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On April 6th, Yoon Ilyong, the Executive Director of POSCO DX Technology Research Institute, participated in a commemorative photo session after signing a business agreement with Kim Lokwon, the CEO of DeepX, for the commercialization of AI solution technology using AI semiconductors in various industrial fields such as manufacturing, robotics, logistics, and safety. The event took place at the POSCO DX Pangyo Office in Bundang-gu, Seongnam, Gyeonggi Province.
On April 6th, DEEPX announced that it has signed a business agreement with POSCO DX, a subsidiary of POSCO, to develop factory automation solutions using artificial intelligence (AI) semiconductors.
The two companies plan to jointly develop AI solutions that automate industrial site operations by integrating DEEPX's AI semiconductor technology into POSCO DX's factory automation and intelligent logistics equipment control system called "PosMaster." The goal is to validate the AI capabilities embedded in DEEPX's AI system-on-chip (SoC) for use in smart factories and to expand the scope of application after verifying its performance and mass production potential.
During the preliminary technical verification process with POSCO DX, DeepX distributed a software development kit (SDK) called "DXNN", which includes the DEEPX compiler, and received recognition for the operability of its hardware and software. It has been evaluated as a suitable solution for automation in industrial sites due to its high AI computational performance efficiency compared to power consumption.
Established in 2018, DEEPX has obtained more than 150 domestic and international patents related to AI semiconductor core technologies. It is known for having top-level technology in neural network processing units (NPUs) optimized for AI model inference. It also possesses four types of AI semiconductors optimized for various edge and server AI applications.
Kim Lokwon, CEO of DEEPX, stated, "Through collaboration, we will build a crucial foundation for leading the future smart factory market by automating the processing of 20,000 camera data simultaneously from POSCO Steelworks."
Yoon Ilyong, Executive Director of POSCO DX's Technology Research Institute, commented, "The integration of POSCO DX's AI software (SW) and control fusion technology with AI semiconductors optimized for deep learning presents a significant collaborative opportunity to build an integrated automation and unmanned system. It is expected to contribute to ESG (Environmental, Social, and Governance) management by reducing power consumption."
DEEPX - POSCO DX to collaborate on developing AI semiconductor-based factory automation solutions
Press release
Date
2023.08.22
Author
by deepx
Views
1932
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DEEPX's AI semiconductor technology into POSCO DX's factory automation and intelligent logistics equipment control system
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During the preliminary technical verification process DEEPX distributed a software development kit (SDK) called "DXNN", which includes the DEEPX compiler, and received recognition for the superior accuracy and performance
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Through collaboration, DEEPX will build a crucial foundation for leading the future smart factory market by automating the processing of ten thousands of camera data simultaneously
On April 6th, Yoon Ilyong, the Executive Director of POSCO DX Technology Research Institute, participated in a commemorative photo session after signing a business agreement with Kim Lokwon, the CEO of DeepX, for the commercialization of AI solution technology using AI semiconductors in various industrial fields such as manufacturing, robotics, logistics, and safety. The event took place at the POSCO DX Pangyo Office in Bundang-gu, Seongnam, Gyeonggi Province.On April 6th, DEEPX announced that it has signed a business agreement with POSCO DX, a subsidiary of POSCO, to develop factory automation solutions using artificial intelligence (AI) semiconductors.
The two companies plan to jointly develop AI solutions that automate industrial site operations by integrating DEEPX's AI semiconductor technology into POSCO DX's factory automation and intelligent logistics equipment control system called "PosMaster." The goal is to validate the AI capabilities embedded in DEEPX's AI system-on-chip (SoC) for use in smart factories and to expand the scope of application after verifying its performance and mass production potential.
During the preliminary technical verification process with POSCO DX, DeepX distributed a software development kit (SDK) called "DXNN", which includes the DEEPX compiler, and received recognition for the operability of its hardware and software. It has been evaluated as a suitable solution for automation in industrial sites due to its high AI computational performance efficiency compared to power consumption.
Established in 2018, DEEPX has obtained more than 150 domestic and international patents related to AI semiconductor core technologies. It is known for having top-level technology in neural network processing units (NPUs) optimized for AI model inference. It also possesses four types of AI semiconductors optimized for various edge and server AI applications.
Kim Lokwon, CEO of DEEPX, stated, "Through collaboration, we will build a crucial foundation for leading the future smart factory market by automating the processing of 20,000 camera data simultaneously from POSCO Steelworks."
Yoon Ilyong, Executive Director of POSCO DX's Technology Research Institute, commented, "The integration of POSCO DX's AI software (SW) and control fusion technology with AI semiconductors optimized for deep learning presents a significant collaborative opportunity to build an integrated automation and unmanned system. It is expected to contribute to ESG (Environmental, Social, and Governance) management by reducing power consumption."
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