You knew DX-M1 as the eyes of Edge AI. Ultra-low power. High performance. Budget-friendly. The perfect vision chip. But eyes alone? That was getting boring. So we gave it a mouth.
DX-M1 now runs SLMs (Small Language Models) fully on-device.Before: Sees everything. Says nothing.
Now: Sees it. Thinks. Talks back. In real time.Same low power. Same cost. Brand new voice.
No internet. No latency. Just intelligence.
딥엑스는 2일 일본 도쿄에서 열린 ‘Physical AI 박람회 2026’ 현장에서 고시다텍과 전략적 파트너십 계약을 체결했다고 밝혔다. 이번 협약에 따라 양사는 일본 시장에서 엣지 AI의 활용과 보급을 확대하기 위해 딥엑스의 신경망처리장치(NPU) 제품군을 현지 산업 현장에 확산하는 작업을 공동으로 추진한다.
고시다테크는 일본 내 고객 네트워크와 시장 이해도를 바탕으로 프로젝트 발굴, 제품 제안, 고객 대응, 공급 확대 등을 담당한다. 딥엑스는 NPU 제품군과 소프트웨어 개발환경, 레퍼런스 플랫폼, 기술 지원 등을 제공해 현지 고객사의 제품 개발과 양산을 뒷받침할 계획이다.
이번 협력으로 딥엑스의 글로벌 공급망도 한층 강화됐다. 딥엑스는 현재 에브넷(AVNET), 더블유피지(WPG), 마크니카(Macnica), 시리얼(Serial), 디지털 차이나(Digital China), 디지키(DigiKey) 등 20여 개 글로벌 유통사와의 파트너십을 통해 북미, 중화권, 동남아 등 주요 거점의 고객망을 확보하고 있다. 고시다테크와의 이번 협약은 이러한 글로벌 네트워크를 바탕으로 일본 시장 내 엣지 AI 상용화에 속도를 내는 계기가 될 것으로 기대된다.
고시다테크는 1930년 설립된 일본 기술 유통 및 솔루션 기업이다. 자동차, 반도체, 휴대전화, 사물인터넷(IoT), 인공지능(AI) 등 다양한 산업 분야에서 사업을 전개해왔다.
일본은 딥엑스가 주목하는 핵심 시장 중 하나다. 제조, 로봇, 자동차, 산업 자동화, 보안·사회 인프라 분야의 경쟁력이 높은 데다 고령화와 인력 부족으로 현장의 무인화·지능화 수요가 커지고 있기 때문이다. 특히 공장, 물류센터, 건설 현장, 보안카메라, 도시 인프라 등 데이터를 클라우드로 보내지 않고 현장에서 바로 처리해야 하는 영역이 많아 엣지 AI 반도체에 대한 잠재 수요가 큰 시장으로 평가된다.
딥엑스의 주력 NPU인 디엑스-M1(DX-M1)은 5나노 공정 기반의 초저전력 AI 반도체다. 25TOPS급 AI 연산 성능을 제공하면서도 3~5W 수준의 저전력 구동을 목표로 설계됐으며, 보안카메라, 산업용 컴퓨터, 로봇, 드론, 스마트팩토리 장비, 엣지 서버 등에 적용될 수 있다.
김녹원 딥엑스 대표는 “일본 파트너와의 협력을 통해 딥엑스 NPU가 실제 산업 현장에서 상용화되는 사례를 하나씩 늘려가는 것이 목표”라며 “한국에서 개발한 초저전력 AI 반도체 기술을 글로벌 제조·인프라 현장에 실질적으로 적용해 나가겠다”고 말했다.
고시다 케이 고시다테크 이사 겸 집행임원은 “딥엑스와 전략적 파트너십을 체결하게 돼 매우 기쁘다”며 “일본 시장에서 엣지 AI에 대한 관심과 수요가 빠르게 증가하고 있다”고 말했다. 이어 “제조 현장과 사회 인프라 현장에서 AI를 활용하려는 요구도 늘고 있다”며 “고시다테크의 일본 내 네트워크와 시장 지식을 바탕으로 딥엑스와 프로젝트 수주와 사업 확대를 추진하겠다”고 밝혔다.
DEEPX NPU to be integrated across AAEON’s full lineup of industrial computers, SBCs, and edge gateways — three-year mass production cooperation targeting smart factories, robotics, smart cities, and beyond
DEEPX Inc. (CEO Lokwon Kim), an ultra-low-power Physical AI semiconductor company, today signed a three-year Mass Production Cooperation MOU with AAEON Technology Inc. (TWSE: 6579, CEO Howard Lin), a leading provider of advanced industrial and embedded AI computing platforms, at COMPUTEX TAIPEI 2026. The signing ceremony took place at the DEEPX exhibition booth in Hall 1 of the Taipei Nangang Exhibition Center, with both CEOs in attendance.
AAEON is one of Taiwan’s foremost industrial computing companies, supplying industrial computers (IPC), embedded boards, and edge computing hardware to global markets. Under this agreement, the two companies will pursue a three-year commercialization cooperation to integrate DEEPX’s AI semiconductors (NPU) across AAEON’s key hardware product lines, including IPC, Single Board Computers (SBC), and edge gateways.
Going beyond a simple technology review, the core objective of this MOU is to embed DEEPX AI semiconductors into global industrial hardware product lines and scale them into commercially mass-producible products. The two companies have agreed to establish a mass production system for AI accelerator modules in standard form factors — M.2, mPCIe, PCIe cards, and COM Express boards — while also collaborating on OEM/ODM-based edge AI product development and large-scale production tailored to customer demand.
DEEPX will supply AI semiconductor chipsets and dedicated compiler and SDK support optimized for AAEON’s product lines, while AAEON will lead hardware design, board form-factor specification matching, and the development of dedicated product lineups. Target sectors span smart factories and Industry 4.0, autonomous robots and AMR/AGV, smart cities, intelligent transportation, healthcare, retail, edge security, and smart agriculture.
This mass production agreement was made possible by the unrivaled business traction and commercial momentum that both companies have already demonstrated in global industrial environments. AAEON’s next-generation industrial computing platforms — powered by DEEPX’s production-ready semiconductors — secured initial pre-orders immediately following official certification in December 2025.
In particular, as ongoing mass-production verification with major global customers has validated exceptional power-to-performance ratios and system stability that exceed all expectations in real-world conditions, the transition from initial verification orders to large-scale commercial mass production and global scale-up is now well underway.
At COMPUTEX TAIPEI 2025, DEEPX had established a partner network of approximately 15 companies spanning Taiwan’s industrial hardware landscape. One year on, that ecosystem has more than doubled — growing to over 30 partners globally — reflecting the accelerating industry demand for DEEPX’s on-device AI semiconductor solutions across robotics, smart manufacturing, security, healthcare, and smart city applications.
The AAEON agreement adds significant new momentum to this trajectory: with AAEON’s extensive global distribution channels, DEEPX gains substantially expanded market reach through a single strategic partnership. The two companies also plan to jointly pursue further market expansion at major global exhibitions including COMPUTEX, CES, and Embedded World, as well as through shared online and offline marketing channels.
Please be advised that an entity located in Hanoi, Vietnam, operating under the name ‘DEEPX SOLUTIONS JSC’, has been found to be unauthorizedly using our corporate name.
In particular, the website operated by this entity (deepx.com.vn) has illegally copied and utilized photos of DEEPX’s proprietary NPU products, along with photos of our CEO Lokwon Kim’s CES presentations, to disguise itself as our official channel.
[사칭 주의 공지] 베트남 현지 사칭 업체 및 저작권 도용 웹사이트 주의 안내
DEEPX를 찾아주신 고객 여러분께 알려드립니다. 최근 베트남 하노이 소재의 ‘DEEPX SOLUTIONS JSC’라는 법인이 당사의 상호를 무단 도용하고 있는 사실이 확인되었습니다.
특히 해당 업체가 운영하는 웹사이트(deepx.com.vn)는 딥엑스의 독자적인 NPU 제품 사진과 김녹원 대표이사의 CES 발표 사진 등을 불법 복제 및 도용하여 공식 채널처럼 위장하고 있습니다.
DEEPX South Korea Headquarters clarifies that we have no legal or business relationship with this Vietnamese entity or website. Any proposals or communications originating from their domain (e.g., admin@deepx.com.vn) are entirely fraudulent.
To protect our intellectual property and stakeholders, we are immediately pursuing all available civil and criminal legal actions to hold this entity strictly accountable.
Please note that the only official website domain for DEEPX is deepx.ai. We urge you to exercise caution to avoid any potential damages from this misleading website.
DEEPX 한국 본사는 해당 베트남 법인 및 웹사이트와 어떠한 법적 관계도 없음을 명백히 밝힙니다. 따라서 해당 메일 주소(예: admin@deepx.com.vn)로부터 발송된 모든 제안이나 연락은 불법 사칭 행위입니다.
당사는 본 건에 대해 자사의 지식재산권 보호를 위해 민·형사상 가능한 모든 법적 조치를 즉각 실행하여 엄중한 책임을 물을 예정입니다.
당사의 공식 웹사이트 도메인은 deepx.ai 단 하나뿐입니다. 외관이 유사한 사칭 사이트에 속아 선의의 피해가 발생하지 않도록 각별히 유의하시기 바랍니다.
DEEPX, a leading fabless AI semiconductor company specializing in ultra-low-power Neural Processing Units (NPUs), today announced a visionary partnership with Ultralytics, the company behind Ultralytics YOLO, the most widely deployed computer vision architecture in the world, with over 130K GitHub stars.
Ultralytics has evolved far beyond a traditional AI model creator to become the definitive developer platform connecting the global vision AI ecosystem. Ultralytics YOLO (You Only Look Once) models and Ultralytics Platform have firmly established themselves as the de facto standard across diverse physical applications—from industrial cameras and robotics to autonomous driving and smart city infrastructure. With over 16.6 million monthly downloads and a single environment to build computer vision projects, they serve as the ultimate gateway for global AI deployment, acting as the core development environment for countless global enterprises and engineers building real-world AI products and services.
This partnership is not merely a technical integration; it is a strategic move to establish a unified global standard for Physical AI. By embedding DEEPX’s NPU hardware and software toolchain directly into the heart of the Ultralytics ecosystem, the two companies are providing millions of global developers with the definitive platform to bring AI out of the cloud and into the physical world.
Physical AI demands high-performance, ultra-energy-efficient computing that can operate autonomously in robots, industrial machinery, and smart vehicles. The Ultralytics YOLO community represents the front line of this revolution, building the “eyes” of these real-world systems. Through this partnership, DEEPX positions its mass-produced DX-M1 NPU as the foundational “brain” for these applications, removing all barriers to entry for edge deployment.
This alliance is about setting the de facto standard for Physical AI. The YOLO community is home to the most innovative computer vision developers on the planet. By making DEEPX a native, frictionless export target within the Ultralytics ecosystem, we are not just offering hardware—we are defining the new global blueprint for how real-world intelligent systems are built and scaled.
Setting the Standard for Physical AI: Partnership Highlights
Ultralytics is committed to democratizing AI by building state-of-the-art vision AI models that run flawlessly on the most efficient edge architectures. Partnering with DEEPX allows our massive developer community to seamlessly translate our Ultralytics YOLO models into powerful, low-power Physical AI solutions. Together, we are shaping how vision AI interacts with the physical world.
The AI industry is rapidly shifting from data center-centric models to a Physical AI era, where intelligence expands into real-world systems. The next five years will be decisive in reshaping the industry. In the Physical AI era, ultra-low-power computing technology capable of running AI in real- world systems — robots, vehicles, industrial devices — will become the core infrastructure. DEEPX aims to become the global leader in Physical AI computing platforms that power AI across robotics and industrial systems.
DEEPX, a pioneer in ultra-low-power AI semiconductor technology, and Hyundai Motor Group Robotics LAB have announced a strategic collaboration to jointly develop a next-generation Physical AI computing
platform for advanced robotics.
The two companies parties will co-develop a next-generation AI computing architecture capable
of running large-scale generative AI models in real time within robotic systems, with the goal of
building an integrated Physical AI platform purpose-built for robotics. This partnership goes beyond a simple technology exchange — it represents a strategic collaboration to jointly architect the core computing infrastructure for next-generation robot platforms.
The robotics AI field is increasingly centered on Vision-Language-Action (VLA) and Vision-Language Model (VLM) technologies — enabling robots to perceive their surroundings through cameras, understand natural language commands, and make autonomous decisions. These technologies are considered essential to the evolution of robots from simple automated machines into intelligent systems that can see, understand, and act.
To enable stable deployment of these next-generation AI capabilities in real-world robotic environments, the two companies will collaborate across the following areas:
• Ultra-low-power AI semiconductor architecture
• AI computing hardware systems for robotics
• Physical AI software stack
• Robotics application AI libraries
The ultimate goal is to build a unified AI computing platform capable of running large-scale AI
models in real time within robotic systems. At the center of this collaboration is DEEPX’s next-generation AI chip, the DX-M2. Designed to run large-scale AI models in ultra-low-power environments, DX-M2 is a Physical GenAI semiconductor being developed as the computing platform for real-time AI inference in
physical AI environments — including robotics, autonomous mobile systems, and industrial automation.
Its ultra-low-power, high-performance AI computing architecture enables on-device AI inference within robots, expected to significantly enhance robotic autonomy and response speed. While AI has historically been driven by data center infrastructure, the industry is now entering the era of Physical AI — where intelligent systems extend into robots, industrial equipment, and autonomous mobile platforms.
In the era of Physical AI, robots are becoming the closest point of contact between AI technology and people. At Hyundai Motor Group Robotics LABab, our goal is to create robots that can naturally coexist with humans — robots worth living with and working with. To achieve this, we are strategically building a core technology ecosystem — including on-device AI computing — in collaboration with specialized partners across industries worldwide.
In this landscape, robots and humanoids are emerging as the most critical Physical AI
platforms, directly interfacing AI with the real world. The Physical AI semiconductor market is projected to reach approximately $123 billion by 2030, with robotics and humanoids expected to be the primary demand drivers.
DEEPX and Hyundai Motor Group Robotics LAB have been jointly developing edge brain
technology for robotics based on low-power AI semiconductors over the past three years. This
new collaboration expands that foundation into the domain of next-generation robotic AI.
Industry observers anticipate that the robotics sector will develop a new industrial ecosystem
centered on standardized computing platforms — similar to what occurred in the semiconductor
industry. The emergence of large-scale manufacturing infrastructure combined with Physical AI
computing platforms is expected to reshape the structure of the entire robotics industry.
(March 10, 2026, Germany) — Global physical AI semiconductor company DEEPX (CEO Lokwon Kim) announced its aggressive move to capture the European market by participating in the world’s largest embedded electronic technology exhibition, ‘Embedded World 2026’, held in Germany.
‘Embedded World’ is the premier global exhibition where the latest technologies in the embedded electronics industry converge, serving as a core business platform for global leading companies in automotive, robotics, and more to share hardware and software innovations.
At this exhibition, DEEPX will demonstrate its unrivaled technological ecosystem. In addition to its standalone booth, DEEPX’s technology will be simultaneously showcased through real-time live demos at the booths of 10 global leading partner companies located throughout the exhibition hall. Following its momentum at CES earlier this year, this achievement proves that DEEPX is establishing itself as the “global standard for physical AI hardware” at the heart of the embedded industry.
The partner demo lineup across the exhibition hall includes:
Renesas Electronics: Will unveil over three types of industrial boards combining Renesas APs and DEEPX NPUs, presenting solutions applicable to smart factories. This collaboration between a global AP semiconductor company and an AI chip company is expected to draw significant attention.
Sixfab and Raspberry Pi: Will conduct a real-time smart traffic analysis demo using the CES 2026 Best of Innovation award-winning AI PC ‘ALPON X5’ equipped with DEEPX products, and will globally debut the AI HAT model equipped with the DX-M1.
AAEON (ASUS subsidiary), IEI, WeLink, Endrich, Toradex, and Lanner: Industrial system developers will demonstrate customized AI hardware solutions for smart cities, automated logistics, and security systems powered by DEEPX products.
Ultralytics & Network Optix: Ultralytics, the developer of the global vision AI standard YOLO model, will showcase the achievements of the “Open-Source Physical AI Alliance” running via a one-click process on the DEEPX NPU. Network Optix will demonstrate an intelligent Video Management System (VMS) integrating and managing thousands of cameras in real-time using DEEPX products.
Through these powerful partnerships with highly influential global distributors and module manufacturers in the European market, DEEPX is introducing a massive array of solutions that can be immediately applied to actual industrial sites. This solidifies its unique position as a ‘Physical AI Infrastructure Company’ enabling developers worldwide to instantly implement commercial-level AI functions.
Furthermore, DEEPX will unveil two core mass-production product lines designed to solve technical challenges in European industrial sectors:
DX-M1M (M.2 Module): A standard M.2 form factor module equipped with the high-performance DX-M1 AI chip. Its strong point is high scalability, allowing users to add powerful AI inference capabilities instantly by plugging it into existing industrial PCs or edge server slots.
DX-AIPlayer: An edge AI integrated acceleration solution combining the DEEPX NPU and a high-efficiency CPU board. As a ‘one-stop’ product supporting the entire process from model development to industrial platform deployment, it provides an optimal development environment to implement intelligent vision AI without complex configurations.
DEEPX signed a distribution agreement with Avnet Silica, a leader in global technology distribution, last year, securing a supply chain across Europe. Avnet Silica is currently expanding purchase contracts after discovering over 30 customers in high-performance embedded sectors such as smart city infrastructure, Autonomous Mobile Robots (AMR), machine vision, and smart factories. Through this joint exhibition, both companies plan to accelerate the commercialization and mass production diversification of DEEPX products throughout Europe.
A DEEPX representative stated, “Through mass production collaborations with hardware leaders like Renesas and Raspberry Pi, as well as software standard companies like Baidu and Ultralytics, DEEPX aims to become the ‘physical AI hardware standard’ that developers worldwide choose first.” The representative added, “As Europe is the most active market for adopting physical AI in smart factories, robotics, and automotive, we will begin our global revenue growth in earnest based on these achievements.”
DEEPX, a pioneer in AI semiconductor technology, successfully hosted the “CES 2026 Foundry” session, an
official media event organized by the Consumer Technology Association (CTA). At the event, DEEPX and its global partners unveiled scalable solutions designed to move artificial intelligence beyond data centers and establish a robust infrastructure for “Physical AI.”
Themed “The Unstoppable Rise of Physical AI,” the panel brought together industry heavyweights actively deploying mass-production AI. Discussions centered on the practical challenges and critical requirements for operating AI reliably in real-world physical environments.
Opening the session, Lokwon Kim, Founder and CEO of DEEPX, emphasized that Physical AI is no longer a futuristic concept but an immediate reality.
“The center of gravity in AI is shifting from the cloud to the physical world,” Kim stated. “To accelerate this transition, we must achieve a seamless integration of hardware and software that can withstand real-world constraints.”
The panel featured senior executives from Hyundai Motor Group Robotics Lab, Baidu, Edge AI Foundation, Ultralytics, and Wind River, representing a diverse ecosystem spanning robotics, edge platforms, open-source frameworks, and mission-critical systems. A consensus emerged among the panelists: across robotics, smart factories, and edge IT services, the industry demands reduced reliance on data centers, ultra-low power consumption, thermal efficiency, and stable 24/7 operation.
Dongjin Hyun, Executive Director at Hyundai Motor Group Robotics Lab, remarked: “Robotics is becoming core infrastructure for both society and industry. Physical AI enables robots to make autonomous decisions on-device, even in unstable network environments. Through our collaboration with DEEPX, we have validated on-device AI capabilities in real-world conditions and plan to deploy these solutions in
our next-generation robots and security systems starting in 2026.”
Addressing the software ecosystem, Raine Hua, Global Ecosystem AI Manager at Baidu, noted: “In the era of Physical AI, success isn’t just about model performance, it’s about consistency. Models must run
reliably anywhere. Our collaboration with DEEPX offers a streamlined path to deploy models at the edge without the need for repeated redesigns.”
Pete Bernard, CEO of Edge AI Foundation, highlighted the structural limitations of current architectures:
“Data-center-centric AI faces clear constraints regarding cost, power, and latency. DEEPX is establishing Physical AI as a foundational infrastructure by combining tangible performance with robust ecosystem development.” The discussion also tackled barriers to large-scale deployment, such as fragmented toolchains and the re-optimization burden during model porting.
Francesco Mattioli, Lead Partner Engineer at Ultralytics, commented: “Developers can build models
quickly, but deployment remains the bottleneck. Our partnership with DEEPX simplifies the journey from training to deployment, delivering real-world performance without requiring developers to become hardware experts.”
Sandeep Modhvadia, CPO at Wind River, offered a perspective on mission-critical systems: “For AI to serve as infrastructure in defense, aerospace, and industrial sectors, security, predictability, and long-term stability are non-negotiable. DEEPX’s solutions enable trusted systems that operate reliably in the field.”
During the event, DEEPX also introduced its initiative to build an open-source-based Physical AI alliance, stressing that the widespread adoption of Physical AI depends on delivering “plug-and-play” environments through collaborative ecosystems.
Through the CES 2026 Foundry, DEEPX cemented its position as a key provider of Physical AI infrastructure, combining ultra-low-power, high-performance silicon with a thriving global partnership network.
DEEPX, a pioneer in ultra-low-power on-device AI semiconductors, today unveiled its next-generation roadmap at a global media briefing during CES 2026. Headlining the announcement is the DX-M2, the company’s second-generation AI processor designed to run Large Language Models (LLMs) of up to 100 billion parameters at under 5 watts—a breakthrough set to liberate generative AI from the constraints of cloud data centers.
DX-M2: Bringing Generative AI to the Edge (Sub-5W) The DX-M2 roadmap targets on-device inference for 20B–100B parameter LLMs, including Mixture-of-Experts (MoE) architectures, within a remarkably low power envelope of sub-5W. This represents a paradigm shift, migrating generative AI workloads from centralized servers to independent edge devices operating in the physical world.
“Running a 100B parameter LLM under 5 watts isn’t just a performance upgrade—it redefines the fundamental possibilities of AI infrastructure,” said Young Cho, Vice President of DEEPX. “Generative AI will no longer be tethered to the cloud. It will be ubiquitous, embedded directly into the machines that perceive and interact with our world.”
This vision positions the DX-M2 as a critical enabler for “Physical AI”—empowering real-world machines to process, interpret, and act autonomously without reliance on network connectivity or energy-intensive server farms.
Impact on Infrastructure & Sustainability DEEPX forecasts that distributing inference workloads across billions of edge devices could slash data center traffic by over 80%, offering a viable solution to current energy bottlenecks and escalating operational costs. The DX-M2 leverages architectural insights from the mass production of the first-generation DX-M1, featuring enhanced power management, superior thermal efficiency, and optimized software stacks.
Scaling the Ecosystem: 3 Strategic Pillars Building on the commercial success of the DX-M1 platform—now deployed in over 50 projects across robotics, defense, and industrial sectors—DEEPX introduced a three-pillar strategy to accelerate global adoption:
1. Open-Source Physical AI Alliance
Partners: Ultralytics, Baidu PaddlePaddle
DEEPX is establishing a developer-centric software ecosystem tailored for real-world deployment. By integrating with leading frameworks like Ultralytics and Baidu PaddlePaddle, DEEPX ensures a seamless workflow from model development to edge deployment, minimizing friction for engineers.
2. Global Distribution Network
Partners: Avnet, DigiKey, WPG
To streamline supply chains and improve accessibility, DEEPX has secured partnerships with major global distributors including Avnet, DigiKey, and WPG. Chips, development kits, and reference modules are now readily available, accelerating time-to-market for customers worldwide.
3. “AI Player” Dev-Kit
The newly launched AI Player Dev-Kit lowers the barrier to entry for edge AI. Designed to simplify model evaluation, benchmarking, and system validation, this tool shortens the cycle from prototyping to mass production, abstracting hardware complexity for developers and integrators.
“While the DX-M1 proved the viability of large-scale vision AI at the edge, the DX-M2 marks the inflection point for generative AI,” a DEEPX spokesperson noted. “Our mission is to decouple AI from the cost and energy limitations of traditional centralized infrastructure.”
Caption: DEEPX executives pose for a photo following the CES 2026 Media Briefing. (From left) Tim Park (Director of Strategic Marketing), Lokwon Kim (CEO), and Young Cho (CFO)
Caption: DEEPX executives pose for a photo following the CES 2026 Media Briefing. (From left) Tim Park (Director of Strategic Marketing), Lokwon Kim (CEO), and Young Cho (CFO)
DEEPX, a global leader in ultra-low-power AI semiconductors, has been featured in the Consumer Technology Association’s(CTA) “What Not To Miss” guide for CES 2026, marking its second consecutive year on this prestigious list.
In the official CES 2026 guide, DEEPX is highlighted alongside industry titans such as AMD, NVIDIA, Qualcomm, and Samsung Electronics as a key innovator shaping the future of AI.
Each year, the CTA curates a list of standout technologies and exhibitors that attendees should prioritize. The 2026 edition places special emphasis on practical AI technologies deployed in real-world physical environments—a domain where DEEPX is leading the charge.
DEEPX Makes a Bold Statement on the Main Floor. With the opening of CES 2026, DEEPX unveiled an expansive standalone booth (#8745) in the North Hall of the Las Vegas Convention Center (LVCC).
The exhibition goes beyond merely showcasing semiconductor chips; it offers an immersive experience demonstrating how DEEPX’s “Physical AI” technology is live-operating across diverse industrial environments, including robotics, mobility, smart factories, and intelligent infrastructure.
Three Key Highlights at CES 2026
Showcasing Leadership on the Global Main Stage: DEEPX takes center stage in the LVCC North Hall, the hub for the world’s leading tech companies. This move reinforces its transition from a promising startup to a global AI infrastructure provider.
Global “Physical AI Alliance” Showcase: The booth features commercially deployable AI solutions developed in collaboration with global partners, including Hyundai Motor Group Robotics Lab, Baidu PaddlePaddle, Ultralytics, Advantech, AAEON, Sixfab, Dell, Supermicro, Ampere, and HP, spanning hardware, software, and system integration.
Driving Real Business Results: DEEPX is hosting relay meetings in private conference rooms within the booth to facilitate pre-scheduled one-on-one discussions with global buyers, partners, and investors, aiming to accelerate tangible business partnerships and contracts.
Official CES Programs: Media Briefing & CES Foundry During CES 2026, DEEPX will host an official CTA Media Briefing, where the company will share its business strategy and next-generation AI semiconductor roadmap with global media.
Additionally, DEEPX has been selected as a featured participant in CES Foundry, CTA’s newly launched studio program focused on AI and quantum technologies. The Foundry brings together innovators, investors, and policymakers, with DEEPX joining industry leaders like AMD and NVIDIA in featured sessions.
