[3/25, Keynote] EDGE AI San Diego 2026

edgeAI

What DEEPX Is Doing in Edge AI

CEO

EDGE AI San Diego 2026 is where the global edge AI community meets to learn, build, and connect. Join industry, academia, and innovators March 24–26 in San Diego for real-world insight and hands-on experiences.

 

At DEEPX, we focus on enabling high-performance, energy-efficient AI at the edge through purpose-built AI semiconductor solutions.

We’re proud to be a Leadership Partner at EDGE AI San Diego 2026, where industry, academia, and practitioners come together to focus on real-world edge AI deployment.

 

Event: EDGE AI San Diego 2026
Dates: March 24–26, 2026
Location: Eve, Waterfront, San Diego
Register: https://sandiego2026.edgeaifoundation.org/
Primary Tagline: Connecting AI to the Real World

 

[2/26 Webinar] Avnet Silica <Deploy Edge AI at GPU-level Performance>

avnet thumpnail
Avnet

Transition from power-hungry GPUs to energy-efficient NPUs and discover how DEEPX delivers exceptional performance-per-watt for physical AI

Join Avnet Silica and DEEPX for an exclusive one-hour webinar introducing cutting-edge AI inference acceleration technology, now available in EMEA through Avnet Silica’s new, exclusive partnership with DEEPX. As the demand for edge AI continues to grow, traditional GPU solutions often fall short in power efficiency and thermal constraints. DEEPX addresses this critical gap with purpose-built edge-first AI processors that deliver exceptional performance per watt while maintaining high-precision inference.

In this session, you will discover how DEEPX technology enables efficient on-device AI inference, explore the DX-M1 architecture and its unique advantages, and learn about real-world use cases across various industries. Whether you’re developing smart cameras, robotics, industrial automation, or IoT devices, this webinar will show you how to accelerate your AI applications while maintaining strict power and thermal budgets.

You will also get hands-on insights into the software stack, see a live demonstration, and learn exactly how to get started with DEEPX solutions through Avnet Silica.

Why You Should Attend?

This session is tailored for professionals across the entire product development lifecycle:

  • Business Leaders: Gain a competitive edge with scalable AI
  • Engineers: Master NPU integration and model optimization
  • Procurement: Source cost-effective, high-availability hardware
  • Product Managers: Balance high-end AI features with strict power budgets

Agenda (1-Hour session)

  • Strategic Partnership – Avnet Silica brings DEEPX innovation to Europe
  • Market Trends – Why the industry is moving from GPUs to NPU-driven architectures
  • Technology Overview – Maximising performance per watt while maintaining high-precision inference
  • Products & Use Cases – Real-world applications in Smart Industry, Automation, and Robotics
  • DX-M1 Architecture – Industrial-grade reliability and memory handling
  • Software Stack – Fast-tracking development with the DXNN® SDK
  • How to Start – Demos, hardware availability, and Embedded World 2026
  • Roadmap – What the future will bring
  • Q&A – Direct access to our experts
 
The GPU era is fading. Register now for the DEEPX webinar!
Physical AI powered by NPU is now coming to Europe.
👉 [Register for the webinar now! 🔗]

CES 2026 Foundry: DEEPX Declares the Era of Physical AI with Global Partners

DEEPX, a pioneer in AI semiconductor technology, successfully hosted the “CES 2026 Foundry” session, an
official media event organized by the Consumer Technology Association (CTA). At the event, DEEPX and its global partners unveiled scalable solutions designed to move artificial intelligence beyond data centers and establish a robust infrastructure for “Physical AI.”

 

Themed “The Unstoppable Rise of Physical AI,” the panel brought together industry heavyweights actively deploying mass-production AI. Discussions centered on the practical challenges and critical requirements for operating AI reliably in real-world physical environments.

 

Opening the session, Lokwon Kim, Founder and CEO of DEEPX, emphasized that Physical AI is no longer a futuristic concept but an immediate reality.

“The center of gravity in AI is shifting from the cloud to the physical world,” Kim stated. “To accelerate this transition, we must achieve a seamless integration of hardware and software that can withstand real-world constraints.”

 

The panel featured senior executives from Hyundai Motor Group Robotics Lab, Baidu, Edge AI Foundation, Ultralytics, and Wind River, representing a diverse ecosystem spanning robotics, edge platforms, open-source frameworks, and mission-critical systems. A consensus emerged among the panelists: across robotics, smart factories, and edge IT services, the industry demands reduced reliance on data centers, ultra-low power consumption, thermal efficiency, and stable 24/7 operation.

 

Dongjin Hyun, Executive Director at Hyundai Motor Group Robotics Lab, remarked: “Robotics is becoming core infrastructure for both society and industry. Physical AI enables robots to make autonomous decisions on-device, even in unstable network environments. Through our collaboration with DEEPX, we have validated on-device AI capabilities in real-world conditions and plan to deploy these solutions in
our next-generation robots and security systems starting in 2026.”

 

Addressing the software ecosystem, Raine Hua, Global Ecosystem AI Manager at Baidu, noted: “In the era of Physical AI, success isn’t just about model performance, it’s about consistency. Models must run
reliably anywhere. Our collaboration with DEEPX offers a streamlined path to deploy models at the edge without the need for repeated redesigns.”

 

Pete Bernard, CEO of Edge AI Foundation, highlighted the structural limitations of current architectures:
“Data-center-centric AI faces clear constraints regarding cost, power, and latency. DEEPX is establishing Physical AI as a foundational infrastructure by combining tangible performance with robust ecosystem development.” 
The discussion also tackled barriers to large-scale deployment, such as fragmented toolchains and the re-optimization burden during model porting.

 

Francesco Mattioli, Lead Partner Engineer at Ultralytics, commented: “Developers can build models
quickly, but deployment remains the bottleneck. Our partnership with DEEPX simplifies the journey from training to deployment, delivering real-world performance without requiring developers to become hardware experts.”

 

Sandeep Modhvadia, CPO at Wind River, offered a perspective on mission-critical systems: “For AI to serve as infrastructure in defense, aerospace, and industrial sectors, security, predictability, and long-term stability are non-negotiable. DEEPX’s solutions enable trusted systems that operate reliably in the field.”

 

During the event, DEEPX also introduced its initiative to build an open-source-based Physical AI alliance, stressing that the widespread adoption of Physical AI depends on delivering “plug-and-play” environments through collaborative ecosystems.

 

Through the CES 2026 Foundry, DEEPX cemented its position as a key provider of Physical AI infrastructure, combining ultra-low-power, high-performance silicon with a thriving global partnership network.

CES 2026 Media Briefing: DEEPX Unveils Physical AI Vision & Roadmap

DEEPX, a pioneer in ultra-low-power on-device AI semiconductors, today unveiled its next-generation roadmap at a global media briefing during CES 2026. Headlining the announcement is the DX-M2, the company’s second-generation AI processor designed to run Large Language Models (LLMs) of up to 100 billion parameters at under 5 watts—a breakthrough set to liberate generative AI from the constraints of cloud data centers.

 

DX-M2: Bringing Generative AI to the Edge (Sub-5W) The DX-M2 roadmap targets on-device inference for 20B–100B parameter LLMs, including Mixture-of-Experts (MoE) architectures, within a remarkably low power envelope of sub-5W. This represents a paradigm shift, migrating generative AI workloads from centralized servers to independent edge devices operating in the physical world.

 

Running a 100B parameter LLM under 5 watts isn’t just a performance upgrade—it redefines the fundamental possibilities of AI infrastructure,” said Young Cho, Vice President of DEEPX. “Generative AI will no longer be tethered to the cloud. It will be ubiquitous, embedded directly into the machines that perceive and interact with our world.”

 

This vision positions the DX-M2 as a critical enabler for “Physical AI”—empowering real-world machines to process, interpret, and act autonomously without reliance on network connectivity or energy-intensive server farms.

 

Impact on Infrastructure & Sustainability DEEPX forecasts that distributing inference workloads across billions of edge devices could slash data center traffic by over 80%, offering a viable solution to current energy bottlenecks and escalating operational costs. The DX-M2 leverages architectural insights from the mass production of the first-generation DX-M1, featuring enhanced power management, superior thermal efficiency, and optimized software stacks.

 

Scaling the Ecosystem: 3 Strategic Pillars Building on the commercial success of the DX-M1 platform—now deployed in over 50 projects across robotics, defense, and industrial sectors—DEEPX introduced a three-pillar strategy to accelerate global adoption:

 

1. Open-Source Physical AI Alliance

Partners: Ultralytics, Baidu PaddlePaddle

DEEPX is establishing a developer-centric software ecosystem tailored for real-world deployment. By integrating with leading frameworks like Ultralytics and Baidu PaddlePaddle, DEEPX ensures a seamless workflow from model development to edge deployment, minimizing friction for engineers.

 

2. Global Distribution Network

Partners: Avnet, DigiKey, WPG

To streamline supply chains and improve accessibility, DEEPX has secured partnerships with major global distributors including Avnet, DigiKey, and WPG. Chips, development kits, and reference modules are now readily available, accelerating time-to-market for customers worldwide.

 

3. “AI Player” Dev-Kit

The newly launched AI Player Dev-Kit lowers the barrier to entry for edge AI. Designed to simplify model evaluation, benchmarking, and system validation, this tool shortens the cycle from prototyping to mass production, abstracting hardware complexity for developers and integrators.

 

 

While the DX-M1 proved the viability of large-scale vision AI at the edge, the DX-M2 marks the inflection point for generative AI,” a DEEPX spokesperson noted. “Our mission is to decouple AI from the cost and energy limitations of traditional centralized infrastructure.”

Caption: DEEPX executives pose for a photo following the CES 2026 Media Briefing. (From left) Tim Park (Director of Strategic Marketing), Lokwon Kim (CEO), and Young Cho (CFO)

Caption: DEEPX executives pose for a photo following the CES 2026 Media Briefing. (From left) Tim Park (Director of Strategic Marketing), Lokwon Kim (CEO), and Young Cho (CFO)

DEEPX: CTA’s “What Not To Miss” for 2nd Year at CES 2026

CES

DEEPX, a global leader in ultra-low-power AI semiconductors, has been featured in the Consumer Technology Association’s(CTA) “What Not To Miss” guide for CES 2026, marking its second consecutive year on this prestigious list.

 

In the official CES 2026 guide, DEEPX is highlighted alongside industry titans such as AMD, NVIDIA, Qualcomm, and Samsung Electronics as a key innovator shaping the future of AI. 

Each year, the CTA curates a list of standout technologies and exhibitors that attendees should prioritize. The 2026 edition places special emphasis on practical AI technologies deployed in real-world physical environments—a domain where DEEPX is leading the charge.

 

DEEPX Makes a Bold Statement on the Main Floor. With the opening of CES 2026, DEEPX unveiled an expansive standalone booth (#8745) in the North Hall of the Las Vegas Convention Center (LVCC). 

 

The exhibition goes beyond merely showcasing semiconductor chips; it offers an immersive experience demonstrating how DEEPX’s “Physical AI” technology is live-operating across diverse industrial environments, including robotics, mobility, smart factories, and intelligent infrastructure.

 

Three Key Highlights at CES 2026 

Showcasing Leadership on the Global Main Stage: DEEPX takes center stage in the LVCC North Hall, the hub for the world’s leading tech companies. This move reinforces its transition from a promising startup to a global AI infrastructure provider.

 

Global “Physical AI Alliance” Showcase: The booth features commercially deployable AI solutions developed in collaboration with global partners, including Hyundai Motor Group Robotics Lab, Baidu PaddlePaddle, Ultralytics, Advantech, AAEON, Sixfab, Dell, Supermicro, Ampere, and HP, spanning hardware, software, and system integration.

 

Driving Real Business Results: DEEPX is hosting relay meetings in private conference rooms within the booth to facilitate pre-scheduled one-on-one discussions with global buyers, partners, and investors, aiming to accelerate tangible business partnerships and contracts.

 

Official CES Programs: Media Briefing & CES Foundry During CES 2026, DEEPX will host an official CTA Media Briefing, where the company will share its business strategy and next-generation AI semiconductor roadmap with global media.

 

Additionally, DEEPX has been selected as a featured participant in CES Foundry, CTA’s newly launched studio program focused on AI and quantum technologies. The Foundry brings together innovators, investors, and policymakers, with DEEPX joining industry leaders like AMD and NVIDIA in featured sessions.

DEEPX Unveils Vision as a “Physical AI Infrastructure Company” at CES 2026

(Photo 1) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025
• Ultra-Low-Power AI Semiconductors to Redefine Global AI Infrastructure Landscape

• Next-gen 2nm AI chip DX-M2 and Open-Source Physical AI Alliance to be unveiled

• DEEPX technology drives Sixfab to win CES “Best of Innovation Award”, proving its role as a core AI infrastructure enabler

• Exclusive "CES Foundry" Event on Jan 8 to Feature Global Leaders from Hyundai Motor Group, Baidu, and Ultralytics

DEEPX, a global leader in ultra-low-power, high-performance AI semiconductors, announced today that it will unveil its strategic vision to become a foundational “Physical AI Infrastructure Company” at CES 2026 in Las Vegas.

 

At CES 2026, DEEPX will present a new paradigm for AI infrastructure—one designed for the physical world. As AI expands beyond data centers into robots, mobility, smart cities, factories, and intelligent devices, DEEPX positions itself at the core of this transformation with energy-efficient, real-time AI semiconductors purpose-built for Physical AI.

 

Much like Arm reshaped the CPU industry through low-power innovation, DEEPX aims to establish a new global standard for Physical AI by delivering ultra-efficient AI accelerators. DEEPX enables intelligence to operate reliably and sustainably in real-world environments, addressing the critical constraints of power, heat, and cost.

 

DEEPX’s technology leadership has already been validated in the global market. In addition to winning two CES Innovation Awards in the Computing Hardware and Embedded Technologies categories, DEEPX-powered solutions have achieved the industry’s highest recognition. Notably U.S.-based partner Sixfab received the CES Best of Innovation Award for its ALPON X5 AI Gateway, powered by DEEPX’s first-generation AI chip, DX-M1. This success serves as a testament to DEEPX’s solutions being more than just a component supply; they are recognized as a core engine and a game changer that elevates global partners’ products to a world-class level.

 

DEEPX will host a dedicated booth at the Las Vegas Convention Center (LVCC), North Hall – AI & Robotics Zone (#8945). The exhibit will showcase real-world deployments of AI semiconductors across robotics, drones, factory automation, retail, and intelligent infrastructure, proving that Physical AI has moved beyond concept and into commercial-scale deployment.

At the booth, DEEPX will showcase performance targets for its next-generation DX-M2 AI chip, built on an advanced 2nm process. The DX-M2 is designed as a foundational infrastructure chip for the Physical AI era, solving the fundamental power and scalability limitations of data-center-centric architectures.

Furthermore, DEEPX will launch its Open-Source Physical AI Alliance, formed in collaboration with leading AI software ecosystems including Baidu PaddlePaddle and Ultralytics’ YOLO community. This initiative reflects DEEPX’s strategy to tightly integrate hardware and software, accelerating global adoption of Physical AI through open, developer-friendly platforms.

 

Key CES 2026 Events Hosted by DEEPX

 

1. Media Briefing
January 6, 2026 | LVCC South Connector S231 | 16:15 PM
DEEPX will present its next-generation ultra-low-power AI technologies and global partner expansion strategy, outlining a new industry standard for Physical AI infrastructure.

 

2. CES Foundry: Unstoppable Rise of Physical AI, Intelligented by DEEPX
January 8, 2026 | Fontainebleau Las Vegas, Azure Ballroom (Level 4) | 10:30 AM
An exclusive DEEPX-hosted forum featuring global leaders from Hyundai Motor Group Robotics Lab, Baidu, Wind River, Ultralytics, and the Edge AI Foundation. The session will explore real-world challenges and collaborative pathways for scaling Physical AI across industries.

 

CES 2026 marks a pivotal moment for DEEPX—not just showcasing technology achievements, but demonstrating how Physical AI becomes real infrastructure through global partnerships,” said Lokwon Kim, CEO of DEEPX.

(Photo 1) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025

(Photo 1) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025

(Photo 2) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025

CES 2025