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On the 24th (Friday) at the Uiwang Research Facility of Hyundai Motors & Kia Corporation, DEEPX announced its conclusion of an MOU on AI semiconductor load for robot platforms, with the representatives of both companies including Kim, Lokwon, CEO, and Hyun, Dong-jin, Robotics lab leader of Hyundai Motors & Kia Corporation present.
DEEPX will cooperate technology development with Hyundai Motor Company and Kia Corporation for on-device AI technology for robot platforms.
On the 24th (Friday) at the Uiwang Research Facility of Hyundai Motors & Kia Corporation, DEEPX announced its conclusion of an MOU on AI semiconductor load for robot platforms, with the representatives of both companies including Kim, Nok-won, CEO, and Hyun, Dong-jin, Robotics lab leader of Hyundai Motors & Kia Corporation present.
DEEPX develops AI semiconductor for on-device AI computing, and implements AI technology to various electronic devices that exists outside of the data center at high-performance and low-power. Currently they possess 4 kinds of AI semiconductors that are optimized for performance and function that can match with various edge and server AI application fields, and have secured more than 150 patents, both domestic and international, that are related to AI semiconductor source technology. Domestically, they are evaluated as the leading AI semiconductor fabless company, and are targeting the global edge AI market.
For the past year, DEEPX has proceeded with advance technology examination with the robotics lab of Hyundai Motors and Kia Corporation, and the AI accuracy provided by them was in no way inferior to the robotics lab's existing GPGPU, proving the excellency of their AI technology. It managed to operate various robot application AI algorithms self-developed by robotics lab flawless, thus proved they could implement an AI model needed by robots. They have been evaluated as suitable to mass-produce battery-powered robot products with their extraordinarily high AI computing performance efficiency.
The purpose of this agreement is for the agreement of technology to apply DEEPX's AI semiconductor technology to the robot platform which is under development by Hyundai Motors and Kia Corporation for commercialization. Both parties will examine the operation ability and mass-productivity by loading the AI function that will be used for robots on the DEEPX's AI SoC (System on Chip) product, and to mount on the mass produced product, and ultimately implement the said AI technology on the robot that will be developed by the robotics lab.
Kim, Lokwon, CEO commented: “According to the global market research agency, the size of the global smart mobility is expected to grow to be 144.54 billion dollars by the year 2027. For the AI semiconductor, the core technology of this market, currently there are no optimized solutions for each detailed fields, therefore it is possible to lead the market if a mass-producible solution is prepared. To have a technology cooperation with Hyundai Motors and Kia Corporation, who are expected to lead the global market, will present DEEPX's AI semiconductor an opportunity to become the core solution of the future market in the related field, which is a great inspiration for us. DEEPX has succeeded in commercializing NPU IP in 2021, and I am grateful to earn the chance for demonstration test for mass-production as soon as we developed NPU chip this year.”
Hyun, Dong-jin, Robotics lab leader of Hyundai Motors & Kia Corporation said, “I expect we could lead the excellent robotics service development both performance- and price-wise by combining the SW technology of robotics lab and DEEPX's HW technology.” He went on, “As soon as we confirm and examine the superiority of DEEPX NPU that have been produced as chip, we will carry on with further cooperation and apply it to the robot that is under research and development.”
DEEPX and Hyundai Motor Company and Kia Corporation are collaborating on AI semiconductor-based Robot Platforms
Press release
Date
2023.08.10
Author
by deepx
Views
1694
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Both companies will strategically cooperate in embedding AI chips into robot platforms
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For the past year in the process of examining in advance, various AI algorithms for robots were operated to check for the latest AI algorithm support, excellent AI accuracy, and high computing efficiency of the DEEPX NPU
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"This will be an opportunity for DEEPX's AI semiconductor to become the mass-production ready core solution in the global smart mobility market"
On the 24th (Friday) at the Uiwang Research Facility of Hyundai Motors & Kia Corporation, DEEPX announced its conclusion of an MOU on AI semiconductor load for robot platforms, with the representatives of both companies including Kim, Lokwon, CEO, and Hyun, Dong-jin, Robotics lab leader of Hyundai Motors & Kia Corporation present.DEEPX will cooperate technology development with Hyundai Motor Company and Kia Corporation for on-device AI technology for robot platforms.
On the 24th (Friday) at the Uiwang Research Facility of Hyundai Motors & Kia Corporation, DEEPX announced its conclusion of an MOU on AI semiconductor load for robot platforms, with the representatives of both companies including Kim, Nok-won, CEO, and Hyun, Dong-jin, Robotics lab leader of Hyundai Motors & Kia Corporation present.
DEEPX develops AI semiconductor for on-device AI computing, and implements AI technology to various electronic devices that exists outside of the data center at high-performance and low-power. Currently they possess 4 kinds of AI semiconductors that are optimized for performance and function that can match with various edge and server AI application fields, and have secured more than 150 patents, both domestic and international, that are related to AI semiconductor source technology. Domestically, they are evaluated as the leading AI semiconductor fabless company, and are targeting the global edge AI market.
For the past year, DEEPX has proceeded with advance technology examination with the robotics lab of Hyundai Motors and Kia Corporation, and the AI accuracy provided by them was in no way inferior to the robotics lab's existing GPGPU, proving the excellency of their AI technology. It managed to operate various robot application AI algorithms self-developed by robotics lab flawless, thus proved they could implement an AI model needed by robots. They have been evaluated as suitable to mass-produce battery-powered robot products with their extraordinarily high AI computing performance efficiency.
The purpose of this agreement is for the agreement of technology to apply DEEPX's AI semiconductor technology to the robot platform which is under development by Hyundai Motors and Kia Corporation for commercialization. Both parties will examine the operation ability and mass-productivity by loading the AI function that will be used for robots on the DEEPX's AI SoC (System on Chip) product, and to mount on the mass produced product, and ultimately implement the said AI technology on the robot that will be developed by the robotics lab.
Kim, Lokwon, CEO commented: “According to the global market research agency, the size of the global smart mobility is expected to grow to be 144.54 billion dollars by the year 2027. For the AI semiconductor, the core technology of this market, currently there are no optimized solutions for each detailed fields, therefore it is possible to lead the market if a mass-producible solution is prepared. To have a technology cooperation with Hyundai Motors and Kia Corporation, who are expected to lead the global market, will present DEEPX's AI semiconductor an opportunity to become the core solution of the future market in the related field, which is a great inspiration for us. DEEPX has succeeded in commercializing NPU IP in 2021, and I am grateful to earn the chance for demonstration test for mass-production as soon as we developed NPU chip this year.”
Hyun, Dong-jin, Robotics lab leader of Hyundai Motors & Kia Corporation said, “I expect we could lead the excellent robotics service development both performance- and price-wise by combining the SW technology of robotics lab and DEEPX's HW technology.” He went on, “As soon as we confirm and examine the superiority of DEEPX NPU that have been produced as chip, we will carry on with further cooperation and apply it to the robot that is under research and development.”
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