions and technical seminars in Europe, further solidifying its
position in the global AI semiconductor market.

 

DEEPX in AVNET Product Shop: View URL Link

DEEPX is heading to COMPUTEX 2025

 

We’re thrilled to announce our presence at Computex 2025, where our groundbreaking on-device AI solutions will be showcased not just at our booth, but across an impressive lineup of partner exhibits throughout the venue!


What does it mean when over 10 leading hardware manufacturers choose to feature DEEPX technology in their own booths? It’s a powerful validation of our reliability-first approach to AI innovation. After rigorous testing with more than 300 global enterprises through our Early Engagement Customer Program, our AI chips have consistently proven their exceptional capabilities.

💡These industry leaders recognize what sets DEEPX apart:
– Advanced Thermal Efficiency
– GPU-level of AI Accuracy
– Unmatched AI Performance
– Industry-Leading TCO

Particularly noteworthy is our strong adoption among Industrial PC manufacturers – partners who operate in the harshest environments where failure is simply not an option. Our partnership network throughout the exhibition is a testament to how DEEPX is becoming the trusted foundation for AI applications.

Visit DEEPX at booth 4F, L0409 during May 20-23 at Taipei Nangang Exhibition Center to witness firsthand how we’re setting new standards for reliable on-device AI.

 

Virtium Embedded Artists Introduces Integrated AI Accelerator DEEPX DX-M1 and iMX8M Mini Kit

DEEPX DX-M1 & i.MX8M Mini

 

Industrial and embedded computing specialist Virtium Embedded Artists has announced the launch of the DEEPX iMX8M Mini AI Kit, developed in partnership with DEEPX: a single-board computer (SBC) style development bundle with an “AI Booster” delivering 25 tera-operations per second (TOPS) of compute at a 5W power draw for on-device machine learning (ML) and artificial intelligence (AI) workloads.

 

“This product redefines the limits of edge AI performance, delivering unparalleled power and cost efficiency,” claims Virtium Embedded Artists managing director Anders Rosvall of the company’s newest launch. “The DEEPX iMX8M Mini AI Kit simplifies the evaluation process for design engineers, enabling them to determine if our solution meets their application requirements while accelerating time to market.”

 

The DEEPX iMX8M Mini AI Kit isn’t a true single-board computer, though it can be treated like one; rather, it’s three boards bundled together. The first is an iMX8M Mini uCOM computer-on-module, built around NXP Semiconductor’s i.MS 8M Mini processor — giving it four Arm Cortex-A53 cores running at up to 1.8GHz and a Cortex-M4 core running at up to 400MHz, a VeriSilicon Vivante GC Nano Ultra 2D graphics processor, and GC320 3D graphics processor. To this the company has added 1GB of LPDDR4 memory and 8GB of on-board eMMC storage.

 

The second board is DEEPX’s contribution: an M.2 module with the company’s DX-M1 AI Booster, delivering a claimed 25 tera-operations per second (TOPS) of minimum-precision compute at a 5W power draw — the highest cost efficiency, power efficiency, and performance efficiency in the world, the company boasts. The final board ties everything together: a carrier board for the uCOM module, which includes a gigabit Ethernet port, USB ports, microSD card slot, MIPI Display Serial Interface (DSI) and parallel RGB video outputs plus a bundled DSI-to-HDMI adapter, a MIPI Camera Serial Interface (CSI) input, mikroBUS header, expansion connectors, and a dedicated debug interface.

 

The kit, which can run pre-trained models or custom models compiled with a toolkit available from DEEPX, is now available to order for “qualified projects” on the Virtium Embedded Artists website; the company has not publicly disclosed pricing.

 

 

 

News Source (1) – ‘Energy-Efficient DEEPX iMX8M Mini AI Kit (Hacksters.io)

News Source (2) – Embedded Artists