Join DEEPX at CES 2026

Jan 6-9, 2026 l North Hall, LVCC l DEEPX Booth No. #8745
Theme: DEEPX Leads Physical AI as an AI Infrastructure

Presentation Schedule at a Glance

Experience AI beyond the screen. DEEPX is leading the boundaries of On-device AI.
Join us at CES 2026 to see how our NPU solutions solve complex data challenges through Physical AI.

Event 01

CES Media Briefing

  • Date: Tuesday, January 6
  • Time: 16:00 – 17:00 PM
  • Venue: Las Vegas Convention Center (LVCC), South Connector, Room S231–S232
  • Hosts : Lokwon Kim, CEO

Event 02

CES Foundry Session

  • Date: Thursday, January 8
  • Time: 10:30 – 11:00 AM
  • Venue: Breakthrough Stage, Level 4, the Azure Ballroom, Fontainebleau Las Vegas
  • Topic: The Unstoppable Rise of Physical AI, Intelligence by DEEPX
  • Panels
    – DEEPX: Lokwon Kim, CEO
    – Hyundai Motor Group: Dong Jin Hyun, VP
    – Baidu: Raine Hua, Global Ecosystem AI Manager
    – Wind River: Modhvadia Sandeep, CPO
    – Edge AI Foundation: Pete Bernard, CEO
    – Ultralytics: Francesco Mattioli, Lead Partnership Engineering

Virtual Booth Tour

Can’t make it to Las Vegas? Experience our breakthrough innovations and industry-leading AI

solutions through an immersive video series, bringing the DEEPX booth experience directly to you.

Can’t make it to Las Vegas? Experience our breakthrough innovations and industry-leading AI solutions through an immersive video series, bringing the DEEPX booth experience directly to you.

Official Booth Tour Preview

Join DEEPX at our AI chips in largest CES booth ever to see live applications:

  • Single Board Computers, Industrial PCs and AI Gateways
  • Servers & Workstations
  • Drones, and Delivery Robots

Journey to Democratize AI

DEEPX’s vision for accessible and affordable AI for all industries.

DEEPX Starts to Change the World

Real-world Physical AI devices powered by high-performance NPUs.

AI for Everyone & Everywhere

On-device AI transforming industries from smart cities to robotics.

Intuitive Comparisons: Superiority Points

Key technical advantages and performance metrics that set DEEPX apart.

DX-M2: Super-intelligence Under 5 Watts

Complex Generative AI on-device with ultra-low power consumption.

Physical AI as an AI Infrastructure

DEEPX chips as the essential backbone for global Physical AI.

Open Source Physical AI Alliance

Streamlining AI deployment with Ultralytics and Baidu.

DEEPX Product Gallery

High-performance AI semiconductors for every edge computing need.

You Can Buy Now

Market-ready solutions available for immediate purchase and deployment.

Award-Winning Partner Solutions

Partner applications recognized by CES and the World Economic Forum.

Latest News

Stay up to date with our latest announcements, industry insights,
and media coverage as we lead the way in AI semiconductor innovation
(Photo 1) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025
News
03 January, 2026
DEEPX Unveils Vision as a “Physical AI Infrastructure Company” at CES 2026
CES 2026 invitation for Physical AI
Event
19 December, 2025
Dive into Physical AI at CES 2026 — DEEPX Booth #8745
News
12 August, 2025
South Korea’s DEEPX to supply AI chips for Baidu’s drones and robots
(Photo 1) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025
News
03 January, 2026
DEEPX Unveils Vision as a “Physical AI Infrastructure Company” at CES 2026
CES 2026 invitation for Physical AI
Event
19 December, 2025
Dive into Physical AI at CES 2026 — DEEPX Booth #8745
News
12 August, 2025
South Korea’s DEEPX to supply AI chips for Baidu’s drones and robots

Explore DEEPX’s Award-Winning Tech at CES

CES Innovation Awards 2026, Double Honoree